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MSP430F417TDE1

Texas Instruments

MSP430F417TDE1 by Texas Instruments

MSP430F417TDE1 by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating voltage range of 1.8V to 3.6V, and peripherals like BOD, Comparator, LCD, Timer(2). Ideal for low-power applications in various industries due to its CMOS technology and FLASH ROM programmability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,845 parts In-Stock

1+ parts

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4,845

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Digiode

USA . 2,141 parts In-Stock

1+ parts

-

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-

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2,141

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,351 parts In-Stock

1+ parts

$16.118

100+ parts

-

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10k+ parts

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2,351

$16.118

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One Stop Electronics

USA . 1,343 parts In-Stock

1+ parts

$19.000

100+ parts

-

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1,343

$19.000

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AZTECH Wire

Italy . 600 parts In-Stock

1+ parts

$19.861

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600

$19.861

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Parana Technologies

USA . 833 parts In-Stock

1+ parts

$35.742

100+ parts

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833

$35.742

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DigiPath Technology Company

USA . 14 parts In-Stock

1+ parts

$39.356

100+ parts

$36.207

1k+ parts

-

10k+ parts

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14

$39.356

$36.207

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ChromeModa Solutions

Germany . 5,571 parts In-Stock

1+ parts

$40.159

100+ parts

$32.930

1k+ parts

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10k+ parts

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5,571

$40.159

$32.930

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IDEA Electronic Components Group

UK . 2,088 parts In-Stock

1+ parts

$40.159

100+ parts

$38.151

1k+ parts

$36.143

10k+ parts

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2,088

$40.159

$38.151

$36.143

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Corphita

USA . 3,790 parts In-Stock

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3,790

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F417TDE1 microcontroller. Designed with precision and innovation, this product offers top-notch quality and reliability. Ideal for a wide range of applications, this microcontroller is perfect for projects requiring low power consumption and high performance. Experience seamless integration and enhanced functionality with the MSP430F417TDE1, making it a valuable asset for any project. Elevate your designs with Texas Instruments' cutting-edge technology and trusted expertise.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and space-saving integration into electronic designs.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, making it versatile in different power supply scenarios.

Package Shape: RECTANGULAR

Rectangular shape allows for easier placement and routing on PCBs.

Bit Size: 16

16-bit architecture provides a good balance between computational power and efficiency.

No. of Terminals: 64

Ample number of terminals for connecting to various peripherals and components in a design.

Package Style (Meter): UNCASED CHIP

Uncased chip package style allows for direct mounting on PCBs without the need for additional housing.

Minimum Supply Voltage: 1.8 V

Can operate efficiently at low supply voltages, ideal for battery-powered applications.

CPU Family: MSP430

Part of the MSP430 CPU family known for low power consumption and high performance.

Terminal Position: UPPER

Upper terminal position simplifies PCB layout and component placement.

Peripherals: BOD, COMPARATOR, LCD, TIMER(2)

Rich set of peripherals like brown-out detection, comparators, LCD interface, and timers for enhanced functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture along with microcontroller capabilities provide high processing power in a compact package.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: NO LEAD

No lead terminals make soldering easier and provide better thermal performance.

Nominal Supply Voltage: 2.5 V

Nominal supply voltage that falls within common operating ranges, ensuring compatibility with standard power sources.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization of the microcontroller.

No. of I/O Lines: 48

Abundance of I/O lines for connecting to peripheral devices, sensors, and user interface components.

Technical Specifications

Microcontrollers MSP430F417TDE1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-XUUC-N64

No. of DMA Channels:

0

No. of I/O Lines:

48

No. of Terminals:

64

PWM Channels:

NO

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

BOD, COMPARATOR, LCD, TIMER(2)

Trade Compliance

MSP430F417TDE1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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