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MSP430F47176IPZ

Texas Instruments

MSP430F47176IPZ by Texas Instruments

MSP430F47176IPZ by Texas Instruments is a 16-bit microcontroller with 8KB RAM, 94.2KB ROM, and 6-Ch 12-Bit ADC channels. Ideal for industrial applications due to its low power mode, operating temperature range of -40 to 85°C, and connectivity options like I2C, SPI, UART.

Median Price

$11.451

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,510 parts In-Stock

1+ parts

$11.451

100+ parts

$10.002

1k+ parts

$6.898

10k+ parts

-

9,510

$11.451

$10.002

$6.898

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,867 parts In-Stock

1+ parts

$10.878

100+ parts

-

1k+ parts

-

10k+ parts

-

2,867

$10.878

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-

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Vyrian

USA . 5,125 parts In-Stock

1+ parts

-

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-

1k+ parts

-

10k+ parts

-

5,125

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,246 parts In-Stock

1+ parts

$9.730

100+ parts

-

1k+ parts

-

10k+ parts

-

9,246

$9.730

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-

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Corphita

USA . 4,996 parts In-Stock

1+ parts

$10.306

100+ parts

-

1k+ parts

-

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4,996

$10.306

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AZTECH Wire

Italy . 985 parts In-Stock

1+ parts

$15.670

100+ parts

-

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-

10k+ parts

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985

$15.670

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-

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Microchip USA

USA . 1,449 parts In-Stock

1+ parts

$31.800

100+ parts

$31.340

1k+ parts

$31.120

10k+ parts

$30.890

1,449

$31.800

$31.340

$31.120

$30.890

Parana Technologies

USA . 1,038 parts In-Stock

1+ parts

$62.322

100+ parts

-

1k+ parts

-

10k+ parts

-

1,038

$62.322

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ChromeModa Solutions

Germany . 2,001 parts In-Stock

1+ parts

$70.025

100+ parts

$57.420

1k+ parts

-

10k+ parts

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2,001

$70.025

$57.420

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IDEA Electronic Components Group

UK . 1,001 parts In-Stock

1+ parts

$70.025

100+ parts

$66.524

1k+ parts

$63.022

10k+ parts

-

1,001

$70.025

$66.524

$63.022

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Lixinc

USA . 2,720 parts In-Stock

1+ parts

-

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2,720

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DigiPath Technology Company

USA . 2,038 parts In-Stock

1+ parts

-

100+ parts

$63.135

1k+ parts

-

10k+ parts

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2,038

-

$63.135

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F47176IPZ microcontroller, designed to bring cutting-edge technology to your projects. With a reputation for excellence, Texas Instruments delivers quality and reliability in every product they create. This versatile microcontroller is perfect for a wide range of applications, offering customers value, efficiency, and performance that sets them apart from the competition. Experience seamless connectivity, low power consumption, and robust functionality with the MSP430F47176IPZ - the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for various applications while keeping manufacturing costs low.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in different power supply scenarios.

No. of Terminals: 100

High number of terminals allow for versatile connectivity options, enabling complex system integration.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast processing speeds, making the device suitable for demanding real-time applications.

ADC Channels: YES

Built-in Analog to Digital Converters enable the device to interface with analog sensors and signals without additional components.

Technical Specifications

Microcontrollers MSP430F47176IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 4.15MHZ AT MINI 1.8V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

68

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), LIN(2), SCI(4), SPI(4), UART(2)"

Peripherals:

"BOD, COMPARATOR(2), DMA(3), RTC, TIMER(7), WDT"

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

MSP430F47176IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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