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MSP430F47163IPZ

Texas Instruments

MSP430F47163IPZ by Texas Instruments

MSP430F47163IPZ by Texas Instruments is a 16-bit microcontroller with 3.6V max supply voltage, 85°C max operating temp, and 16MHz clock frequency. Ideal for industrial applications requiring low power consumption, it features 72 I/O lines, 3 ADC channels, and 3 DMA channels for efficient data processing.

Median Price

$9.740

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,431 parts In-Stock

1+ parts

$10.519

100+ parts

$8.576

1k+ parts

$5.717

10k+ parts

-

1,431

$10.519

$8.576

$5.717

-

Mouser Electronics

USA . 95 parts In-Stock

1+ parts

$15.180

100+ parts

$8.860

1k+ parts

$8.160

10k+ parts

-

95

$15.180

$8.860

$8.160

-

Rochester

USA . 80 parts In-Stock

1+ parts

-

100+ parts

$7.400

1k+ parts

$6.620

10k+ parts

$6.230

80

-

$7.400

$6.620

$6.230

DigiKey

USA . 80 parts In-Stock

1+ parts

-

100+ parts

$9.740

1k+ parts

-

10k+ parts

-

80

-

$9.740

-

-

Verical

USA . 80 parts In-Stock

1+ parts

-

100+ parts

$9.250

1k+ parts

$8.275

10k+ parts

$7.787

80

-

$9.250

$8.275

$7.787

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 409 parts In-Stock

1+ parts

$7.543

100+ parts

-

1k+ parts

-

10k+ parts

-

409

$7.543

-

-

-

Vyrian

USA . 8,853 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,853

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,158 parts In-Stock

1+ parts

$7.146

100+ parts

-

1k+ parts

-

10k+ parts

-

2,158

$7.146

-

-

-

Microchip USA

USA . 2,367 parts In-Stock

1+ parts

$23.130

100+ parts

$22.800

1k+ parts

$22.630

10k+ parts

$22.470

2,367

$23.130

$22.800

$22.630

$22.470

Parana Technologies

USA . 1,965 parts In-Stock

1+ parts

$35.695

100+ parts

-

1k+ parts

-

10k+ parts

-

1,965

$35.695

-

-

-

IDEA Electronic Components Group

UK . 2,165 parts In-Stock

1+ parts

$40.107

100+ parts

$38.102

1k+ parts

$36.096

10k+ parts

-

2,165

$40.107

$38.102

$36.096

-

ChromeModa Solutions

Germany . 690 parts In-Stock

1+ parts

$40.107

100+ parts

$32.888

1k+ parts

-

10k+ parts

-

690

$40.107

$32.888

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

DigiPath Technology Company

USA . 49 parts In-Stock

1+ parts

-

100+ parts

$36.160

1k+ parts

-

10k+ parts

-

49

-

$36.160

-

-

Overview

Discover the cutting-edge MSP430F47163IPZ microcontroller by Texas Instruments, a top-tier manufacturer known for delivering superior quality products. Ideal for a wide range of applications, this microcontroller offers unmatched value with its high performance and low power consumption. With features like multiple ADC channels, DMA channels, and an array of peripherals, this product provides customers with endless possibilities for creating innovative solutions. Experience the reliability and efficiency of Texas Instruments technology with the MSP430F47163IPZ microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring reliable performance.

Maximum Supply Voltage: 3.6 V

Support for higher voltage applications, providing versatility.

Maximum Operating Temperature: 85 °C

Ability to operate in high-temperature environments, suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency.

No. of I/O Lines: 72

Plenty of I/O options for connecting external devices and peripherals, increasing flexibility.

Technical Specifications

Microcontrollers MSP430F47163IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 4.15MHZ AT MINI 1.8V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

72

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), LIN(2), SCI(4), SPI(4), UART(2)"

Peripherals:

"BOD, COMPARATOR(2), DMA(3), RTC, TIMER(7), WDT"

Analog To Digital Convertors:

3-Ch 12-Bit

Trade Compliance

MSP430F47163IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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