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MSP430F4361IPNR

Texas Instruments

MSP430F4361IPNR by Texas Instruments

MSP430F4361IPNR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 24576 ROM words. It operates at a max clock frequency of 8 MHz, suitable for industrial applications requiring low power consumption. Features include 8-channel ADC, 7 timers, and connectivity options like SPI and UART.

Median Price

$6.578

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,500 parts In-Stock

1+ parts

$6.578

100+ parts

$5.363

1k+ parts

$3.575

10k+ parts

-

7,500

$6.578

$5.363

$3.575

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,560 parts In-Stock

1+ parts

$6.249

100+ parts

-

1k+ parts

-

10k+ parts

-

2,560

$6.249

-

-

-

Vyrian

USA . 8,829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,829

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,434 parts In-Stock

1+ parts

$5.920

100+ parts

-

1k+ parts

-

10k+ parts

-

2,434

$5.920

-

-

-

AZTECH Wire

Italy . 596 parts In-Stock

1+ parts

$18.260

100+ parts

-

1k+ parts

-

10k+ parts

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596

$18.260

-

-

-

Microchip USA

USA . 2,652 parts In-Stock

1+ parts

$31.680

100+ parts

$31.490

1k+ parts

$31.390

10k+ parts

$31.290

2,652

$31.680

$31.490

$31.390

$31.290

Parana Technologies

USA . 2,161 parts In-Stock

1+ parts

$50.476

100+ parts

-

1k+ parts

-

10k+ parts

-

2,161

$50.476

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-

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$54.785

100+ parts

$54.237

1k+ parts

$52.046

10k+ parts

-

50

$54.785

$54.237

$52.046

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DigiPath Technology Company

USA . 875 parts In-Stock

1+ parts

$55.581

100+ parts

$51.134

1k+ parts

-

10k+ parts

-

875

$55.581

$51.134

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-

ChromeModa Solutions

Germany . 4,523 parts In-Stock

1+ parts

$56.715

100+ parts

$46.506

1k+ parts

-

10k+ parts

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4,523

$56.715

$46.506

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IDEA Electronic Components Group

UK . 2,327 parts In-Stock

1+ parts

$56.715

100+ parts

$53.879

1k+ parts

$51.044

10k+ parts

-

2,327

$56.715

$53.879

$51.044

-

Overview

Unlock the power of innovation with the MSP430F4361IPNR by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers top-quality products that push boundaries and drive progress. Ideal for a wide range of applications, this microcontroller offers unmatched value and benefits to customers. With features like low power mode, PWM channels, and connectivity options, the MSP430F4361IPNR is a versatile solution for your next project. Experience the advantages of cutting-edge technology and seamless integration with this high-performance microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material allows for a lightweight and durable package, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability enhances ease of PCB assembly and reduces overall size of the design.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power supply options.

On Chip Data RAM Width: 8

8-bit data RAM width enables efficient data handling and processing.

Package Shape: SQUARE

Square package shape facilitates neat and compact PCB layout.

Bit Size: 16

16-bit architecture enables high-performance computing capabilities.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages enhances compatibility with different systems.

No. of Terminals: 80

High number of terminals allows for versatile connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, fine pitch package style ensures efficient use of board space and enhanced routing capabilities.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage helps in conserving power and extending battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes it suitable for industrial environments.

CPU Family: MSP430

Belonging to the MSP430 CPU family ensures reliable and proven performance.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for operation in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

ADC Channels: YES

Presence of ADC channels enables analog signal processing capabilities.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure soldering.

ROM Words: 24576

Large ROM size allows for storing a significant amount of program code.

Maximum Seated Height: 1.6 mm

Low seated height makes it suitable for compact and slim designs.

Width: 12 mm

Compact width dimension enables space-saving integration.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of PCBs.

Peripherals: COMPARTOR, LCD, POR, TIMER(7), WDT

Rich set of peripherals enables a wide range of functionalities for diverse applications.

Maximum Clock Frequency: 8 MHz

High clock frequency supports fast processing speeds.

Maximum Time At Peak Reflow Temperature (s): 30

Maintaining peak reflow temperature for a longer duration ensures proper soldering and reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures strong and durable solder joints.

Length: 12 mm

Compact length dimension enables space-efficient designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range allows for reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture provides efficient performance and low power consumption.

No. of Timers: 7

Multiple timers enable precise timing control for various functions.

RAM Bytes: 1024

Ample RAM size allows for efficient data storage and manipulation.

Technology: CMOS

CMOS technology offers high integration density and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical support and easy soldering.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple 12-bit ADC channels enable accurate analog-to-digital conversion.

Maximum Supply Current: 0.56 mA

Low maximum supply current ensures efficient power usage.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent performance.

PWM Channels: YES

Support for PWM channels enables precise control of output signals.

Connectivity: SPI, TWI, UART, USART

Versatile connectivity options for interfacing with external devices.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates to the program code.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on PCBs.

Format: FIXED POINT

Fixed-point format offers efficient computational capabilities for various algorithms.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for most environments.

Speed: 8 rpm

Efficient processing speed for a wide range of applications.

Low Power Mode: YES

Low power mode option enhances energy efficiency for battery-powered applications.

On Chip Program ROM Width: 8

8-bit program ROM width allows for efficient storage and execution of program code.

No. of I/O Lines: 48

High number of I/O lines provides ample connectivity for interfacing with external devices.

Technical Specifications

Microcontrollers MSP430F4361IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

1

No. of Terminals:

80

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"SPI, TWI, UART, USART"

Peripherals:

"COMPARATOR, LCD, POR, TIMER(7), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F4361IPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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