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MSP430F4371IPZR

Texas Instruments

MSP430F4371IPZR by Texas Instruments

MSP430F4371IPZR by Texas Instruments is a 16-bit microcontroller with 8KB RAM, 32KB ROM, and 8-channel ADC. Ideal for industrial applications, it operates b/w -40 to 85°C, has low power mode, and offers connectivity via SPI, TWI, UART.

Median Price

$5.196

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 85,427 parts In-Stock

1+ parts

$5.592

100+ parts

$4.559

1k+ parts

$3.039

10k+ parts

-

85,427

$5.592

$4.559

$3.039

-

Rochester

USA . 40 parts In-Stock

1+ parts

-

100+ parts

$4.800

1k+ parts

$4.290

10k+ parts

$4.040

40

-

$4.800

$4.290

$4.040

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,808 parts In-Stock

1+ parts

$4.009

100+ parts

-

1k+ parts

-

10k+ parts

-

3,808

$4.009

-

-

-

Vyrian

USA . 4,132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,132

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,421 parts In-Stock

1+ parts

$3.798

100+ parts

-

1k+ parts

-

10k+ parts

-

1,421

$3.798

-

-

-

Component Stockers USA

USA . 115,946 parts In-Stock

1+ parts

$5.860

100+ parts

-

1k+ parts

-

10k+ parts

-

115,946

$5.860

-

-

-

AZTECH Wire

Italy . 422 parts In-Stock

1+ parts

$17.630

100+ parts

-

1k+ parts

-

10k+ parts

-

422

$17.630

-

-

-

Microchip USA

USA . 2,212 parts In-Stock

1+ parts

$26.930

100+ parts

$26.770

1k+ parts

$26.690

10k+ parts

$26.600

2,212

$26.930

$26.770

$26.690

$26.600

Parana Technologies

USA . 2,356 parts In-Stock

1+ parts

$69.259

100+ parts

-

1k+ parts

-

10k+ parts

-

2,356

$69.259

-

-

-

DigiPath Technology Company

USA . 755 parts In-Stock

1+ parts

$76.263

100+ parts

$70.162

1k+ parts

-

10k+ parts

-

755

$76.263

$70.162

-

-

ChromeModa Solutions

Germany . 3,192 parts In-Stock

1+ parts

$77.819

100+ parts

$63.812

1k+ parts

-

10k+ parts

-

3,192

$77.819

$63.812

-

-

IDEA Electronic Components Group

UK . 216 parts In-Stock

1+ parts

$77.819

100+ parts

$73.928

1k+ parts

$70.037

10k+ parts

-

216

$77.819

$73.928

$70.037

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,500

-

-

-

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Kepictronics

USA . 1,200 parts In-Stock

1+ parts

-

100+ parts

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1,200

-

-

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Benley Electronics

USA . 966 parts In-Stock

1+ parts

-

100+ parts

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966

-

-

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Futuretech Components

Singapore . 830 parts In-Stock

1+ parts

-

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830

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F4371IPZR microcontroller, a powerful and versatile solution for your embedded system needs. Manufactured by a trusted industry leader, this device offers exceptional quality and reliability. Ideal for a wide range of applications, this microcontroller provides unparalleled value with its low power consumption, high performance, and advanced features. Experience seamless connectivity and efficient operation with the MSP430F4371IPZR, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a cost-effective and lightweight option for packaging the microcontroller, making it suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for operation in a variety of voltage environments, providing flexibility in power supply options.

No. of I/O Lines: 48

Offers a high number of I/O lines, allowing for versatile connectivity and interactions with external devices or peripherals.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC architecture microcontroller, it provides efficient and fast processing capabilities for embedded applications.

ADC Channels: YES

Integration of Analog-to-Digital Converters enables the microcontroller to interface with analog sensors or signals, expanding its functionality.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates of the program memory, enhancing flexibility and adaptability of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

The inclusion of various peripherals such as comparators, LCD, timers, and more, enhances the microcontroller's capabilities for diverse applications.

Speed: 8 rpm

Although not a typical specification for a microcontroller, the low speed ensures energy efficiency in low-power applications or during standby modes.

Technical Specifications

Microcontrollers MSP430F4371IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"SPI, TWI, UART, USART"

Peripherals:

"COMPARATOR, LCD, POR, TIMER(7), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F4371IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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