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MSP430F2619TPNR

Texas Instruments

MSP430F2619TPNR by Texas Instruments

MSP430F2619TPNR by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 16 MHz. It features 2 DAC and 8 ADC channels, suitable for industrial applications requiring low power consumption and high-speed processing. With peripherals like BOD, DMA, and timers, it offers versatile connectivity options including I2C, SPI, and UART interfaces.

Median Price

$9.438

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,000 parts In-Stock

1+ parts

$9.064

100+ parts

$7.917

1k+ parts

$5.460

10k+ parts

-

4,000

$9.064

$7.917

$5.460

-

Rochester

USA . 66 parts In-Stock

1+ parts

-

100+ parts

$7.850

1k+ parts

$7.020

10k+ parts

$6.610

66

-

$7.850

$7.020

$6.610

DigiKey

USA . 66 parts In-Stock

1+ parts

-

100+ parts

$10.330

1k+ parts

-

10k+ parts

-

66

-

$10.330

-

-

Verical

USA . 66 parts In-Stock

1+ parts

-

100+ parts

$9.813

1k+ parts

$8.775

10k+ parts

$8.262

66

-

$9.813

$8.775

$8.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,145 parts In-Stock

1+ parts

$7.201

100+ parts

-

1k+ parts

-

10k+ parts

-

1,145

$7.201

-

-

-

Forefront Electronics and Design

USA . 2 parts In-Stock

1+ parts

$23.280

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$23.280

-

-

-

Vyrian

USA . 5,714 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,714

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 733 parts In-Stock

1+ parts

$6.822

100+ parts

-

1k+ parts

-

10k+ parts

-

733

$6.822

-

-

-

Parana Technologies

USA . 934 parts In-Stock

1+ parts

$21.806

100+ parts

-

1k+ parts

$22.279

10k+ parts

-

934

$21.806

-

$22.279

-

ChromeModa Solutions

Germany . 6,076 parts In-Stock

1+ parts

$24.501

100+ parts

$20.091

1k+ parts

-

10k+ parts

-

6,076

$24.501

$20.091

-

-

IDEA Electronic Components Group

UK . 302 parts In-Stock

1+ parts

$24.501

100+ parts

$23.276

1k+ parts

$22.051

10k+ parts

-

302

$24.501

$23.276

$22.051

-

QUARKTWIN TECHNOLOGY LTD

USA . 19,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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19,622

-

-

-

-

Perfect Parts

USA . 748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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748

-

-

-

-

DigiPath Technology Company

USA . 338 parts In-Stock

1+ parts

-

100+ parts

$22.090

1k+ parts

-

10k+ parts

-

338

-

$22.090

-

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430F2619TPNR microcontroller. Crafted with precision and expertise, this versatile device offers a wide range of applications in various industries. From its durable package body material to its advanced technology, this microcontroller is designed to exceed expectations. Experience seamless connectivity, low power consumption, and high performance with the MSP430F2619TPNR. Elevate your projects and designs with the reliability and value that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material helps in providing a lightweight and durable package for the microcontroller.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options for the microcontroller.

Bit Size: 16

16-bit architecture provides a good balance between performance and cost-efficiency.

ADC Channels: YES

Having analog to digital converter channels allows for input from analog sensors, making the microcontroller versatile for various applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions.

RAM Bytes: 4096

Having a decent amount of RAM allows for efficient data processing and storage within the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient instruction execution and lower power consumption.

Connectivity: "I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Multiple connectivity options enable easy communication with external devices and sensors, increasing the versatility of the microcontroller.

Technical Specifications

Microcontrollers MSP430F2619TPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

64

No. of Serial I/Os:

2

No. of Terminals:

80

No. of Timers:

10

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

122880

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)"

Peripherals:

BOD, COMPARATOR, DMA(3), TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2619TPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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