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MSP430F2616TZCA

Texas Instruments

MSP430F2616TZCA by Texas Instruments

MSP430F2616TZCA by Texas Instruments is a 16-bit microcontroller with 48 I/O lines, 4096 bytes of RAM, and 94208 ROM words. It features 2 DAC channels, 8 ADC channels, and operates at a max clock frequency of 16 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$20.840

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,305 parts In-Stock

1+ parts

$12.960

100+ parts

$11.320

1k+ parts

$7.807

10k+ parts

-

1,305

$12.960

$11.320

$7.807

-

Mouser Electronics

USA . 260 parts In-Stock

1+ parts

$20.840

100+ parts

$14.460

1k+ parts

$14.450

10k+ parts

-

260

$20.840

$14.460

$14.450

-

DigiKey

USA . 240 parts In-Stock

1+ parts

$20.840

100+ parts

$14.460

1k+ parts

-

10k+ parts

-

240

$20.840

$14.460

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,033 parts In-Stock

1+ parts

$12.302

100+ parts

-

1k+ parts

-

10k+ parts

-

1,033

$12.302

-

-

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Vyrian

USA . 5,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,038

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,642 parts In-Stock

1+ parts

$11.655

100+ parts

-

1k+ parts

-

10k+ parts

-

4,642

$11.655

-

-

-

Microchip USA

USA . 2,848 parts In-Stock

1+ parts

$46.370

100+ parts

$45.710

1k+ parts

$45.370

10k+ parts

$45.040

2,848

$46.370

$45.710

$45.370

$45.040

Parana Technologies

USA . 2,233 parts In-Stock

1+ parts

$53.014

100+ parts

-

1k+ parts

-

10k+ parts

-

2,233

$53.014

-

-

-

DigiPath Technology Company

USA . 538 parts In-Stock

1+ parts

$58.375

100+ parts

$53.705

1k+ parts

-

10k+ parts

-

538

$58.375

$53.705

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-

ChromeModa Solutions

Germany . 1,688 parts In-Stock

1+ parts

$59.566

100+ parts

$48.844

1k+ parts

-

10k+ parts

-

1,688

$59.566

$48.844

-

-

IDEA Electronic Components Group

UK . 1,658 parts In-Stock

1+ parts

$59.566

100+ parts

$56.588

1k+ parts

$53.609

10k+ parts

-

1,658

$59.566

$56.588

$53.609

-

Overview

Unlock endless possibilities with the Texas Instruments MSP430F2616TZCA microcontroller! From smart home devices to industrial automation, this versatile chip offers unparalleled quality and reliability. With advanced features like DAC and ADC channels, low power modes, and a wide range of connectivity options, this microcontroller is the perfect choice for your next project. Trust in Texas Instruments' legacy of excellence and innovation to bring your ideas to life with the MSP430F2616TZCA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a variety of systems.

ROM Words: 94208

Large ROM capacity allows for storing a significant amount of program data and code, making the microcontroller versatile and capable of handling complex tasks.

ADC Channels: YES

Presence of Analog to Digital Converter channels enables the microcontroller to measure and convert analog signals to digital data, making it suitable for sensor applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and quick execution of instructions, making the microcontroller a high-performance choice for various applications.

Connectivity: I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Multiple connectivity options enable easy integration with other devices and systems, enhancing the versatility and communication capabilities of the microcontroller.

Technical Specifications

Microcontrollers MSP430F2616TZCA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

48

No. of Terminals:

113

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, DMA(3), TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2616TZCA Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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