Loading...

MSP430F2471TRGCT

Texas Instruments

MSP430F2471TRGCT by Texas Instruments

MSP430F2471TRGCT by Texas Instruments is a 16-bit microcontroller with 48 I/O lines, 4 serial I/Os, and 6 timers. It operates at speeds up to 16 MHz, suitable for industrial applications requiring low power consumption. With on-chip flash ROM programmability and various connectivity options like I2C and SPI, it offers versatile solutions in a compact square package.

Median Price

$7.955

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 338 parts In-Stock

1+ parts

$11.110

100+ parts

$7.440

1k+ parts

$6.820

10k+ parts

-

338

$11.110

$7.440

$6.820

-

Rochester

USA . 658 parts In-Stock

1+ parts

-

100+ parts

$6.200

1k+ parts

$5.550

10k+ parts

$5.220

658

-

$6.200

$5.550

$5.220

DigiKey

USA . 658 parts In-Stock

1+ parts

-

100+ parts

$8.160

1k+ parts

-

10k+ parts

-

658

-

$8.160

-

-

Verical

USA . 408 parts In-Stock

1+ parts

-

100+ parts

$7.750

1k+ parts

$6.938

10k+ parts

$6.525

408

-

$7.750

$6.938

$6.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,631 parts In-Stock

1+ parts

$5.681

100+ parts

-

1k+ parts

-

10k+ parts

-

3,631

$5.681

-

-

-

Vyrian

USA . 7,862 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,862

-

-

-

-

DigiKey Marketplace

USA . 658 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

658

-

-

-

-

Connect4Technologies Inc.

Canada . 37 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

37

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,605 parts In-Stock

1+ parts

$5.382

100+ parts

-

1k+ parts

-

10k+ parts

-

4,605

$5.382

-

-

-

Component Stockers USA

USA . 2,412 parts In-Stock

1+ parts

$6.130

100+ parts

$5.770

1k+ parts

-

10k+ parts

-

2,412

$6.130

$5.770

-

-

Parana Technologies

USA . 2,010 parts In-Stock

1+ parts

$35.512

100+ parts

-

1k+ parts

-

10k+ parts

-

2,010

$35.512

-

-

-

ChromeModa Solutions

Germany . 2,362 parts In-Stock

1+ parts

$39.901

100+ parts

$32.719

1k+ parts

-

10k+ parts

-

2,362

$39.901

$32.719

-

-

IDEA Electronic Components Group

UK . 1,323 parts In-Stock

1+ parts

$39.901

100+ parts

$37.906

1k+ parts

$35.911

10k+ parts

-

1,323

$39.901

$37.906

$35.911

-

Perfect Parts

USA . 3,578 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,578

-

-

-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Futuretech Components

Singapore . 831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

831

-

-

-

-

DigiPath Technology Company

USA . 523 parts In-Stock

1+ parts

-

100+ parts

$35.975

1k+ parts

-

10k+ parts

-

523

-

$35.975

-

-

Overview

Unlock the power of cutting-edge technology with the MSP430F2471TRGCT by Texas Instruments, a top-quality microcontroller designed for a vast range of applications. With its advanced features and reliable performance, this product offers unmatched value to customers seeking high-speed connectivity and seamless integration. Trust in Texas Instruments' reputation for excellence and innovation, and experience the countless benefits and advantages that the MSP430F2471TRGCT brings to your projects. Elevate your designs to new heights with this exceptional microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this microcontroller suitable for mass production and compact designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options and allows for compatibility with a wide range of applications.

On Chip Data RAM Width: 8

Having a wide data RAM width enables faster data processing and efficient storage capabilities, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

The square package shape offers a balanced form factor for easy mounting and integration into various systems, optimizing space utilization.

Bit Size: 16

A higher bit size allows for greater data processing capabilities and can handle complex computations, making this microcontroller suitable for advanced applications.

Power Supplies (V): 2/3.3

Having multiple power supply options provides flexibility in system design and operation, catering to different power requirements and environments.

No. of Terminals: 64

With a large number of terminals, this microcontroller can support a wide range of input/output connections, enabling versatile interfacing with external components.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The chip carrier package style with a very thin profile offers space-saving benefits and ensures efficient thermal management, making it ideal for compact and high-performance applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for energy-efficient operation and extends the battery life in portable devices, making this microcontroller suitable for power-sensitive applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures reliable operation in harsh environments and industrial applications, enhancing the durability and ruggedness of the microcontroller.

