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MSP430F2619SPM

Texas Instruments

MSP430F2619SPM by Texas Instruments

MSP430F2619SPM by Texas Instruments is a 16-bit microcontroller with 122880 ROM words and 4 RAM words. It features 2-Ch 12-Bit DAC channels, 8-Ch 12-Bit ADC channels, and low power mode for applications requiring efficient power management. Ideal for IoT devices, sensors, and battery-operated systems due to its compact size and versatile connectivity options like I2C, SPI, UART.

Median Price

$156.380

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2 parts In-Stock

1+ parts

$88.120

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-

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2

$88.120

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Texas Instruments

USA . 16,707 parts In-Stock

1+ parts

$92.169

100+ parts

$89.397

1k+ parts

$69.300

10k+ parts

-

16,707

$92.169

$89.397

$69.300

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Arrow

USA . 130 parts In-Stock

1+ parts

$156.380

100+ parts

$124.590

1k+ parts

-

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130

$156.380

$124.590

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Verical

USA . 130 parts In-Stock

1+ parts

$156.380

100+ parts

$124.590

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-

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130

$156.380

$124.590

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DigiKey

USA . 368 parts In-Stock

1+ parts

$157.230

100+ parts

$127.300

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368

$157.230

$127.300

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Mouser Electronics

USA . 291 parts In-Stock

1+ parts

$157.230

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$127.300

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291

$157.230

$127.300

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 139 parts In-Stock

1+ parts

$83.714

100+ parts

-

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139

$83.714

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Nova Conductors

Japan . 30 parts In-Stock

1+ parts

$118.910

100+ parts

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30

$118.910

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Vyrian

USA . 6,420 parts In-Stock

1+ parts

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6,420

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Chip Stock

USA . 325 parts In-Stock

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325

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Sensible Micro Corp

USA . 26 parts In-Stock

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26

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,895 parts In-Stock

1+ parts

$38.421

100+ parts

-

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1,895

$38.421

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DigiPath Technology Company

USA . 146 parts In-Stock

1+ parts

$42.307

100+ parts

$38.922

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146

$42.307

$38.922

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ChromeModa Solutions

Germany . 6,398 parts In-Stock

1+ parts

$43.170

100+ parts

$35.399

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6,398

$43.170

$35.399

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IDEA Electronic Components Group

UK . 1,289 parts In-Stock

1+ parts

$43.170

100+ parts

$41.012

1k+ parts

$38.853

10k+ parts

-

1,289

$43.170

$41.012

$38.853

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Corohmni

South Africa . 29 parts In-Stock

1+ parts

$66.373

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29

$66.373

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Semicontronic

India . 5,470 parts In-Stock

1+ parts

$74.900

100+ parts

$73.028

1k+ parts

$72.653

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5,470

$74.900

$73.028

$72.653

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Corphita

USA . 261 parts In-Stock

1+ parts

$79.308

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261

$79.308

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Continental Prestige Electronics

USA . 450 parts In-Stock

1+ parts

$118.910

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$116.532

450

$118.910

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-

$116.532

Netroflash

USA . 50 parts In-Stock

1+ parts

$118.910

100+ parts

-

1k+ parts

$112.965

10k+ parts

$110.586

50

$118.910

-

$112.965

$110.586

Advanced Electronics

New Zealand . 49 parts In-Stock

1+ parts

$121.288

100+ parts

$121.288

1k+ parts

$121.288

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49

$121.288

$121.288

$121.288

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Ampacity Inc.

Singapore . 5,257 parts In-Stock

1+ parts

$163.020

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5,257

$163.020

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Lixinc

USA . 17,341 parts In-Stock

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17,341

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Epart123

USA . 850 parts In-Stock

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$520.000

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850

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$520.000

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Argo Parts USA

USA . 741 parts In-Stock

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741

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Kepictronics

USA . 284 parts In-Stock

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284

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Overview

Discover the Texas Instruments MSP430F2619SPM microcontroller, a cutting-edge solution for a wide range of applications. With a reputation for high quality and reliability, Texas Instruments delivers a product that exceeds expectations. This versatile microcontroller offers customers value through its low power consumption, multiple peripherals, and advanced connectivity options. Whether you're designing IoT devices, industrial controls, or consumer electronics, the MSP430F2619SPM provides the performance and efficiency you need to bring your ideas to life. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this microcontroller is suitable for a wide range of operating environments.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making this microcontroller energy-efficient and reliable.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital data, which is essential for many applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers faster execution of instructions and better performance compared to CISC architectures.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2)

Multiple connectivity options like I2C, IRDA, SPI, and UART enable versatile communication capabilities for the microcontroller.

ROM Programmability: FLASH

The ability to program ROM using flash memory allows for easy updates and customization of the microcontroller's firmware.

Low Power Mode: YES

The presence of a low power mode makes this microcontroller suitable for power-sensitive applications by reducing energy consumption.

Technical Specifications

Microcontrollers MSP430F2619SPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 1.8V MINIMAL SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

122880

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2)

Peripherals:

BOD, COMPARATOR(8), DMA(3), POR, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2619SPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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