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MSP430F47177IPZ

Texas Instruments

MSP430F47177IPZ by Texas Instruments

MSP430F47177IPZ by Texas Instruments is a 16-bit microcontroller with 8KB RAM, 7 ADC channels, and 3 DMA channels. Ideal for industrial applications, it operates at up to 16MHz with low power mode support. Features include 2/3.3V power supplies, I2C/SPI/UART connectivity, and FLASH ROM programmability.

Median Price

$16.822

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 141,425 parts In-Stock

1+ parts

$13.434

100+ parts

$11.735

1k+ parts

$8.093

10k+ parts

-

141,425

$13.434

$11.735

$8.093

-

Mouser Electronics

USA . 285 parts In-Stock

1+ parts

$20.210

100+ parts

$12.230

1k+ parts

$12.070

10k+ parts

-

285

$20.210

$12.230

$12.070

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,738 parts In-Stock

1+ parts

$12.762

100+ parts

-

1k+ parts

-

10k+ parts

-

3,738

$12.762

-

-

-

Vyrian

USA . 7,641 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,641

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,589 parts In-Stock

1+ parts

$12.091

100+ parts

-

1k+ parts

-

10k+ parts

-

4,589

$12.091

-

-

-

Parana Technologies

USA . 343 parts In-Stock

1+ parts

$24.524

100+ parts

-

1k+ parts

$25.189

10k+ parts

-

343

$24.524

-

$25.189

-

DigiPath Technology Company

USA . 1,477 parts In-Stock

1+ parts

$27.004

100+ parts

-

1k+ parts

-

10k+ parts

-

1,477

$27.004

-

-

-

IDEA Electronic Components Group

UK . 1,287 parts In-Stock

1+ parts

$27.555

100+ parts

$26.177

1k+ parts

$24.800

10k+ parts

-

1,287

$27.555

$26.177

$24.800

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ChromeModa Solutions

Germany . 255 parts In-Stock

1+ parts

$27.555

100+ parts

$22.595

1k+ parts

-

10k+ parts

-

255

$27.555

$22.595

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-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,500

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-

-

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Perfect Parts

USA . 101 parts In-Stock

1+ parts

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100+ parts

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101

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Overview

Unlock unparalleled performance and efficiency with the MSP430F47177IPZ by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers top-notch quality and reliability. Ideal for a wide range of applications, this microcontroller offers exceptional value with its low power consumption, high-speed operation, and versatile peripherals. Experience seamless connectivity and robust functionality with the MSP430F47177IPZ, setting new standards in embedded systems design. Elevate your projects to new heights with this cutting-edge microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring longevity and reliability in various operating conditions.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power input options, supporting a wide range of applications.

Bit Size: 16

High bit size allows for processing data and instructions in larger chunks, improving overall efficiency and performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Using a RISC architecture enhances speed and efficiency in processing instructions, making it a suitable choice for applications requiring quick response times.

Maximum Clock Frequency: 16 MHz

High clock frequency ensures fast execution of instructions and operations, making the microcontroller suitable for applications with high processing demands.

Analog To Digital Convertors: 7-Ch 12-Bit

Multiple ADC channels with high resolution allow for precise analog-to-digital conversions, making it ideal for applications requiring accurate sensor readings or data acquisition.

Technical Specifications

Microcontrollers MSP430F47177IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 4.15MHZ AT MINI 1.8V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

68

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), LIN(2), SCI(4), SPI(4), UART(2)"

Peripherals:

"BOD, COMPARATOR(2), DMA(3), RTC, TIMER(7), WDT"

Analog To Digital Convertors:

7-Ch 12-Bit

Trade Compliance

MSP430F47177IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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