CPU Family: MSP430

Being part of the MSP430 CPU family indicates a reliable and well-established microcontroller architecture with proven performance and features, making it a trusted choice for various applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finish materials like nickel, palladium, and gold ensures excellent conductivity, corrosion resistance, and reliability in the microcontroller's connections.

Terminal Position: QUAD

The quad terminal position offers enhanced stability and mechanical strength during soldering and assembly processes, contributing to the overall durability and reliability of the microcontroller.

ROM Words: 32768

Having a large ROM word capacity allows for storing complex programs and data, enabling versatile functionality and customization in the microcontroller's operations.

Maximum Seated Height: 1 mm

The low maximum seated height facilitates slim and compact product designs, making this microcontroller suitable for applications where space constraints are a concern.

RAM Words: 4

Although the RAM word capacity is relatively low, it can still support basic data processing and temporary storage needs, making this microcontroller suitable for simpler applications.

Width: 9 mm

With a compact width dimension, this microcontroller can be easily integrated into space-constrained designs while maintaining efficient performance and functionality.

Boundary Scan: YES

The presence of boundary scan capability allows for efficient testing and debugging of the microcontroller during production and development phases, ensuring reliable performance and quality control.

Peripherals: BOD, COMPARATOR, TIMER(6), WDT

The inclusion of various peripherals like Brown-Out Detector (BOD), Comparator, Timers, and Watchdog Timer (WDT) enhances the microcontroller's functionality and versatility for different applications.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency enables fast data processing and execution of tasks, making this microcontroller suitable for time-critical applications that require high-speed operation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures stable and reliable soldering performance during assembly, maintaining the integrity of the connections and overall product quality.

Length: 9 mm

With a compact length dimension, this microcontroller can be effectively integrated into various designs without compromising on performance or functionality, making it a versatile solution for different applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades indicates the microcontroller's reliability and robustness in harsh operating conditions, making it suitable for demanding industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture combined with microcontroller functionality provides efficient and streamlined data processing capabilities, enhancing the overall performance and energy efficiency of the microcontroller.

No. of Timers: 6

Having multiple timer modules allows for precise timing control and event scheduling, making this microcontroller suitable for applications that require complex timing operations and synchronization.

RAM Bytes: 4096

With a generous RAM byte capacity, this microcontroller can efficiently handle data storage and processing requirements, enabling robust performance and versatility in various applications.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it an efficient and reliable choice for different applications.

Terminal Form: NO LEAD

The no-lead terminal form ensures reliable electrical connections and simplifies the assembly process, leading to cost-effective production and reliable performance in the microcontroller.

Nominal Supply Voltage: 3 V

The stable nominal supply voltage provides consistent power delivery to the microcontroller, ensuring reliable and predictable performance in various operating conditions and applications.

No. of Serial I/Os: 4

The presence of multiple serial I/O interfaces allows for flexible communication with external devices and systems, enabling seamless data exchange and connectivity in diverse applications.

PWM Channels: YES

The Pulse Width Modulation (PWM) channels enable precise control of the output signals' duty cycle, making this microcontroller suitable for applications requiring accurate and efficient power management.

Connectivity: I2C, IRDA, LIN, SPI(2), UART, USCI(2)

The diverse connectivity options including I2C, IRDA, LIN, SPI, UART, and USCI interfaces facilitate seamless communication and interoperability with various devices and networks, expanding the microcontroller's compatibility and versatility.

ROM Programmability: FLASH

The Flash ROM programmability feature allows for easy and convenient firmware updates and modifications, enabling quick deployment of new features and enhancements in the microcontroller's functionality.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density mounting and efficient PCB layout, allowing for compact designs and optimized circuit board space utilization in the product.

Format: FIXED POINT

The fixed-point format ensures accurate and efficient mathematical operations, making this microcontroller suitable for applications requiring precise and consistent numerical calculations.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the microcontroller's robustness against moisture-related failures during storage and assembly, ensuring long-term reliability in various environmental conditions.

Speed: 16 rpm

The high speed rating of 16 rpm enables fast data processing and response times, making this microcontroller suitable for applications requiring rapid execution of tasks and real-time operation.

Low Power Mode: YES

The low power mode feature allows for energy-efficient operation and prolongs the battery life in portable devices, making this microcontroller suitable for battery-powered and IoT applications.

On Chip Program ROM Width: 8

With a wide on-chip program ROM width, this microcontroller can store and execute complex programs efficiently, enhancing the overall performance and functionality of the device.

Technical Specifications

Microcontrollers MSP430F2471TRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR, TIMER(6), WDT"

Trade Compliance

MSP430F2471TRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20