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MSP430F2619SKGD1

Texas Instruments

MSP430F2619SKGD1 by Texas Instruments

MSP430F2619SKGD1 by Texas Instruments is a 16-bit microcontroller with 122880 ROM words, 4 RAM words, and 8 ADC channels. Ideal for military-grade applications requiring low power consumption and high-speed processing up to 16 MHz. Features include 2 DAC channels, 3 DMA channels, and various peripherals like timers and UART for versatile connectivity options.

Median Price

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1k+

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Vyrian

USA . 6,501 parts In-Stock

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Digiode

USA . 583 parts In-Stock

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AZTECH Wire

Italy . 447 parts In-Stock

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$6.731

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One Stop Electronics

USA . 815 parts In-Stock

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$23.000

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Parana Technologies

USA . 554 parts In-Stock

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DigiPath Technology Company

USA . 738 parts In-Stock

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ChromeModa Solutions

Germany . 6,480 parts In-Stock

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$78.801

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$64.617

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IDEA Electronic Components Group

UK . 73 parts In-Stock

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$78.801

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$74.861

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$70.921

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Microchip USA

USA . 1,266 parts In-Stock

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$153.470

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$150.800

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$149.470

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QUARKTWIN TECHNOLOGY LTD

USA . 18,346 parts In-Stock

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Corphita

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Overview

Unlock the potential of your projects with the Texas Instruments MSP430F2619SKGD1 microcontroller. Boasting top-notch quality and reliability, this versatile chip is a game-changer for a wide range of applications. From IoT devices to consumer electronics, this microcontroller offers unparalleled value with its low power consumption, advanced peripherals, and high-performance capabilities. Trust in Texas Instruments to deliver cutting-edge technology that empowers your designs to reach new heights. Elevate your projects with the MSP430F2619SKGD1 today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and compact integration onto circuit boards.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

Bit Size: 16

Enables processing of data in 16-bit chunks, providing efficient performance.

DAC Channels: YES

Allows for digital to analog conversion, useful for interfacing with analog components.

Package Style (Meter): UNCASED CHIP

Saves space and allows for direct placement onto boards.

Minimum Operating Temperature: -55 °C

Can operate in extreme low temperature environments.

ADC Channels: YES

Allows for analog to digital conversion, necessary for reading analog sensors.

No. of Terminals: 82

Provides ample connectivity options for various peripherals.

ROM Words: 122880

Large amount of programmable memory for storing code.

Digital To Analog Convertors: 2-Ch 12-Bit

High resolution DACs provide accurate analog output.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses a RISC architecture for efficient processing and control.

No. of Timers: 2

Allows for precise timing control in the product.

RAM Bytes: 4096

A decent amount of RAM for storing and manipulating data during operation.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple high resolution ADCs for reading multiple analog inputs.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses a RISC architecture for efficient processing and control.

Maximum Clock Frequency: 16 MHz

Provides fast processing speed for quick execution of tasks.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2)

Multiple communication interfaces for connecting with other devices or modules.

Technical Specifications

Microcontrollers MSP430F2619SKGD1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 1.8V MINIMAL SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

X-XUUC-N82

Low Power Mode:

YES

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

4

No. of Terminals:

82

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

122880

ROM Programmability:

FLASH

Speed:

16 rpm

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2)

Peripherals:

BOD, COMPARATOR(8), DMA(3), POR, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2619SKGD1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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