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MSP430F249TRGCT

Texas Instruments

MSP430F249TRGCT by Texas Instruments

MSP430F249TRGCT by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 16 MHz. Featuring 48 I/O lines, it offers 8 ADC channels and low power mode for industrial applications requiring high-speed processing and connectivity via UART, SPI, and I2C interfaces.

Median Price

$7.668

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 18,500 parts In-Stock

1+ parts

$8.799

100+ parts

$7.173

1k+ parts

$4.782

10k+ parts

-

18,500

$8.799

$7.173

$4.782

-

Rochester

USA . 15,818 parts In-Stock

1+ parts

-

100+ parts

$5.980

1k+ parts

$5.350

10k+ parts

$5.030

15,818

-

$5.980

$5.350

$5.030

DigiKey

USA . 15,818 parts In-Stock

1+ parts

-

100+ parts

$7.860

1k+ parts

-

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15,818

-

$7.860

-

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Verical

USA . 15,806 parts In-Stock

1+ parts

-

100+ parts

$7.475

1k+ parts

$6.688

10k+ parts

$6.287

15,806

-

$7.475

$6.688

$6.287

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,240 parts In-Stock

1+ parts

$6.308

100+ parts

-

1k+ parts

-

10k+ parts

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3,240

$6.308

-

-

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Vyrian

USA . 7,502 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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7,502

-

-

-

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Chip Stock

USA . 3,481 parts In-Stock

1+ parts

-

100+ parts

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3,481

-

-

-

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LIBRA Elektronik GmbH

Germany . 56 parts In-Stock

1+ parts

-

100+ parts

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56

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Semi Source

USA . 34 parts In-Stock

1+ parts

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100+ parts

-

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34

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,784 parts In-Stock

1+ parts

$5.976

100+ parts

-

1k+ parts

-

10k+ parts

-

2,784

$5.976

-

-

-

Parana Technologies

USA . 701 parts In-Stock

1+ parts

$70.971

100+ parts

-

1k+ parts

-

10k+ parts

-

701

$70.971

-

-

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ChromeModa Solutions

Germany . 5,939 parts In-Stock

1+ parts

$79.743

100+ parts

$65.389

1k+ parts

-

10k+ parts

-

5,939

$79.743

$65.389

-

-

IDEA Electronic Components Group

UK . 598 parts In-Stock

1+ parts

$79.743

100+ parts

$75.756

1k+ parts

$71.769

10k+ parts

-

598

$79.743

$75.756

$71.769

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iodParts Technologies Inc.

India . 8,016 parts In-Stock

1+ parts

-

100+ parts

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8,016

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DigiPath Technology Company

USA . 1,755 parts In-Stock

1+ parts

-

100+ parts

$71.896

1k+ parts

-

10k+ parts

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1,755

-

$71.896

-

-

Overview

Experience the power of innovation with the Texas Instruments MSP430F249TRGCT microcontroller. A leader in the industry, Texas Instruments delivers a top-quality product that is perfect for a wide range of applications. From smart devices to industrial control systems, this microcontroller offers unmatched performance and reliability. With low power consumption and advanced features like multiple peripherals and connectivity options, the MSP430F249TRGCT provides exceptional value and flexibility for all your project needs. Upgrade your designs today with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy integration onto PCBs, making it suitable for compact designs and mass production.

Maximum Supply Voltage: 3.6 V

Wide voltage range allows for flexibility in power supply options and compatibility with various applications.

On Chip Data RAM Width: 8

Having a wide data RAM width of 8 enhances data processing capabilities and overall performance.

Package Shape: SQUARE

Square package shape helps in efficient space utilization and ease of placement on the PCB.

Bit Size: 16

16-bit architecture provides a good balance between processing power and cost-effectiveness.

Power Supplies (V): 2/3.3

Dual voltage support provides compatibility with different power sources for increased versatility.

No. of Terminals: 64

Plenty of terminals allow for versatile connectivity options and expansion capabilities.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Thin profile chip carrier package style enables compact designs and efficient heat dissipation.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 105 °C

High maximum operating temperature makes the product suitable for industrial applications with harsh conditions.

CPU Family: MSP430

Belonging to the MSP430 family ensures compatibility with existing designs and tools for ease of integration.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function reliably in extreme cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures reliable electrical connections and resistance to corrosion.

ADC Channels: YES

Integrated ADC channels enable analog signal conversion, making the product suitable for sensor interfacing.

Terminal Position: QUAD

Quad terminal position provides stable mounting and ease of soldering for reliable connections.

ROM Words: 61440

Large ROM capacity allows for storing firmware and program codes, enabling complex applications to run smoothly.

Maximum Seated Height: 1 mm

Low seated height facilitates slim profile designs and minimizes PCB space occupation.

RAM Words: 2

Having 2 RAM words provides temporary storage for efficient data processing and multitasking.

Width: 9 mm

Compact width dimension helps in space-constrained designs without sacrificing performance.

Boundary Scan: YES

Boundary scan support enables easy debugging and testing of connections during manufacturing and maintenance.

Peripherals: BOD, COMPARATOR, TIMER(6), WDT

Rich set of peripherals like BOD, comparators, timers, and watchdog timer enhance system functionality and performance.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast data processing and real-time operation in demanding applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering and thermal stability during manufacturing processes.

Length: 9 mm

Compact length dimension facilitates space-efficient placement on PCBs and reduces overall product size.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions and extended lifetime.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller configuration provides efficient data processing and low power consumption.

No. of Timers: 6

6 timers offer versatile timing functions for task scheduling, event triggering, and system control.

RAM Bytes: 2048

Ample RAM capacity enables efficient data storage and manipulation for various computational tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with modern digital systems.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures safer handling during manufacturing and disposal.

Analog To Digital Convertors: 8-Ch 12-Bit

Eight channels of 12-bit ADC provide high-resolution analog signal conversion for accurate sensor data acquisition.

Nominal Supply Voltage: 3 V

Stable 3V nominal supply voltage ensures consistent operation and compatibility with standard power sources.

No. of Serial I/Os: 4

Four serial I/O interfaces enable communication with external devices, peripherals, and networks for data exchange.

PWM Channels: YES

Integrated PWM channels facilitate precise control of motor speeds, LED brightness, and other analog applications.

Connectivity: I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Multiple connectivity options like I2C, LIN, SPI, and UART support various communication protocols for seamless integration.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates, configuration changes, and customization of system functionalities.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and compact PCB layouts for space-efficient designs.

Format: FIXED POINT

Fixed-point format simplifies numerical calculations, reduces computational overhead, and enhances real-time processing speed.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard manufacturing and storage environments.

Speed: 16 rpm

Operational speed of 16 rpm allows for efficient task execution, data processing, and system response in real-time applications.

Low Power Mode: YES

Low-power mode capability enables energy-efficient operation, prolonging battery life and reducing overall power consumption.

On Chip Program ROM Width: 8

Having ROM program width of 8 enhances program storage capacity and supports larger software applications.

No. of I/O Lines: 48

Abundance of I/O lines offers versatile interfacing options with external devices, sensors, and peripherals for data exchange.

Technical Specifications

Microcontrollers MSP430F249TRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR, TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F249TRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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