Loading...

MSP430F417CY

Texas Instruments

MSP430F417CY by Texas Instruments

MSP430F417CY by Texas Instruments is a 16-bit microcontroller with a max clock frequency of 8 MHz. Operating in industrial temperature range (-40 to 85°C), it features 48 I/O lines and PWM channels for various applications. This CMOS technology-based chip has flash ROM programmability, making it suitable for diverse embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,470

-

-

-

-

Digiode

USA . 632 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

632

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,456 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,456

$2.000

-

-

-

AZTECH Wire

Italy . 363 parts In-Stock

1+ parts

$6.823

100+ parts

-

1k+ parts

-

10k+ parts

-

363

$6.823

-

-

-

Parana Technologies

USA . 104 parts In-Stock

1+ parts

$74.171

100+ parts

$6,887.886

1k+ parts

$66.754

10k+ parts

-

104

$74.171

$6,887.886

$66.754

-

DigiPath Technology Company

USA . 2,151 parts In-Stock

1+ parts

$81.671

100+ parts

$75.138

1k+ parts

-

10k+ parts

-

2,151

$81.671

$75.138

-

-

ChromeModa Solutions

Germany . 5,729 parts In-Stock

1+ parts

$83.338

100+ parts

$68.337

1k+ parts

-

10k+ parts

-

5,729

$83.338

$68.337

-

-

IDEA Electronic Components Group

UK . 1,078 parts In-Stock

1+ parts

$83.338

100+ parts

$79.171

1k+ parts

$75.004

10k+ parts

-

1,078

$83.338

$79.171

$75.004

-

Microchip USA

USA . 1,299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,299

-

-

-

-

Corphita

USA . 743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

743

-

-

-

-

Overview

Unlock the full potential of your next project with the Texas Instruments MSP430F417CY microcontroller. With its advanced technology and reliable performance, this device is perfect for a wide range of applications. Whether you're working on IoT devices, consumer electronics, or industrial automation, this microcontroller offers unmatched value and benefits. Trust in Texas Instruments' reputation for quality and innovation, and experience the advantages of precision engineering with the MSP430F417CY. Upgrade your designs today and see the difference for yourself.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy PCB assembly and saves space compared to through-hole mounting.

Maximum Supply Voltage: 3.6 V

Capable of operating at higher voltages which can be beneficial for certain applications.

Bit Size: 16

Provides a good balance between performance and cost for various embedded systems.

Package Style (Meter): UNCASED CHIP

Offers flexibility in mounting options and allows for customization of the final product design.

Minimum Supply Voltage: 2.7 V

Can operate at lower voltages to conserve power in battery-powered applications.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher temperatures may be present.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold environments without performance degradation.

Terminal Position: UPPER

Facilitates easier connections and routing on the PCB.

Maximum Clock Frequency: 8 MHz

Provides sufficient processing speed for many embedded applications while consuming less power.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial conditions without compromising functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instruction execution and lower power consumption.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: NO LEAD

Enables easy surface mount assembly and improves thermal performance.

Nominal Supply Voltage: 3 V

Standard supply voltage for many embedded systems, ensuring compatibility.

PWM Channels: YES

Supports Pulse Width Modulation which is useful for controlling motors, LEDs, and other devices.

ROM Programmability: FLASH

Allows for easy reprogramming of the memory and firmware during product development.

Speed: 8 rpm

Sufficient speed for controlling various mechanical and electrical systems in real-time.

No. of I/O Lines: 48

Offers a good number of input/output options for interfacing with external devices and sensors.

Technical Specifications

Microcontrollers MSP430F417CY attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

X-XUUC-N

No. of I/O Lines:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

ROM Programmability:

FLASH

Speed:

8 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

MSP430F417CY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20