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MSP430F2617TZCA

Texas Instruments

MSP430F2617TZCA by Texas Instruments

MSP430F2617TZCA by Texas Instruments is a 16-bit microcontroller with 8KB RAM and 94,208 ROM words. It features 2-Ch 12-Bit DACs, 8-Ch 12-Bit ADCs, and low power mode. Ideal for industrial applications requiring high-speed processing up to 16MHz with connectivity options like I2C, SPI, UART.

Median Price

$24.080

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,545 parts In-Stock

1+ parts

$14.007

100+ parts

$12.235

1k+ parts

$8.438

10k+ parts

-

2,545

$14.007

$12.235

$8.438

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Mouser Electronics

USA . 630 parts In-Stock

1+ parts

$24.080

100+ parts

$16.850

1k+ parts

$16.830

10k+ parts

-

630

$24.080

$16.850

$16.830

-

DigiKey

USA . 190 parts In-Stock

1+ parts

$24.080

100+ parts

$16.844

1k+ parts

-

10k+ parts

-

190

$24.080

$16.844

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 504 parts In-Stock

1+ parts

$11.951

100+ parts

-

1k+ parts

-

10k+ parts

-

504

$11.951

-

-

-

Vyrian

USA . 2,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,390

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,841 parts In-Stock

1+ parts

$11.322

100+ parts

-

1k+ parts

-

10k+ parts

-

1,841

$11.322

-

-

-

Microchip USA

USA . 2,416 parts In-Stock

1+ parts

$35.220

100+ parts

$34.720

1k+ parts

$34.470

10k+ parts

$34.220

2,416

$35.220

$34.720

$34.470

$34.220

Parana Technologies

USA . 34 parts In-Stock

1+ parts

$38.164

100+ parts

-

1k+ parts

-

10k+ parts

-

34

$38.164

-

-

-

DigiPath Technology Company

USA . 383 parts In-Stock

1+ parts

$42.023

100+ parts

-

1k+ parts

-

10k+ parts

-

383

$42.023

-

-

-

ChromeModa Solutions

Germany . 65 parts In-Stock

1+ parts

$42.881

100+ parts

$35.162

1k+ parts

-

10k+ parts

-

65

$42.881

$35.162

-

-

IDEA Electronic Components Group

UK . 50 parts In-Stock

1+ parts

$42.881

100+ parts

$40.737

1k+ parts

$38.593

10k+ parts

-

50

$42.881

$40.737

$38.593

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QUARKTWIN TECHNOLOGY LTD

USA . 9,767 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,767

-

-

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2617TZCA microcontroller. Designed with precision and reliability in mind, this versatile device is perfect for a wide range of applications in the industrial sector. With its advanced features and cutting-edge technology, the MSP430F2617TZCA offers customers unparalleled performance and efficiency. Experience seamless connectivity and enhanced functionality with this top-of-the-line microcontroller from a trusted industry leader. Elevate your projects to new heights with the Texas Instruments MSP430F2617TZCA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for portable and long-lasting applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power input options and compatibility with various power sources.

DAC Channels: YES

Having DAC (Digital-to-Analog Converter) channels allows the microcontroller to convert digital signals into analog signals, enabling it to interface with analog devices and sensors.

ROM Words: 94208

With a large ROM (Read-Only Memory) capacity of 94208 words, the microcontroller can store a significant amount of code and program data for complex applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller enables fast and efficient processing of instructions, making it suitable for high-speed applications.

Connectivity: I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

The multiple connectivity options such as I2C, IRDA, LIN, SPI, and UART enable the microcontroller to easily communicate with a wide range of external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F2617TZCA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

48

No. of Terminals:

113

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

RAM Words:

8

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, DMA(3), TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2617TZCA Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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