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MSP430F4619IPZ

Texas Instruments

MSP430F4619IPZ by Texas Instruments

MSP430F4619IPZ by Texas Instruments is a 16-bit microcontroller with 122880 ROM words and 4 RAM words. It operates at a max clock frequency of 8 MHz, suitable for industrial applications requiring low power consumption. Features include 16-Ch 12-Bit ADC channels, connectivity options like I2C and SPI, and multiple timers for precise timing functions.

Median Price

$13.721

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,840 parts In-Stock

1+ parts

$11.892

100+ parts

$10.388

1k+ parts

$7.164

10k+ parts

-

1,840

$11.892

$10.388

$7.164

-

DigiKey

USA . 45 parts In-Stock

1+ parts

$15.550

100+ parts

$11.529

1k+ parts

-

10k+ parts

-

45

$15.550

$11.529

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,067 parts In-Stock

1+ parts

$11.297

100+ parts

-

1k+ parts

-

10k+ parts

-

1,067

$11.297

-

-

-

Vyrian

USA . 6,212 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,212

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,690 parts In-Stock

1+ parts

$10.703

100+ parts

-

1k+ parts

-

10k+ parts

-

4,690

$10.703

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$40.828

100+ parts

$37.153

1k+ parts

$33.479

10k+ parts

-

2,500

$40.828

$37.153

$33.479

-

Microchip USA

USA . 2,256 parts In-Stock

1+ parts

$42.530

100+ parts

$41.920

1k+ parts

$41.620

10k+ parts

$41.320

2,256

$42.530

$41.920

$41.620

$41.320

Parana Technologies

USA . 1,768 parts In-Stock

1+ parts

$51.779

100+ parts

-

1k+ parts

-

10k+ parts

-

1,768

$51.779

-

-

-

DigiPath Technology Company

USA . 1,177 parts In-Stock

1+ parts

$57.015

100+ parts

-

1k+ parts

-

10k+ parts

-

1,177

$57.015

-

-

-

ChromeModa Solutions

Germany . 4,488 parts In-Stock

1+ parts

$58.179

100+ parts

$47.707

1k+ parts

-

10k+ parts

-

4,488

$58.179

$47.707

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-

IDEA Electronic Components Group

UK . 15 parts In-Stock

1+ parts

$58.179

100+ parts

$55.270

1k+ parts

$52.361

10k+ parts

-

15

$58.179

$55.270

$52.361

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Perfect Parts

USA . 184 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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184

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Overview

The Texas Instruments MSP430F4619IPZ microcontroller is a game-changer in the industry, offering unparalleled quality and reliability. As a leader in microcontroller technology, Texas Instruments brings you a product that exceeds expectations in various applications. With features like low power mode, multiple ADC channels, and extensive connectivity options, this microcontroller caters to all your needs. Whether you're working on IoT devices or industrial automation, the MSP430F4619IPZ delivers unmatched performance and value. Trust Texas Instruments for cutting-edge technology that empowers your projects to reach new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and cost-effective, making the product suitable for portable and budget-friendly applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, the product is able to handle higher voltage applications efficiently.

Power Supplies (V): 2/3.3

Having multiple power supply options (2V and 3.3V) provides flexibility in powering the system according to requirements.

ADC Channels: YES

The presence of Analog to Digital Converters allows the product to interface with analog sensors and signals, expanding its functionality.

Maximum Clock Frequency: 8 MHz

The high maximum clock frequency of 8 MHz enables fast processing and response times in applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller makes the product more efficient in executing instructions and performing tasks quickly.

Connectivity: I2C, IRDA, SCI(2), SPI(3), UART(3)

Support for multiple communication interfaces enables seamless connectivity with various devices and peripherals.

Low Power Mode: YES

The low power mode feature allows the product to conserve energy, making it suitable for battery-operated or energy-efficient applications.

Technical Specifications

Microcontrollers MSP430F4619IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 3MHZ AT MINI 1.8V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

80

No. of Serial I/Os:

0

No. of Terminals:

100

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

122880

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.74 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(3), UART(3)"

Peripherals:

"BOD, COMPARATOR, DMA(3), LCD, TIMER(11), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F4619IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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