Loading...

MSP430F2618TZCA

Texas Instruments

MSP430F2618TZCA by Texas Instruments

MSP430F2618TZCA by Texas Instruments is a 16-bit microcontroller with 3.6V max supply voltage, 4096 RAM words, and 2-Ch 12-Bit DAC channels. Ideal for industrial applications due to its -40 to 105 °C operating temperature range, it features peripherals like BOD, DMA(3), and TIMER(2) for enhanced functionality in compact designs.

Median Price

$21.440

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,032 parts In-Stock

1+ parts

$14.701

100+ parts

$12.841

1k+ parts

$8.856

10k+ parts

-

2,032

$14.701

$12.841

$8.856

-

DigiKey

USA . 31 parts In-Stock

1+ parts

$21.440

100+ parts

$14.897

1k+ parts

$13.980

10k+ parts

-

31

$21.440

$14.897

$13.980

-

Mouser Electronics

USA . 19 parts In-Stock

1+ parts

$24.330

100+ parts

$16.990

1k+ parts

$16.340

10k+ parts

-

19

$24.330

$16.990

$16.340

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,455 parts In-Stock

1+ parts

$13.966

100+ parts

-

1k+ parts

-

10k+ parts

-

2,455

$13.966

-

-

-

Vyrian

USA . 3,826 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,826

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,663 parts In-Stock

1+ parts

$13.231

100+ parts

-

1k+ parts

-

10k+ parts

-

4,663

$13.231

-

-

-

Microchip USA

USA . 1,269 parts In-Stock

1+ parts

$52.580

100+ parts

$51.830

1k+ parts

$51.460

10k+ parts

$51.080

1,269

$52.580

$51.830

$51.460

$51.080

Parana Technologies

USA . 1,944 parts In-Stock

1+ parts

$68.340

100+ parts

-

1k+ parts

-

10k+ parts

-

1,944

$68.340

-

-

-

DigiPath Technology Company

USA . 866 parts In-Stock

1+ parts

$75.251

100+ parts

-

1k+ parts

-

10k+ parts

-

866

$75.251

-

-

-

ChromeModa Solutions

Germany . 1,426 parts In-Stock

1+ parts

$76.787

100+ parts

$62.965

1k+ parts

-

10k+ parts

-

1,426

$76.787

$62.965

-

-

IDEA Electronic Components Group

UK . 70 parts In-Stock

1+ parts

$76.787

100+ parts

$72.948

1k+ parts

$69.108

10k+ parts

-

70

$76.787

$72.948

$69.108

-

iodParts Technologies Inc.

India . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,000

-

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Overview

Unlock endless possibilities with the Texas Instruments MSP430F2618TZCA microcontroller, a cutting-edge solution that offers unparalleled quality and reliability. Perfect for a wide range of applications, this innovative device boasts advanced features like DAC and ADC channels, DMA support, and multiple connectivity options. Experience seamless operation and maximum performance with the MSP430 family, designed to elevate your projects to new heights. Invest in the future with Texas Instruments and revolutionize your electronics today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the microcontroller lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and space-efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V allows for flexibility in power input options.

On Chip Data RAM Width: 16

With a data RAM width of 16, the microcontroller can handle larger amounts of data efficiently.

Package Shape: SQUARE

The square package shape makes it easy to integrate the microcontroller into various designs.

Bit Size: 16

A 16-bit architecture allows for enhanced processing capabilities and performance.

DAC Channels: YES

Having DAC channels enables the microcontroller to convert digital signals into analog output.

No. of Terminals: 113

With 113 terminals, the microcontroller offers plenty of connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style provides a compact form factor, making it suitable for space-constrained applications.

Minimum Supply Voltage: 3.3 V

The low minimum supply voltage of 3.3V helps in minimizing power consumption.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, the microcontroller can withstand harsh environmental conditions.

Technical Specifications

Microcontrollers MSP430F2618TZCA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

RAM Words:

4096

ROM Words:

118784

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, DMA(3), TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2618TZCA Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20