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MSP430F2481TRGCR

Texas Instruments

MSP430F2481TRGCR by Texas Instruments

MSP430F2481TRGCR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 16 MHz. It features 4KB RAM, FLASH ROM programmability, and low power mode suitable for industrial applications requiring high-speed processing and connectivity via I2C, LIN, SPI, UART interfaces.

Median Price

$7.782

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,020 parts In-Stock

1+ parts

$6.403

100+ parts

$5.220

1k+ parts

$3.480

10k+ parts

-

8,020

$6.403

$5.220

$3.480

-

DigiKey

USA . 5 parts In-Stock

1+ parts

$9.160

100+ parts

-

1k+ parts

-

10k+ parts

$5.357

5

$9.160

-

-

$5.357

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,197 parts In-Stock

1+ parts

$6.083

100+ parts

-

1k+ parts

-

10k+ parts

-

3,197

$6.083

-

-

-

Vyrian

USA . 7,157 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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7,157

-

-

-

-

Bristol Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,500

-

-

-

-

Velocity Electronics

USA . 2,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,380

-

-

-

-

Cyclops Electronics Ltd

UK . 200 parts In-Stock

1+ parts

-

100+ parts

-

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200

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,987 parts In-Stock

1+ parts

$5.763

100+ parts

-

1k+ parts

-

10k+ parts

-

3,987

$5.763

-

-

-

Microchip USA

USA . 1,266 parts In-Stock

1+ parts

$28.280

100+ parts

$28.100

1k+ parts

$28.010

10k+ parts

$27.930

1,266

$28.280

$28.100

$28.010

$27.930

Parana Technologies

USA . 2,189 parts In-Stock

1+ parts

$30.820

100+ parts

-

1k+ parts

$69.415

10k+ parts

-

2,189

$30.820

-

$69.415

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DigiPath Technology Company

USA . 2,300 parts In-Stock

1+ parts

$33.936

100+ parts

-

1k+ parts

-

10k+ parts

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2,300

$33.936

-

-

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ChromeModa Solutions

Germany . 6,558 parts In-Stock

1+ parts

$34.629

100+ parts

$28.396

1k+ parts

-

10k+ parts

-

6,558

$34.629

$28.396

-

-

IDEA Electronic Components Group

UK . 2,329 parts In-Stock

1+ parts

$34.629

100+ parts

$32.898

1k+ parts

$31.166

10k+ parts

-

2,329

$34.629

$32.898

$31.166

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,000

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Kepictronics

USA . 441 parts In-Stock

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441

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2481TRGCR microcontroller, designed for a wide range of applications in various industries. With Texas Instruments' reputation for high-quality products, this microcontroller offers unparalleled value and benefits to customers seeking reliable and efficient solutions. From industrial automation to consumer electronics, the MSP430F2481TRGCR delivers unmatched performance, low power consumption, and advanced peripherals, making it the ideal choice for your next project. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

On Chip Data RAM Width: 8

Having a wide data RAM width enables faster data processing and enhances the overall performance of the microcontroller.

Package Shape: SQUARE

Square package shape offers efficient use of space on the PCB and enables compact designs for end products.

Bit Size: 16

16-bit architecture provides a balance between performance and cost, making it suitable for a variety of embedded system applications.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages offers flexibility in power management and allows for compatibility with different power sources.

No. of Terminals: 64

Having a high number of terminals allows for connectivity to a wide range of external components and peripherals, increasing the versatility of the microcontroller.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Chip carrier style with a very thin profile enables compact and space-saving designs, ideal for applications with size constraints.

Minimum Supply Voltage: 1.8 V

Lower minimum supply voltage ensures efficient power consumption and extends battery life in portable or low-power applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions, suitable for industrial applications.

CPU Family: MSP430

Belonging to the MSP430 CPU family indicates a proven track record of performance, reliability, and compatibility with various development tools and software.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the microcontroller can function reliably even in cold environments, suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Having a quality terminal finish with nickel, palladium, and gold ensures longevity and reliability of the connections, reducing the risk of corrosion or oxidation.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller offers efficient and fast data processing capabilities, making it suitable for real-time applications and high-performance embedded systems.

RAM Bytes: 4096

Having a sufficient amount of RAM allows for efficient data storage and manipulation, enabling the microcontroller to handle complex tasks and run multiple applications simultaneously.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller suitable for battery-powered and noise-sensitive applications.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent and reliable performance, protecting the microcontroller from voltage fluctuations and ensuring long-term reliability.

Connectivity: I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Support for multiple connectivity options such as I2C, IRDA, LIN, SPI, UART, and USCI enables communication with a wide range of external devices and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers MSP430F2481TRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR, TIMER(6), WDT"

Trade Compliance

MSP430F2481TRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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