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MSP430F4616IPZR

Texas Instruments

MSP430F4616IPZR by Texas Instruments

MSP430F4616IPZR by Texas Instruments is a 16-bit microcontroller with 8KB RAM, 94KB ROM, and 16 ADC channels. Ideal for industrial applications due to its low power consumption (0.74mA) and wide temperature range (-40 to 85°C). Features include 11 timers, DMA support, and various connectivity options like I2C and SPI.

Median Price

$8.426

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 50,710 parts In-Stock

1+ parts

$8.426

100+ parts

$7.360

1k+ parts

$5.076

10k+ parts

-

50,710

$8.426

$7.360

$5.076

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$7.050

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100

$7.050

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Digiode

USA . 832 parts In-Stock

1+ parts

$8.005

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832

$8.005

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Vyrian

USA . 6,964 parts In-Stock

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Chip Stock

USA . 2,526 parts In-Stock

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2,526

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Distributors (Availability)

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Continental Prestige Electronics

USA . 2,336 parts In-Stock

1+ parts

$7.050

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-

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$6.909

2,336

$7.050

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-

$6.909

Netroflash

USA . 500 parts In-Stock

1+ parts

$7.050

100+ parts

$6.909

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500

$7.050

$6.909

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Ampacity Inc.

Singapore . 50,677 parts In-Stock

1+ parts

$7.160

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50,677

$7.160

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Corphita

USA . 82 parts In-Stock

1+ parts

$7.583

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82

$7.583

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AZTECH Wire

Italy . 315 parts In-Stock

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$20.220

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315

$20.220

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Microchip USA

USA . 6,363 parts In-Stock

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$22.109

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$22.109

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Parana Technologies

USA . 1,418 parts In-Stock

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$50.412

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1,418

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DigiPath Technology Company

USA . 518 parts In-Stock

1+ parts

$55.510

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$51.069

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518

$55.510

$51.069

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ChromeModa Solutions

Germany . 2,493 parts In-Stock

1+ parts

$56.643

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$46.447

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2,493

$56.643

$46.447

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IDEA Electronic Components Group

UK . 551 parts In-Stock

1+ parts

$56.643

100+ parts

$53.811

1k+ parts

$50.979

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551

$56.643

$53.811

$50.979

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Perfect Parts

USA . 5,277 parts In-Stock

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Argo Parts USA

USA . 3,903 parts In-Stock

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Futuretech Components

Singapore . 830 parts In-Stock

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Infinite Electronics LLP (Excess)

. 108 parts In-Stock

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108

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Overview

Discover the innovative MSP430F4616IPZR microcontroller by Texas Instruments, a game-changer in the world of technology. With a focus on quality and reliability, this product offers unparalleled value with its wide range of applications in various industries. From low power mode to its advanced peripherals like BOD and DMA, this microcontroller delivers exceptional performance and efficiency. Upgrade your projects with the MSP430F4616IPZR and experience the difference that Texas Instruments brings to the table. Unlock endless possibilities with this cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power input, accommodating a range of voltage sources.

CPU Family: MSP430

Belonging to the MSP430 family ensures reliability and compatibility with other MSP430 devices.

RAM Words: 4

Provides sufficient memory for storing data and variables during program execution.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller allows for efficient and fast processing of instructions, enhancing overall performance.

Analog To Digital Convertors: 16-Ch 12-Bit

Having multiple ADC channels with high bit resolution enables accurate conversion of analog signals to digital data, crucial for sensor interfacing.

Connectivity: I2C, IRDA, SCI(2), SPI(3), UART(3)

Support for various communication protocols facilitates easy integration and communication with other devices.

No. of I/O Lines: 80

Having a high number of I/O lines allows for versatile input and output options, enabling complex interactions with external components.

Technical Specifications

Microcontrollers MSP430F4616IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 3MHZ AT MINI 1.8V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

80

No. of Serial I/Os:

0

No. of Terminals:

100

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.74 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(3), UART(3)"

Peripherals:

"BOD, COMPARATOR, DMA(3), LCD, TIMER(11), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F4616IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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