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MSP430F249TPM

Texas Instruments

MSP430F249TPM by Texas Instruments

MSP430F249TPM by Texas Instruments is a 16-bit microcontroller with a max clock frequency of 16 MHz. It features 48 I/O lines, 8-channel 12-bit ADC, and connectivity options such as I2C, SPI, UART. This microcontroller is commonly used in industrial applications due to its low power mode and wide temperature range (-40°C to +105°C).

Median Price

$10.518

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 151,522 parts In-Stock

1+ parts

$8.799

100+ parts

$7.173

1k+ parts

$4.782

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-

151,522

$8.799

$7.173

$4.782

-

Arrow

USA . 19 parts In-Stock

1+ parts

$10.277

100+ parts

$6.732

1k+ parts

$6.259

10k+ parts

$6.168

19

$10.277

$6.732

$6.259

$6.168

Verical

USA . 19 parts In-Stock

1+ parts

$10.277

100+ parts

-

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-

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19

$10.277

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DigiKey

USA . 79 parts In-Stock

1+ parts

$10.760

100+ parts

$7.830

1k+ parts

$6.636

10k+ parts

$6.520

79

$10.760

$7.830

$6.636

$6.520

Mouser Electronics

USA . 9 parts In-Stock

1+ parts

$10.760

100+ parts

$7.020

1k+ parts

$6.630

10k+ parts

$6.510

9

$10.760

$7.020

$6.630

$6.510

Chip1Stop

Japan . 61 parts In-Stock

1+ parts

$11.876

100+ parts

$8.278

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-

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61

$11.876

$8.278

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 850 parts In-Stock

1+ parts

$7.469

100+ parts

-

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850

$7.469

-

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$7.679

100+ parts

-

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870

$7.679

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Chip Stock

USA . 31,500 parts In-Stock

1+ parts

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31,500

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Vyrian

USA . 3,346 parts In-Stock

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3,346

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ComSIT Distribution GmbH

Germany . 259 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 40 parts In-Stock

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40

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EMSNET

USA . 7 parts In-Stock

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7

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Distributors (Availability)

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Ampacity Inc.

Singapore . 25,175 parts In-Stock

1+ parts

$5.210

100+ parts

-

1k+ parts

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25,175

$5.210

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Corphita

USA . 2,165 parts In-Stock

1+ parts

$7.076

100+ parts

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2,165

$7.076

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$7.526

100+ parts

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1k+ parts

$7.225

10k+ parts

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1,000

$7.526

-

$7.225

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Continental Prestige Electronics

USA . 2,697 parts In-Stock

1+ parts

$7.679

100+ parts

-

1k+ parts

-

10k+ parts

$7.526

2,697

$7.679

-

-

$7.526

Microchip USA

USA . 2,763 parts In-Stock

1+ parts

$32.170

100+ parts

$31.710

1k+ parts

$31.480

10k+ parts

$31.250

2,763

$32.170

$31.710

$31.480

$31.250

Parana Technologies

USA . 2,238 parts In-Stock

1+ parts

$59.968

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2,238

$59.968

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Corohmni

South Africa . 186 parts In-Stock

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$63.937

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186

$63.937

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ChromeModa Solutions

Germany . 6,892 parts In-Stock

1+ parts

$67.380

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$55.252

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6,892

$67.380

$55.252

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IDEA Electronic Components Group

UK . 1,525 parts In-Stock

1+ parts

$67.380

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$64.011

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$60.642

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1,525

$67.380

$64.011

$60.642

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Lixinc

USA . 14,420 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,175 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,562 parts In-Stock

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2,562

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DigiPath Technology Company

USA . 1,256 parts In-Stock

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$60.750

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1,256

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$60.750

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Metaverse IC Inc.

Canada . 565 parts In-Stock

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565

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Argo Parts USA

USA . 497 parts In-Stock

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497

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Overview

Experience unmatched performance and reliability with the MSP430F249TPM microcontroller by Texas Instruments - a game-changer in the world of microcontrollers. Designed to meet the highest industry standards, this cutting-edge device offers endless possibilities for your projects. From smart home automation to wearable technology, the MSP430F249TPM is the ultimate solution. With its compact design and advanced features, it provides exceptional value, enabling you to create innovative and efficient solutions. Say goodbye to limitations and unlock the full potential of your designs with the MSP430F249TPM. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides a durable and cost-effective solution, making this microcontroller suitable for various applications.

Surface Mount: YES

With surface mount capability, this microcontroller enables easy integration onto printed circuit boards, simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows the microcontroller to be used in systems where higher voltage levels are required, adding versatility to its applications.

On Chip Data RAM Width: 8

The 8-bit data RAM width provides efficient data processing capabilities, allowing the microcontroller to handle complex tasks effectively.

Package Shape: SQUARE

The square package shape facilitates easier mounting and placement in space-constrained environments, providing flexibility in design.

Bit Size: 16

With a 16-bit architecture, this microcontroller offers enhanced computational power and accuracy, making it suitable for demanding tasks.

