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MSP430F2616TPN

Texas Instruments

MSP430F2616TPN by Texas Instruments

MSP430F2616TPN by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 16 MHz. It features 8KB RAM, 94KB ROM, and ADC/DAC channels for industrial applications requiring low power consumption and high-speed processing.

Median Price

$9.462

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,618 parts In-Stock

1+ parts

$10.231

100+ parts

$8.936

1k+ parts

$6.163

10k+ parts

-

1,618

$10.231

$8.936

$6.163

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Verical

USA . 420 parts In-Stock

1+ parts

-

100+ parts

$10.063

1k+ parts

$9.100

10k+ parts

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420

-

$10.063

$9.100

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Arrow

USA . 357 parts In-Stock

1+ parts

-

100+ parts

-

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$7.196

10k+ parts

-

357

-

-

$7.196

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Rochester

USA . 346 parts In-Stock

1+ parts

-

100+ parts

$8.860

1k+ parts

$7.930

10k+ parts

$7.460

346

-

$8.860

$7.930

$7.460

DigiKey

USA . 346 parts In-Stock

1+ parts

-

100+ parts

$11.660

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-

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346

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$11.660

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Chip1Stop

Japan . 119 parts In-Stock

1+ parts

-

100+ parts

-

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$7.430

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119

-

-

$7.430

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,490 parts In-Stock

1+ parts

$8.132

100+ parts

-

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2,490

$8.132

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Vyrian

USA . 3,372 parts In-Stock

1+ parts

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3,372

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DigiKey Marketplace

USA . 625 parts In-Stock

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625

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,041 parts In-Stock

1+ parts

$7.704

100+ parts

-

1k+ parts

-

10k+ parts

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3,041

$7.704

-

-

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Parana Technologies

USA . 652 parts In-Stock

1+ parts

$21.417

100+ parts

$1,988.890

1k+ parts

$19.275

10k+ parts

-

652

$21.417

$1,988.890

$19.275

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DigiPath Technology Company

USA . 777 parts In-Stock

1+ parts

$23.583

100+ parts

$21.696

1k+ parts

-

10k+ parts

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777

$23.583

$21.696

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ChromeModa Solutions

Germany . 6,308 parts In-Stock

1+ parts

$24.064

100+ parts

$19.732

1k+ parts

-

10k+ parts

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6,308

$24.064

$19.732

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IDEA Electronic Components Group

UK . 211 parts In-Stock

1+ parts

$24.064

100+ parts

$22.861

1k+ parts

$21.658

10k+ parts

-

211

$24.064

$22.861

$21.658

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Overview

Experience the power and reliability of Texas Instruments with the MSP430F2616TPN microcontroller. This versatile device offers unparalleled performance in a compact package, making it perfect for a wide range of applications. Whether you need precision control in industrial settings or efficient data processing in consumer electronics, this microcontroller delivers. With low power consumption and advanced features like DAC and ADC channels, the MSP430F2616TPN provides exceptional value and functionality. Trust Texas Instruments to deliver cutting-edge technology that meets your needs, every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power requirements and compatibility with different voltage sources.

On Chip Data RAM Width: 8

A wider data RAM width of 8 allows for faster data processing and storage, enhancing the performance of the microcontroller.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog components and devices, expanding its versatility and functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller ensures efficient and optimized performance, making it suitable for a wide range of applications.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16 MHz allows for fast data processing and execution speed, enhancing the overall performance of the microcontroller.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to convert analog signals into digital data, making it suitable for sensor interfacing and data acquisition applications.

Technical Specifications

Microcontrollers MSP430F2616TPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

64

No. of Terminals:

80

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, DMA(3), TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2616TPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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