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MSP430F2616TPNR

Texas Instruments

MSP430F2616TPNR by Texas Instruments

MSP430F2616TPNR by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 16 MHz. It features 8 KB RAM, 94,208 ROM words, and connectivity options like I2C, SPI, and UART. Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

$8.526

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,881 parts In-Stock

1+ parts

$8.526

100+ parts

$7.447

1k+ parts

$5.136

10k+ parts

-

4,881

$8.526

$7.447

$5.136

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,102 parts In-Stock

1+ parts

$8.100

100+ parts

-

1k+ parts

-

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3,102

$8.100

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-

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Vyrian

USA . 8,845 parts In-Stock

1+ parts

-

100+ parts

-

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8,845

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,124 parts In-Stock

1+ parts

$7.673

100+ parts

-

1k+ parts

-

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2,124

$7.673

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AZTECH Wire

Italy . 605 parts In-Stock

1+ parts

$14.800

100+ parts

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605

$14.800

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Microchip USA

USA . 2,624 parts In-Stock

1+ parts

$19.320

100+ parts

$19.040

1k+ parts

$18.900

10k+ parts

$18.770

2,624

$19.320

$19.040

$18.900

$18.770

Parana Technologies

USA . 96 parts In-Stock

1+ parts

$65.409

100+ parts

-

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96

$65.409

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DigiPath Technology Company

USA . 2,348 parts In-Stock

1+ parts

$72.023

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-

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2,348

$72.023

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ChromeModa Solutions

Germany . 4,239 parts In-Stock

1+ parts

$73.493

100+ parts

$60.264

1k+ parts

-

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4,239

$73.493

$60.264

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IDEA Electronic Components Group

UK . 1,839 parts In-Stock

1+ parts

$73.493

100+ parts

$69.818

1k+ parts

$66.144

10k+ parts

-

1,839

$73.493

$69.818

$66.144

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Overview

Unlock the power of innovation with Texas Instruments' MSP430F2616TPNR microcontroller. This cutting-edge device offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers exceptional performance and efficiency. Experience the value and benefits of Texas Instruments' industry-leading technology with the MSP430F2616TPNR, providing customers with a competitive edge in today's fast-paced market. Elevate your projects to new heights with this top-of-the-line microcontroller from a trusted manufacturer in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the microcontroller lightweight and durable, ideal for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6 V provides flexibility in power supply options for different projects.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility with other MSP430 devices and access to a wide range of resources and support.

ADC Channels: YES

The presence of ADC channels allows for analog input signals to be converted into digital data, essential for many sensor-based applications.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16 MHz enables fast processing speeds, suitable for demanding real-time applications.

Connectivity: I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

With multiple connectivity options including I2C, IRDA, LIN, SPI, UART, and USCI, this microcontroller can easily communicate with a variety of external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F2616TPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

64

No. of Terminals:

80

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, DMA(3), TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2616TPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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