No. of Terminals: 64

The large number of terminals allows for versatile connectivity options, enabling the microcontroller to interface with various external devices and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style enables efficient heat dissipation and compact design, making it an excellent choice for space-constrained applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures efficient power consumption, making this microcontroller suitable for battery-powered or low-power applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, expanding its application possibilities.

CPU Family: MSP430

The MSP430 CPU family offers excellent performance and low-power capabilities, making this microcontroller a reliable choice for various embedded applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this microcontroller to operate reliably in extreme temperature conditions, making it suitable for outdoor or industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold as terminal finish ensures excellent conductivity and corrosion resistance, enhancing the microcontroller's long-term reliability.

ADC Channels: YES

With the availability of ADC channels, this microcontroller can accurately convert analog signals to digital, making it suitable for applications requiring precise measurement and monitoring.

Terminal Position: QUAD

The quad terminal position enables easy assembly and soldering onto the PCB, simplifying the manufacturing process and reducing production costs.

ROM Words: 61440

The generous ROM word size provides ample storage capacity for program code, allowing for the implementation of complex algorithms and software functionalities.

Maximum Seated Height: 1.6 mm

The low maximum seated height ensures the microcontroller can be used in compact designs without compromising the overall device profile.

RAM Words: 2

Although limited, the 2 RAM words provide some temporary data storage capacity for efficient operation and data manipulation.

Width: 10 mm

With a compact width dimension, this microcontroller can be easily integrated into space-constrained designs, enhancing overall system flexibility.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging during manufacturing, reducing production time and ensuring high-quality end products.

Peripherals: BOD, COMPARATOR, TIMER(6), WDT

The inclusion of various peripherals, such as brownout detection, comparators, timers, and watchdog timers, expands the microcontroller's functionality, enabling it to interface with external devices and perform diverse tasks.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency facilitates fast execution of instructions, enabling the microcontroller to handle time-critical tasks effectively.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during the manufacturing process, preventing solder joint failures and enhancing product durability.

Length: 10 mm

With a compact length dimension, this microcontroller can be easily integrated into space-constrained designs, enhancing overall system flexibility.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this microcontroller operates reliably within a wide temperature range, making it suitable for demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a microcontroller with a RISC architecture, this product offers high-performance computing capabilities while maintaining low power consumption, making it ideal for embedded systems.

No. of Timers: 6

The presence of six timers allows the microcontroller to handle precise timing and event management, providing versatile timing control capabilities for different applications.

RAM Bytes: 2048

With ample RAM byte capacity available, this microcontroller can efficiently handle data storage and manipulation, supporting the implementation of complex algorithms and data-intensive tasks.

Technology: CMOS

The use of CMOS technology provides low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process, ensuring reliable electrical connections and reducing manufacturing costs.

Analog To Digital Convertors: 8-Ch 12-Bit

With eight 12-bit analog-to-digital converters (ADCs), this microcontroller enables high-resolution analog signal acquisition, making it suitable for applications requiring precise analog measurements.

Nominal Supply Voltage: 3 V

The 3-volt nominal supply voltage ensures compatibility with a wide range of power supply sources, offering flexibility in selecting suitable power solutions.

No. of Serial I/Os: 4

With four serial input/output interfaces, this microcontroller can communicate with multiple external devices simultaneously, ensuring seamless integration into complex systems.

PWM Channels: YES

The availability of PWM channels enables this microcontroller to generate precise and adjustable analog-like signals, making it ideal for motor control, lighting control, and other applications requiring precise voltage regulation.

Connectivity: I2C, IRDA, LIN, SPI(2), UART, USCI(2)

With multiple connectivity options, including I2C, IRDA, LIN, SPI, UART, and USCI, this microcontroller can interface with various external devices, expanding its application possibilities.

ROM Programmability: FLASH

The programmability of the ROM using flash technology allows for easy and convenient updating or modification of program code, enhancing the microcontroller's flexibility and adaptability.

Terminal Pitch: 0.5 mm

With a compact terminal pitch of 0.5 mm, this microcontroller can be easily mounted on densely populated PCBs without sacrificing reliable electrical connections.

Format: FIXED POINT

The fixed-point format utilized by this microcontroller enables efficient and precise numerical calculations, making it suitable for applications requiring accurate mathematical computations.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this microcontroller can withstand moderate levels of moisture exposure during storage and assembly, ensuring its reliability under normal manufacturing conditions.

Speed: 16 rpm

With a speed of 16 revolutions per minute, this microcontroller can handle time-critical tasks efficiently, making it suitable for real-time applications.

Low Power Mode: YES

The availability of a low-power mode allows this microcontroller to conserve energy when idle or in standby mode, extending battery life in portable or battery-powered devices.

On Chip Program ROM Width: 8

The 8-bit program ROM width provides sufficient storage capacity for program code, enabling the microcontroller to execute complex software functions and algorithms.

No. of I/O Lines: 48

With 48 input/output lines, this microcontroller offers versatile connectivity and interfacing options, enhancing its capability to interact with external devices and sensors.

Technical Specifications

Microcontrollers MSP430F249TPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR, TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F249TPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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