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MSP430F417IRTDR

Texas Instruments

MSP430F417IRTDR by Texas Instruments

MSP430F417IRTDR by Texas Instruments is a 16-bit microcontroller with 3.6V max supply voltage, 8 MHz clock frequency, and 1024 bytes of RAM. Ideal for industrial applications requiring low power consumption, it features UART connectivity, 48 I/O lines, and on-chip flash ROM programmability.

Median Price

$3.796

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,548 parts In-Stock

1+ parts

$3.796

100+ parts

$3.095

1k+ parts

$2.063

10k+ parts

-

9,548

$3.796

$3.095

$2.063

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,064 parts In-Stock

1+ parts

$3.606

100+ parts

-

1k+ parts

-

10k+ parts

-

2,064

$3.606

-

-

-

Vyrian

USA . 8,877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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8,877

-

-

-

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ComSIT Distribution GmbH

Germany . 2,663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,663

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,626 parts In-Stock

1+ parts

$3.416

100+ parts

-

1k+ parts

-

10k+ parts

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3,626

$3.416

-

-

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AZTECH Wire

Italy . 652 parts In-Stock

1+ parts

$8.400

100+ parts

-

1k+ parts

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10k+ parts

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652

$8.400

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-

-

Parana Technologies

USA . 1,747 parts In-Stock

1+ parts

$13.493

100+ parts

-

1k+ parts

$14.005

10k+ parts

-

1,747

$13.493

-

$14.005

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ChromeModa Solutions

Germany . 4,561 parts In-Stock

1+ parts

$15.161

100+ parts

$12.432

1k+ parts

-

10k+ parts

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4,561

$15.161

$12.432

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IDEA Electronic Components Group

UK . 845 parts In-Stock

1+ parts

$15.161

100+ parts

$14.403

1k+ parts

$13.645

10k+ parts

-

845

$15.161

$14.403

$13.645

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Microchip USA

USA . 4,461 parts In-Stock

1+ parts

$20.857

100+ parts

-

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4,461

$20.857

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Component Stockers USA

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

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7,000

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DigiPath Technology Company

USA . 1,148 parts In-Stock

1+ parts

-

100+ parts

$13.669

1k+ parts

-

10k+ parts

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1,148

-

$13.669

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-

Overview

Unlock the potential of your electronic projects with the Texas Instruments MSP430F417IRTDR microcontroller. Designed with precision and quality in mind, Texas Instruments delivers cutting-edge technology to power your innovations. With a wide range of applications in various industries, this microcontroller provides value, efficiency, and reliability for your projects. Experience the benefits of its advanced features, low power consumption, and high performance, making it the perfect choice for your next design. Trust Texas Instruments to drive your success with the MSP430F417IRTDR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the microcontroller suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and space in the design process.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options while ensuring stable performance within the specified range.

On Chip Data RAM Width: 8

With a wider data RAM width, the microcontroller can handle larger amounts of data efficiently.

Package Shape: SQUARE

Square packages are easier to handle and integrate into circuit designs, improving overall board layout.

Bit Size: 16

A 16-bit size allows for higher precision and larger data processing capabilities compared to lower bit sizes.

Power Supplies (V): 2/3.3

Supports multiple power supply options, giving designers flexibility in choosing the most suitable voltage for their application.

No. of Terminals: 64

Having a higher number of terminals allows for more connectivity options and interfacing with external components.

Minimum Supply Voltage: 2.7 V

Guarantees reliable operation even at lower voltages, ensuring consistent performance in varying power supply conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions without compromising performance.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility with existing software, tools, and peripherals, reducing development time and effort.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures, making it suitable for a wide range of industrial and automotive applications.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals to digital data, expanding its capability to interface with various sensors and devices.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability, ensuring reliable connections during assembly and operation.

Peripherals: "BOR, COMPARATOR, LCD, TIMER(9), WDT

A wide range of peripherals enhances the microcontroller's functionality, making it suitable for diverse applications that require different interfacing options.

Maximum Clock Frequency: 8 MHz

With a high maximum clock frequency, the microcontroller can execute instructions quickly, improving overall performance and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required at peak reflow temperature ensures efficient and reliable soldering during assembly.

Technical Specifications

Microcontrollers MSP430F417IRTDR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

0

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

UART

Peripherals:

"BOR, COMPARATOR, LCD, TIMER(9), WDT"

Trade Compliance

MSP430F417IRTDR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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