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MSP430F4132IRGZR

Texas Instruments

MSP430F4132IRGZR by Texas Instruments

MSP430F4132IRGZR by Texas Instruments is a 16-bit microcontroller with 8KB ROM and 512B RAM. Operating at up to 8MHz, it features 8 ADC channels, 9 timers, and low power mode ideal for industrial applications. With I2C, SPI, UART connectivity options, this CMOS device in a chip carrier package suits various embedded system designs.

Median Price

$3.133

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,500 parts In-Stock

1+ parts

$3.133

100+ parts

$2.745

1k+ parts

$1.551

10k+ parts

-

2,500

$3.133

$2.745

$1.551

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,680 parts In-Stock

1+ parts

$2.976

100+ parts

-

1k+ parts

-

10k+ parts

-

3,680

$2.976

-

-

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Vyrian

USA . 8,655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,655

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,811 parts In-Stock

1+ parts

$2.820

100+ parts

-

1k+ parts

-

10k+ parts

-

3,811

$2.820

-

-

-

AZTECH Wire

Italy . 491 parts In-Stock

1+ parts

$10.010

100+ parts

-

1k+ parts

-

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491

$10.010

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-

-

Parana Technologies

USA . 1,148 parts In-Stock

1+ parts

$72.020

100+ parts

-

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1,148

$72.020

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IDEA Electronic Components Group

UK . 1,872 parts In-Stock

1+ parts

$80.921

100+ parts

$76.875

1k+ parts

$72.829

10k+ parts

-

1,872

$80.921

$76.875

$72.829

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ChromeModa Solutions

Germany . 1,443 parts In-Stock

1+ parts

$80.921

100+ parts

$66.355

1k+ parts

-

10k+ parts

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1,443

$80.921

$66.355

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Perfect Parts

USA . 4,146 parts In-Stock

1+ parts

-

100+ parts

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4,146

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A-Z Elektronik GmbH

Germany . 2,500 parts In-Stock

1+ parts

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2,500

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DigiPath Technology Company

USA . 527 parts In-Stock

1+ parts

-

100+ parts

$72.958

1k+ parts

-

10k+ parts

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527

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$72.958

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Overview

Unlock the potential of your projects with the MSP430F4132IRGZR by Texas Instruments. This powerful microcontroller offers top-notch quality and reliability, backed by a trusted manufacturer. Ideal for a wide range of applications, this product provides unmatched value with its high performance, low power consumption, and versatile connectivity options. Experience the benefits of cutting-edge technology in a compact package, perfect for industrial-grade projects that demand efficiency and precision. Choose the MSP430F4132IRGZR for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, making the product versatile in different applications.

Bit Size: 16

The 16-bit architecture provides improved processing power and performance, suitable for tasks requiring higher computational capabilities.

No. of I/O Lines: 56

The ample number of I/O lines enable the product to interface with various external devices and sensors, enhancing its connectivity and functionality.

ADC Channels: YES

The presence of Analog to Digital Converter (ADC) channels allows for accurate conversion of analog signals to digital data, enabling precise measurements and control.

Technical Specifications

Microcontrollers MSP430F4132IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

56

No. of Serial I/Os:

1

No. of Terminals:

48

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.398 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SPI(2), UART(2), USCI(2)

Peripherals:

BOR, COMPARATOR, LCD, RTC, TIMER(9), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F4132IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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