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MSP430F4250IRGZT

Texas Instruments

MSP430F4250IRGZT by Texas Instruments

MSP430F4250IRGZT by Texas Instruments is a 16-bit microcontroller with 16384 ROM words and 256 RAM bytes. It operates at a max clock frequency of 8 MHz, suitable for industrial applications requiring low power consumption. Features include 5-Ch 12-Bit ADCs, BOR, LCD, and TIMER peripherals.

Median Price

$6.252

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35 parts In-Stock

1+ parts

$3.340

100+ parts

$3.270

1k+ parts

$3.210

10k+ parts

-

35

$3.340

$3.270

$3.210

-

Texas Instruments

USA . 24,465 parts In-Stock

1+ parts

$6.252

100+ parts

$5.097

1k+ parts

$3.398

10k+ parts

-

24,465

$6.252

$5.097

$3.398

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DigiKey

USA . 262 parts In-Stock

1+ parts

$8.150

100+ parts

-

1k+ parts

$5.109

10k+ parts

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262

$8.150

-

$5.109

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Mouser Electronics

USA . 250 parts In-Stock

1+ parts

$8.150

100+ parts

-

1k+ parts

$4.930

10k+ parts

-

250

$8.150

-

$4.930

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Arrow

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.600

10k+ parts

-

250

-

-

$4.600

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,777 parts In-Stock

1+ parts

$4.484

100+ parts

-

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4,777

$4.484

-

-

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Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$5.170

100+ parts

-

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68

$5.170

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Vyrian

USA . 6,800 parts In-Stock

1+ parts

-

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-

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6,800

-

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Euro-Tech

UK . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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250

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,571 parts In-Stock

1+ parts

$3.910

100+ parts

-

1k+ parts

-

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4,571

$3.910

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-

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Corphita

USA . 3,793 parts In-Stock

1+ parts

$4.248

100+ parts

-

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10k+ parts

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3,793

$4.248

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-

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Netroflash

USA . 500 parts In-Stock

1+ parts

$5.170

100+ parts

$5.067

1k+ parts

$4.912

10k+ parts

$4.808

500

$5.170

$5.067

$4.912

$4.808

Parana Technologies

USA . 1,985 parts In-Stock

1+ parts

$71.975

100+ parts

-

1k+ parts

-

10k+ parts

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1,985

$71.975

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DigiPath Technology Company

USA . 1,858 parts In-Stock

1+ parts

$79.254

100+ parts

$72.913

1k+ parts

-

10k+ parts

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1,858

$79.254

$72.913

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ChromeModa Solutions

Germany . 5,100 parts In-Stock

1+ parts

$80.871

100+ parts

$66.314

1k+ parts

-

10k+ parts

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5,100

$80.871

$66.314

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IDEA Electronic Components Group

UK . 2,290 parts In-Stock

1+ parts

$80.871

100+ parts

$76.827

1k+ parts

$72.784

10k+ parts

-

2,290

$80.871

$76.827

$72.784

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

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4,000

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Perfect Parts

USA . 3,069 parts In-Stock

1+ parts

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3,069

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Overview

Unlock endless possibilities with the MSP430F4250IRGZT microcontroller by Texas Instruments. Designed with precision and reliability, this powerful device offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, the MSP430F4250IRGZT delivers exceptional value with its low power consumption, versatile peripherals, and advanced features. Trust in Texas Instruments' reputation for excellence and elevate your projects to new heights with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for more flexibility in power source options and compatibility with different systems.

ADC Channels: YES

Having analog-to-digital converter channels enables the microcontroller to process analog signals, expanding its capabilities in sensor interfacing and data acquisition.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computing) architecture typically results in faster execution of instructions, making the microcontroller more efficient in handling tasks.

Nominal Supply Voltage: 2.2 V

Operating at a lower supply voltage can help in reducing power consumption and heat dissipation, making the microcontroller more energy-efficient.

Low Power Mode: YES

The availability of low power mode allows the microcontroller to optimize power usage when not running intensive tasks, prolonging battery life in portable devices.

Technical Specifications

Microcontrollers MSP430F4250IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

0

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.52 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOR, LCD, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

MSP430F4250IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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