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MSP430F4351IPNR

Texas Instruments

MSP430F4351IPNR by Texas Instruments

MSP430F4351IPNR by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 8 MHz. It features 512 bytes of RAM, 16384 ROM words, and 8 ADC channels. Ideal for industrial applications requiring low power consumption and connectivity via SPI, TWI, UART, and USART interfaces.

Median Price

$6.041

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,682 parts In-Stock

1+ parts

$6.041

100+ parts

$4.925

1k+ parts

$3.283

10k+ parts

-

11,682

$6.041

$4.925

$3.283

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,553 parts In-Stock

1+ parts

$5.739

100+ parts

-

1k+ parts

-

10k+ parts

-

2,553

$5.739

-

-

-

Vyrian

USA . 3,523 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,523

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,036 parts In-Stock

1+ parts

$5.437

100+ parts

-

1k+ parts

-

10k+ parts

-

1,036

$5.437

-

-

-

Parana Technologies

USA . 926 parts In-Stock

1+ parts

$15.328

100+ parts

-

1k+ parts

$15.723

10k+ parts

-

926

$15.328

-

$15.723

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DigiPath Technology Company

USA . 1,588 parts In-Stock

1+ parts

$16.879

100+ parts

-

1k+ parts

-

10k+ parts

-

1,588

$16.879

-

-

-

ChromeModa Solutions

Germany . 3,405 parts In-Stock

1+ parts

$17.223

100+ parts

$14.123

1k+ parts

-

10k+ parts

-

3,405

$17.223

$14.123

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IDEA Electronic Components Group

UK . 1,992 parts In-Stock

1+ parts

$17.223

100+ parts

$16.362

1k+ parts

$15.501

10k+ parts

-

1,992

$17.223

$16.362

$15.501

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AZTECH Wire

Italy . 434 parts In-Stock

1+ parts

$17.620

100+ parts

-

1k+ parts

-

10k+ parts

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434

$17.620

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Microchip USA

USA . 2,594 parts In-Stock

1+ parts

$29.100

100+ parts

$28.920

1k+ parts

$28.830

10k+ parts

$28.740

2,594

$29.100

$28.920

$28.830

$28.740

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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Perfect Parts

USA . 542 parts In-Stock

1+ parts

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100+ parts

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542

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F4351IPNR Microcontroller. Designed to deliver top-notch quality and reliability, this cutting-edge device offers a wide range of applications in various industries. Whether you're looking to enhance efficiency, streamline processes, or maximize performance, this advanced microcontroller has got you covered. With its state-of-the-art technology and exceptional features, the MSP430F4351IPNR is the perfect solution for all your embedded system needs. Say hello to seamless connectivity, unparalleled speed, and unmatched precision – experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microcontroller, making it suitable for a wide range of applications.

Maximum Supply Voltage 3.6 V

Allows for flexibility in power supply options without risking damage to the microcontroller.

ADC Channels YES

Built-in Analog to Digital Converters allow for easy interfacing with analog sensors and signals.

PWM Channels YES

Pulse Width Modulation channels enable precise control over digital signals, useful for motor control and power regulation.

Connectivity "SPI, TWI, UART, USART

Multiple communication interfaces provide versatility in connecting with other devices and systems.

ROM Programmability FLASH

Flash ROM allows for easy programmability and reprogramming of the microcontroller, essential for development and updates.

Low Power Mode YES

Low power mode helps conserve energy and extend battery life, making the microcontroller suitable for power-sensitive applications.

Technical Specifications

Microcontrollers MSP430F4351IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

1

No. of Terminals:

80

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"SPI, TWI, UART, USART"

Peripherals:

"COMPARATOR, LCD, POR, TIMER(7), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F4351IPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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