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MSP430F2419TPM

Texas Instruments

MSP430F2419TPM by Texas Instruments

MSP430F2419TPM by Texas Instruments is a 16-bit microcontroller with 122880 ROM words and 4 RAM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like ADC channels, PWM channels, and multiple connectivity options, it offers versatile solutions in embedded systems design.

Median Price

$11.817

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,548 parts In-Stock

1+ parts

$5.710

100+ parts

$5.600

1k+ parts

$5.480

10k+ parts

-

2,548

$5.710

$5.600

$5.480

-

Chip1Stop

Japan . 158 parts In-Stock

1+ parts

$8.690

100+ parts

-

1k+ parts

-

10k+ parts

-

158

$8.690

-

-

-

Texas Instruments

USA . 3,423 parts In-Stock

1+ parts

$11.155

100+ parts

$9.744

1k+ parts

$6.720

10k+ parts

-

3,423

$11.155

$9.744

$6.720

-

Arrow

USA . 3 parts In-Stock

1+ parts

$11.817

100+ parts

$10.167

1k+ parts

$9.809

10k+ parts

$9.736

3

$11.817

$10.167

$9.809

$9.736

Verical

USA . 3 parts In-Stock

1+ parts

$11.817

100+ parts

$10.167

1k+ parts

$9.809

10k+ parts

$9.736

3

$11.817

$10.167

$9.809

$9.736

Mouser Electronics

USA . 193 parts In-Stock

1+ parts

$14.570

100+ parts

$12.100

1k+ parts

$11.310

10k+ parts

-

193

$14.570

$12.100

$11.310

-

DigiKey

USA . 65 parts In-Stock

1+ parts

$16.660

100+ parts

$12.357

1k+ parts

-

10k+ parts

-

65

$16.660

$12.357

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,357 parts In-Stock

1+ parts

$5.424

100+ parts

-

1k+ parts

-

10k+ parts

-

3,357

$5.424

-

-

-

Vyrian

USA . 7,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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7,040

-

-

-

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ComSIT Distribution GmbH

Germany . 322 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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322

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 619 parts In-Stock

1+ parts

$5.139

100+ parts

-

1k+ parts

-

10k+ parts

-

619

$5.139

-

-

-

Component Stockers USA

USA . 101 parts In-Stock

1+ parts

$10.650

100+ parts

$8.870

1k+ parts

-

10k+ parts

-

101

$10.650

$8.870

-

-

Microchip USA

USA . 1,005 parts In-Stock

1+ parts

$28.060

100+ parts

$27.660

1k+ parts

$27.450

10k+ parts

$27.250

1,005

$28.060

$27.660

$27.450

$27.250

Parana Technologies

USA . 1,273 parts In-Stock

1+ parts

$28.389

100+ parts

-

1k+ parts

$46.922

10k+ parts

-

1,273

$28.389

-

$46.922

-

ChromeModa Solutions

Germany . 4,301 parts In-Stock

1+ parts

$31.898

100+ parts

$26.156

1k+ parts

-

10k+ parts

-

4,301

$31.898

$26.156

-

-

IDEA Electronic Components Group

UK . 1,744 parts In-Stock

1+ parts

$31.898

100+ parts

$30.303

1k+ parts

$28.708

10k+ parts

-

1,744

$31.898

$30.303

$28.708

-

Lixinc

USA . 4,349 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,349

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-

-

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Perfect Parts

USA . 3,143 parts In-Stock

1+ parts

-

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3,143

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-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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3,000

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 2,679 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,679

-

-

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DigiPath Technology Company

USA . 1,471 parts In-Stock

1+ parts

-

100+ parts

$28.759

1k+ parts

-

10k+ parts

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1,471

-

$28.759

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-

GreenTree Electronics

Israel . 310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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310

-

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Infinite Electronics LLP (Excess)

. 304 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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304

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A-Z Elektronik GmbH

Germany . 225 parts In-Stock

1+ parts

-

100+ parts

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225

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Overview

Unleash the power of technology with the Texas Instruments MSP430F2419TPM microcontroller! Designed for a wide range of applications, this high-quality product boasts top-notch performance and reliability. With its advanced features and innovative design, customers can expect seamless integration and enhanced functionality in their projects. Elevate your creations with the MSP430F2419TPM and experience the value, benefits, and advantages it brings to the table. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for compact and portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6V, providing flexibility in power options for different applications.

Bit Size: 16

16-bit architecture allows for higher performance and more complex operations compared to lower bit sizes.

No. of Terminals: 64

With 64 terminals, this microcontroller offers ample I/O options for connecting external peripherals and sensors.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this microcontroller suitable for industrial applications with demanding temperature conditions.

Minimum Operating Temperature: -40 °C

Can operate effectively in low temperatures, making it suitable for a wide range of environments and applications.

ADC Channels: YES

Integrated analog-to-digital converters enable the microcontroller to directly interface with analog sensors and inputs.

ROM Words: 122880

Large ROM capacity allows for storing a significant amount of code and data, enabling complex embedded applications.

No. of Timers: 10

Multiple timers provide timing and control functions, essential for coordinating tasks and operations in embedded systems.

RAM Bytes: 4096

A generous amount of RAM enables efficient data storage and manipulation, improving overall system performance.

Analog To Digital Convertors: 8-Ch 12-Bit

8-channel 12-bit ADCs allow for precise and simultaneous analog signal conversion, useful in applications requiring accurate measurements.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and integrated peripherals make this microcontroller efficient and versatile for a wide range of applications.

Technical Specifications

Microcontrollers MSP430F2419TPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

10

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

122880

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)"

Peripherals:

BOD, COMPARATOR, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F2419TPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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