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MSP430F2419TZQW

Texas Instruments

MSP430F2419TZQW by Texas Instruments

MSP430F2419TZQW by Texas Instruments is a 16-bit microcontroller with 122880 ROM words and 4 RAM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With 8-Ch 12-Bit ADC channels and various peripherals like BOD, COMPARATOR, TIMER(2), WDT, it offers versatile connectivity options including I2C, IRDA, LIN, SPI, UART, USCI.

Median Price

$7.132

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,150 parts In-Stock

1+ parts

-

100+ parts

$6.340

1k+ parts

$5.670

10k+ parts

$5.340

1,150

-

$6.340

$5.670

$5.340

Verical

USA . 1,150 parts In-Stock

1+ parts

-

100+ parts

$7.925

1k+ parts

$7.088

10k+ parts

$6.675

1,150

-

$7.925

$7.088

$6.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,980 parts In-Stock

1+ parts

$6.688

100+ parts

-

1k+ parts

-

10k+ parts

-

2,980

$6.688

-

-

-

Vyrian

USA . 6,897 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,897

-

-

-

-

DigiKey Marketplace

USA . 1,150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,150

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,656 parts In-Stock

1+ parts

$6.336

100+ parts

-

1k+ parts

-

10k+ parts

-

2,656

$6.336

-

-

-

Parana Technologies

USA . 918 parts In-Stock

1+ parts

$30.203

100+ parts

-

1k+ parts

$68.204

10k+ parts

-

918

$30.203

-

$68.204

-

DigiPath Technology Company

USA . 331 parts In-Stock

1+ parts

$33.257

100+ parts

-

1k+ parts

-

10k+ parts

-

331

$33.257

-

-

-

IDEA Electronic Components Group

UK . 1,573 parts In-Stock

1+ parts

$33.936

100+ parts

$32.239

1k+ parts

$30.542

10k+ parts

-

1,573

$33.936

$32.239

$30.542

-

ChromeModa Solutions

Germany . 750 parts In-Stock

1+ parts

$33.936

100+ parts

$27.828

1k+ parts

-

10k+ parts

-

750

$33.936

$27.828

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 12,835 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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12,835

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Microchip USA

USA . 146 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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146

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Overview

Empower your designs with the MSP430F2419TZQW microcontroller by Texas Instruments, a reliable and innovative solution for your electronic projects. With top-notch quality and cutting-edge technology, this microcontroller offers unmatched performance and efficiency. Whether you're working on IoT devices, consumer electronics, or industrial applications, this versatile microcontroller delivers exceptional value, benefits, and advantages to meet all your needs. Elevate your projects to new heights with the MSP430F2419TZQW and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environmental conditions.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 3.6 V

Provides a wide operating voltage range, allowing for flexibility in power supply options.

Package Shape: SQUARE

Square shape enables compact and space-saving design layouts on the PCB.

Bit Size: 16

16-bit architecture provides higher processing capabilities and efficiency for handling complex tasks.

Power Supplies (V): 2/3.3

Dual power supply options offer versatility in different applications and voltage requirements.

No. of Terminals: 113

Ample number of terminals allow for numerous connections and interfaces with other components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with thin profile and fine pitch enhances PCB layout density and signal integrity.

Minimum Supply Voltage: 3.3 V

Ensures stable operation at a minimum voltage level, maintaining reliable performance.

Maximum Operating Temperature: 105 °C

Wide temperature range tolerance makes it suitable for industrial applications with varying operating conditions.

CPU Family: MSP430

Part of the MSP430 family known for low power consumption, high performance, and versatile features.

Minimum Operating Temperature: -40 °C

Allows for reliable operation in extreme cold environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

Provides corrosion resistance and excellent conductivity for reliable connections and signal transmission.

ADC Channels: YES

Integrated Analog to Digital Converters enable precise measurements and sensor interfacing.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB placement and soldering during assembly.

ROM Words: 122880

Large ROM size allows for storing a significant amount of program data and code.

Maximum Seated Height: 1 mm

Low profile design saves space and enables compact electronic device designs.

RAM Words: 4

Provides sufficient memory for data storage and processing tasks, enhancing system performance.

Width: 7 mm

Compact width dimension enables flexible placement on the PCB and efficient use of space.

Boundary Scan: YES

Supports boundary scan testing for efficient debugging and troubleshooting during production.

Peripherals: BOD, COMPARATOR, TIMER(2), WDT

Integrated peripherals offer added functionality for system control, monitoring, and timing functions.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast processing speed and real-time operation of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow process without damaging the microcontroller during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures reliable solder joints and PCB assembly.

Length: 7 mm

Compact length dimension provides flexibility in PCB layout and design integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions and industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency for executing instructions and tasks.

No. of Timers: 10

Multiple timers provide precise timing control for applications requiring synchronized or time-based operations.

RAM Bytes: 4096

Sufficient RAM size for data storage and temporary processing, enhancing system performance and responsiveness.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form facilitates reliable soldering connections and ease of mounting on the PCB.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple ADC channels with high resolution enable accurate analog signal conversion and processing.

Maximum Supply Current: 0.595 mA

Low supply current consumption for efficient power management and extended battery life in portable devices.

No. of Serial I/Os: 2

Multiple serial I/O interfaces for communication and connectivity with other devices and peripherals.

PWM Channels: YES

Integrated PWM channels offer precise control over the signal output for applications like motor control and LED dimming.

Connectivity: "I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Multiple communication interfaces for versatile connectivity options with various devices and protocols.

ROM Programmability: FLASH

Flash ROM technology allows for easy and fast programming of the microcontroller's memory, making it ideal for updating firmware and code.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high density PCB designs and efficient signal routing for optimal performance.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and calculations, improving processing efficiency.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage precautions.

Speed: 16 rpm

Operates at a speed of 16 rotations per minute, suitable for applications requiring precise speed control or measurement.

Low Power Mode: YES

Supports low-power mode for energy-efficient operation and extended battery life in power-sensitive applications.

On Chip Program ROM Width: 8

8-bit wide on-chip ROM for storing program instructions and data efficiently.

No. of I/O Lines: 64

E ample number of I/O lines for interfacing with external devices and peripherals, providing versatile connectivity options.

Technical Specifications

Microcontrollers MSP430F2419TZQW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

64

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

10

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

122880

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)"

Peripherals:

BOD, COMPARATOR, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F2419TZQW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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