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MSP430F4270IRGZT

Texas Instruments

MSP430F4270IRGZT by Texas Instruments

MSP430F4270IRGZT by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 256B RAM, and 32768 ROM words. It operates at up to 8MHz clock frequency, suitable for industrial applications requiring low power consumption and ADC/DAC functionality. The chip carrier package has a very thin profile, making it ideal for compact designs with boundary scan capability.

Median Price

$8.011

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 250 parts In-Stock

1+ parts

$6.520

100+ parts

$4.470

1k+ parts

$3.510

10k+ parts

-

250

$6.520

$4.470

$3.510

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Newark

USA . 250 parts In-Stock

1+ parts

$7.750

100+ parts

$5.800

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-

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250

$7.750

$5.800

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Texas Instruments

USA . 3,000 parts In-Stock

1+ parts

$8.011

100+ parts

$6.531

1k+ parts

$4.354

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-

3,000

$8.011

$6.531

$4.354

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DigiKey

USA . 454 parts In-Stock

1+ parts

$10.200

100+ parts

$6.787

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$6.229

10k+ parts

$6.131

454

$10.200

$6.787

$6.229

$6.131

Mouser Electronics

USA . 245 parts In-Stock

1+ parts

$10.200

100+ parts

$6.790

1k+ parts

$6.130

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245

$10.200

$6.790

$6.130

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Verical

USA . 38 parts In-Stock

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38

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Distributors (In-Stock)

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Digiode

USA . 2,991 parts In-Stock

1+ parts

$7.610

100+ parts

-

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2,991

$7.610

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Vyrian

USA . 824 parts In-Stock

1+ parts

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824

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Infinite Electronics LLP

India . 250 parts In-Stock

1+ parts

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250

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Martec Srl

Italy . 240 parts In-Stock

1+ parts

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240

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Continental Prestige Electronics

USA . 240 parts In-Stock

1+ parts

$6.380

100+ parts

$5.020

1k+ parts

-

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240

$6.380

$5.020

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Semicontronic

India . 558 parts In-Stock

1+ parts

$6.810

100+ parts

$6.640

1k+ parts

$6.606

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558

$6.810

$6.640

$6.606

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Corphita

USA . 4,146 parts In-Stock

1+ parts

$7.210

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4,146

$7.210

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Ampacity Inc.

Singapore . 616 parts In-Stock

1+ parts

$14.820

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616

$14.820

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$19.456

100+ parts

$18.483

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$18.483

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15

$19.456

$18.483

$18.483

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Corohmni

South Africa . 192 parts In-Stock

1+ parts

$25.796

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192

$25.796

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Parana Technologies

USA . 517 parts In-Stock

1+ parts

$48.847

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517

$48.847

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ChromeModa Solutions

Germany . 4,960 parts In-Stock

1+ parts

$54.884

100+ parts

$45.005

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4,960

$54.884

$45.005

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IDEA Electronic Components Group

UK . 1,421 parts In-Stock

1+ parts

$54.884

100+ parts

$52.140

1k+ parts

$49.396

10k+ parts

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1,421

$54.884

$52.140

$49.396

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QUARKTWIN TECHNOLOGY LTD

USA . 12,966 parts In-Stock

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12,966

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Lixinc

USA . 4,735 parts In-Stock

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Perfect Parts

USA . 3,644 parts In-Stock

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3,644

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Argo Parts USA

USA . 3,218 parts In-Stock

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3,218

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A-Z Elektronik GmbH

Germany . 1,587 parts In-Stock

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1,587

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DigiPath Technology Company

USA . 1,566 parts In-Stock

1+ parts

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$49.483

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1,566

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$49.483

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Metaverse IC Inc.

Canada . 970 parts In-Stock

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970

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F4270IRGZT microcontroller. This powerful device, part of the MSP430 family, offers unparalleled quality and reliability in a compact package. Ideal for a wide range of applications, this microcontroller boasts low power consumption, high performance, and versatile peripherals including LCD and timers. Experience seamless integration and exceptional value with the MSP430F4270IRGZT, designed to elevate your projects to new heights. Join the Texas Instruments community and revolutionize the way you approach microcontroller technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product reliable for long-term use.

On Chip Data RAM Width: 8

With a data RAM width of 8, the product can efficiently handle and process data, improving performance.

Bit Size: 16

A 16-bit architecture allows for higher precision and processing capabilities, enhancing the overall performance of the microcontroller.

DAC Channels: YES

Having DAC channels enables the microcontroller to convert digital signals into analog signals, making it suitable for various applications that require analog output.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals into digital signals, making it versatile for different types of input signals.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller ensures efficient processing and execution of instructions, improving overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various operating conditions.

PWM Channels: YES

PWM (Pulse Width Modulation) channels allow for precise control of output signals, making the microcontroller ideal for applications that require accurate pulse modulation.

Low Power Mode: YES

Having a low power mode enhances energy efficiency and extends battery life, making the microcontroller suitable for power-sensitive applications.

Technical Specifications

Microcontrollers MSP430F4270IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

0

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.52 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOR, LCD, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

MSP430F4270IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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