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MSP430F2616TZQW

Texas Instruments

MSP430F2616TZQW by Texas Instruments

MSP430F2616TZQW by Texas Instruments is a 16-bit microcontroller with 4096 bytes of RAM and 94208 ROM words. It features 8 ADC channels, 2 DAC channels, and operates at a max clock frequency of 16 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$6.410

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,295 parts In-Stock

1+ parts

$6.410

100+ parts

$6.280

1k+ parts

$6.150

10k+ parts

-

2,295

$6.410

$6.280

$6.150

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 15 parts In-Stock

1+ parts

$7.827

100+ parts

-

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-

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15

$7.827

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Vyrian

USA . 5,998 parts In-Stock

1+ parts

-

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5,998

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Digiode

USA . 1,882 parts In-Stock

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1,882

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Electronics Depot

USA . 157 parts In-Stock

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-

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157

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Distributors (Availability)

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AZTECH Wire

Italy . 533 parts In-Stock

1+ parts

$5.294

100+ parts

-

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-

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533

$5.294

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One Stop Electronics

USA . 250 parts In-Stock

1+ parts

$10.000

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-

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250

$10.000

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Parana Technologies

USA . 1,614 parts In-Stock

1+ parts

$65.962

100+ parts

-

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1,614

$65.962

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ChromeModa Solutions

Germany . 2,024 parts In-Stock

1+ parts

$74.115

100+ parts

$60.774

1k+ parts

-

10k+ parts

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2,024

$74.115

$60.774

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IDEA Electronic Components Group

UK . 750 parts In-Stock

1+ parts

$74.115

100+ parts

$70.409

1k+ parts

$66.704

10k+ parts

-

750

$74.115

$70.409

$66.704

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Corphita

USA . 4,080 parts In-Stock

1+ parts

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4,080

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DigiPath Technology Company

USA . 2,194 parts In-Stock

1+ parts

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100+ parts

$66.822

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2,194

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$66.822

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Microchip USA

USA . 452 parts In-Stock

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452

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F2616TZQW microcontroller, a high-quality product designed to meet your every need. With a wide range of applications in various industries, this powerful device offers unmatched value and benefits. Texas Instruments, known for its reliable and innovative technology, guarantees superior performance and efficiency. Experience seamless connectivity, precision, and low power consumption like never before. Upgrade your projects with the MSP430F2616TZQW and witness the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating a wide range of applications.

Bit Size: 16

Provides a good balance between performance and cost, suitable for a wide range of applications.

ADC Channels: YES

Enables analog-to-digital conversion, allowing for interfacing with analog sensors and signals.

DMA Channels: YES

Supports Direct Memory Access, enhancing data transfer efficiency and reducing CPU overhead.

ROM Words: 94208

Ample on-chip storage for program and data, allowing for complex applications to be executed efficiently.

Maximum Clock Frequency: 16 MHz

Offers high processing speed, enabling quick execution of tasks and real-time operations.

Connectivity: I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Provides versatile communication options, allowing for easy integration with various devices and systems.

Low Power Mode: YES

Supports energy efficiency, prolonging battery life in battery-powered applications.

Technical Specifications

Microcontrollers MSP430F2616TZQW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

64

No. of Terminals:

113

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, DMA(3), TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2616TZQW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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