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MSP430F439IPN

Texas Instruments

MSP430F439IPN by Texas Instruments

MSP430F439IPN by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at a max frequency of 0.032 MHz. It features 12 ADC channels, DMA support, and 7 timers for applications requiring low power consumption in industrial settings.

Median Price

$9.872

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,046 parts In-Stock

1+ parts

$9.872

100+ parts

$8.623

1k+ parts

$5.947

10k+ parts

-

1,046

$9.872

$8.623

$5.947

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,350 parts In-Stock

1+ parts

$9.378

100+ parts

-

1k+ parts

-

10k+ parts

-

2,350

$9.378

-

-

-

Vyrian

USA . 9,629 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,629

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,393 parts In-Stock

1+ parts

$8.885

100+ parts

-

1k+ parts

-

10k+ parts

-

1,393

$8.885

-

-

-

AZTECH Wire

Italy . 255 parts In-Stock

1+ parts

$18.310

100+ parts

-

1k+ parts

-

10k+ parts

-

255

$18.310

-

-

-

Microchip USA

USA . 1,823 parts In-Stock

1+ parts

$27.410

100+ parts

$27.020

1k+ parts

$26.830

10k+ parts

$26.630

1,823

$27.410

$27.020

$26.830

$26.630

Parana Technologies

USA . 700 parts In-Stock

1+ parts

$71.577

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$71.577

-

-

-

ChromeModa Solutions

Germany . 5,858 parts In-Stock

1+ parts

$80.424

100+ parts

$65.948

1k+ parts

-

10k+ parts

-

5,858

$80.424

$65.948

-

-

IDEA Electronic Components Group

UK . 1,859 parts In-Stock

1+ parts

$80.424

100+ parts

$76.403

1k+ parts

$72.382

10k+ parts

-

1,859

$80.424

$76.403

$72.382

-

DigiPath Technology Company

USA . 737 parts In-Stock

1+ parts

-

100+ parts

$72.510

1k+ parts

-

10k+ parts

-

737

-

$72.510

-

-

Overview

Unleash the power of innovation with the Texas Instruments MSP430F439IPN microcontroller. Designed for maximum performance and reliability, this versatile device offers a wide range of applications in various industries. With advanced features like low power mode, PWM channels, and connectivity options including SPI and UART, this product provides unparalleled value to customers seeking cutting-edge solutions. Trust in Texas Instruments' reputation for excellence and experience the benefits of superior quality and functionality with the MSP430F439IPN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient integration into circuit boards.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

On Chip Data RAM Width: 8

Provides sufficient memory capacity for data processing.

Package Shape: SQUARE

Saves space and allows for compact design layouts.

Bit Size: 16

Enables efficient data processing and calculations.

Power Supplies (V): 2/3.3

Compatible with commonly used power supply voltages.

No. of Terminals: 80

Provides ample connectivity options for peripherals.

Package Style (Meter): FLATPACK

Facilitates easy installation and maintenance of the microcontroller.

Minimum Supply Voltage: 1.8 V

Allows for low power operation and energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

CPU Family: MSP430

Utilizes a reliable and proven processor architecture for efficient operation.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures stable electrical connections.

ADC Channels: YES

Allows for analog to digital conversion for sensor interfacing and data acquisition.

DMA Channels: YES

Enables efficient data transfer between peripherals and memory without CPU intervention.

Terminal Position: QUAD

Ensures secure and reliable connections with other components on the circuit board.

ROM Words: 61440

Sufficient non-volatile memory for program storage and data retention.

Maximum Seated Height: 1.6 mm

Allows for slim and compact designs in space-constrained applications.

RAM Words: 2

Provides temporary storage for data manipulation and processing.

Width: 12 mm

Compact form factor for easy integration into electronic devices.

Boundary Scan: YES

Facilitates testing and debugging of the microcontroller during production.

Peripherals: BOR, COMPARATOR, DMA, LCD, TIMER(7), WDT

Offers a wide range of integrated peripherals for diverse application requirements.

Maximum Clock Frequency: 0.032 MHz

Provides efficient clock speed for data processing and communication tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering process during manufacturing.

Peak Reflow Temperature °C: 260

Suitable for high-temperature soldering processes for robust connections.

Length: 12 mm

Compact size for space-efficient designs.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for high performance and efficiency.

No. of Timers: 7

Enables precise timing control and synchronization in applications.

RAM Bytes: 2048

Sufficient memory for temporary storage and data manipulation.

Technology: CMOS

Provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates easy soldering and robust mechanical connections.

Analog To Digital Convertors: 12-Ch 12-Bit

Supports multiple analog inputs with high precision conversion.

Maximum Supply Current: 0.57 mA

Low power consumption for energy-efficient operation.

Nominal Supply Voltage: 2.2 V

Optimal voltage level for stable and reliable performance.

PWM Channels: YES

Allows for precise control of pulse width modulation signals.

Connectivity: SPI, UART, USART

Supports versatile communication protocols for connectivity with external devices.

ROM Programmability: FLASH

Offers flexibility for reprogramming and updating firmware.

Terminal Pitch: 0.5 mm

Compact spacing for high-density PCB layouts.

Format: FIXED POINT

Provides accurate and efficient numeric representation for calculations.

Moisture Sensitivity Level (MSL): 3

Suitable for standard moisture exposure levels during handling and storage.

Speed: 8 rpm

Offers moderate processing speed for general-purpose applications.

Low Power Mode: YES

Enables power-saving operation modes for energy efficiency.

On Chip Program ROM Width: 8

Sufficient memory capacity for storing program instructions.

No. of I/O Lines: 48

Provides ample input/output options for interfacing with external devices and sensors.

Technical Specifications

Microcontrollers MSP430F439IPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

1

No. of Terminals:

80

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.57 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART, USART

Peripherals:

BOR, COMPARATOR, DMA, LCD, TIMER(7), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430F439IPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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