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MSP430F4152IRGZ

Texas Instruments

MSP430F4152IRGZ by Texas Instruments

MSP430F4152IRGZ by Texas Instruments is a 16-bit microcontroller with 48 terminals, operating at up to 8 MHz. It features 512 bytes of RAM, 16384 ROM words, and ADC channels for industrial applications requiring low power consumption and high performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 34,500 parts In-Stock

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Vyrian

USA . 4,817 parts In-Stock

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Digiode

USA . 2,746 parts In-Stock

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AZTECH Wire

Italy . 523 parts In-Stock

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$17.556

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Parana Technologies

USA . 1,473 parts In-Stock

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$25.477

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$26.103

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One Stop Electronics

USA . 1,291 parts In-Stock

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$26.000

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DigiPath Technology Company

USA . 1,226 parts In-Stock

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$28.053

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ChromeModa Solutions

Germany . 4,776 parts In-Stock

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$28.626

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$23.473

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IDEA Electronic Components Group

UK . 1,351 parts In-Stock

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$28.626

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$27.195

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$25.763

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Microchip USA

USA . 5,296 parts In-Stock

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Corphita

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Overview

Unleash the power of innovation with the MSP430F4152IRGZ by Texas Instruments! As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers like this one, designed for a wide range of applications. With its compact package body material and impressive features, this microcontroller offers unmatched value to customers seeking high-performance solutions. Experience seamless operation, versatile functionality, and reliable performance with the MSP430F4152IRGZ - the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures a long-lasting and reliable product.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Suitable for a wide range of applications while providing adequate power to the microcontroller.

Package Shape: SQUARE

Compact shape allows for efficient use of space on the circuit board.

Bit Size: 16

Provides sufficient processing power for various tasks and applications.

Power Supplies (V): 2/3.3

Supports multiple voltage options for flexibility in power requirements.

No. of Terminals: 48

Offers numerous connection points for interfacing with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles provide options for different mounting and thermal management needs.

Minimum Supply Voltage: 3 V

Lower voltage requirement can help in reducing power consumption and extending battery life.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments without compromising performance.

CPU Family: MSP430

Part of a well-known and reliable microcontroller family with a strong support community.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold conditions, making it suitable for a wide range of environments.

ADC Channels: YES

Integrated analog-to-digital converters provide the ability to interface with analog sensors and devices.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connections to the circuit board.

ROM Words: 16384

Ample ROM capacity for storing program instructions and data.

Maximum Seated Height: 1 mm

Low profile design helps in reducing overall height of the assembly.

Width: 7 mm

Compact width dimension suitable for space-constrained applications.

Maximum Clock Frequency: 8 MHz

High clock frequency allows for fast and efficient processing of instructions.

Length: 7 mm

Compact length dimension suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature range, ensuring performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and fast processing of instructions.

RAM Bytes: 512

Adequate RAM capacity for temporary storage of data during operation.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly and RoHS compliant design.

Maximum Supply Current: 0.398 mA

Low supply current for efficient power usage and longer battery life.

Nominal Supply Voltage: 3.3 V

Stable and common supply voltage for consistent performance.

PWM Channels: YES

Pulse Width Modulation (PWM) channels for precise control of output signals.

ROM Programmability: FLASH

Flash ROM programmability for easy and quick updates of software and firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and reliable connections.

Speed: 8 rpm

Capable of handling tasks at a speed of 8 rotations per minute.

No. of I/O Lines: 39

Sufficient I/O lines for connecting to various external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F4152IRGZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

No. of I/O Lines:

39

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.398 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MSP430F4152IRGZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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