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MSP430F413CY

Texas Instruments

MSP430F413CY by Texas Instruments

MSP430F413CY by Texas Instruments is a 16-bit microcontroller with a max clock frequency of 8 MHz. Operating in industrial temperature range (-40 to 85 °C), it features 48 I/O lines, PWM channels, and ROM programmability for various applications like IoT devices and embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,642 parts In-Stock

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2,642

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Digiode

USA . 1,197 parts In-Stock

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1,197

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Distributors (Availability)

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AZTECH Wire

Italy . 581 parts In-Stock

1+ parts

$11.322

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581

$11.322

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One Stop Electronics

USA . 1,598 parts In-Stock

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$13.000

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1,598

$13.000

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Parana Technologies

USA . 853 parts In-Stock

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$48.198

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853

$48.198

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ChromeModa Solutions

Germany . 5,771 parts In-Stock

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$54.155

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$44.407

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5,771

$54.155

$44.407

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IDEA Electronic Components Group

UK . 1,330 parts In-Stock

1+ parts

$54.155

100+ parts

$51.447

1k+ parts

$48.740

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1,330

$54.155

$51.447

$48.740

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Component Stockers USA

USA . 382 parts In-Stock

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$99.990

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382

$99.990

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Microchip USA

USA . 2,842 parts In-Stock

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DigiPath Technology Company

USA . 1,726 parts In-Stock

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$48.826

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1,726

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$48.826

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Corphita

USA . 753 parts In-Stock

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753

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Overview

Enhance your electronic projects with the MSP430F413CY microcontroller from Texas Instruments. This high-quality, surface-mount device offers a 16-bit architecture with a maximum clock frequency of 8 MHz, making it ideal for a wide range of applications in industrial settings. With its FLASH ROM programmability and 48 I/O lines, this microcontroller provides unmatched flexibility and performance. Trust Texas Instruments for reliable, cutting-edge technology that delivers value and innovation to your designs. Elevate your projects with the MSP430F413CY today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for smaller components and higher component density, making this microcontroller suitable for compact and space-constrained applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power sources, increasing its versatility.

Bit Size: 16

The 16-bit architecture provides improved performance and efficiency compared to lower bit sizes, making it suitable for a variety of applications that require more processing power.

Package Style: UNCASED CHIP

The unencased chip design offers flexibility in mounting options and allows for customization of the final product design.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 85°C ensures reliable performance in various environmental conditions, making it ideal for industrial applications.

Maximum Clock Frequency: 8 MHz

The high clock frequency of 8 MHz enables fast processing speeds, making this microcontroller suitable for applications that require quick response times.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller offers efficient and streamlined operations, enhancing overall performance and power efficiency.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates to the microcontroller's firmware, making it convenient for development and debugging processes.

No. of I/O Lines: 48

With 48 I/O lines, this microcontroller offers ample connectivity options for interfacing with external devices and sensors, enabling versatile functionality.

Technical Specifications

Microcontrollers MSP430F413CY attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

X-XUUC-N

No. of I/O Lines:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

ROM Programmability:

FLASH

Speed:

8 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

MSP430F413CY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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