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MSP430F2418TPN

Texas Instruments

MSP430F2418TPN by Texas Instruments

MSP430F2418TPN by Texas Instruments is a 16-bit microcontroller with 80 terminals, 8192 bytes of RAM, and 118784 ROM words. It operates at a max clock frequency of 16 MHz and features low power mode for industrial applications. With PWM channels, ADC converters, and multiple connectivity options like I2C and SPI, it offers versatile solutions in a compact package.

Median Price

$10.589

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,718 parts In-Stock

1+ parts

$10.589

100+ parts

$9.250

1k+ parts

$6.379

10k+ parts

-

1,718

$10.589

$9.250

$6.379

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Arrow

USA . 238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.516

10k+ parts

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238

-

-

$8.516

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Rochester

USA . 178 parts In-Stock

1+ parts

-

100+ parts

$9.180

1k+ parts

$8.210

10k+ parts

$7.730

178

-

$9.180

$8.210

$7.730

DigiKey

USA . 178 parts In-Stock

1+ parts

-

100+ parts

$12.080

1k+ parts

-

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178

-

$12.080

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Verical

USA . 114 parts In-Stock

1+ parts

-

100+ parts

$11.475

1k+ parts

$10.262

10k+ parts

$9.662

114

-

$11.475

$10.262

$9.662

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 3 parts In-Stock

1+ parts

$4.900

100+ parts

-

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-

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3

$4.900

-

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Digiode

USA . 1,486 parts In-Stock

1+ parts

$8.417

100+ parts

-

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1,486

$8.417

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Vyrian

USA . 4,272 parts In-Stock

1+ parts

-

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-

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4,272

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DigiKey Marketplace

USA . 178 parts In-Stock

1+ parts

-

100+ parts

-

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178

-

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ComSIT Distribution GmbH

Germany . 54 parts In-Stock

1+ parts

-

100+ parts

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54

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 810 parts In-Stock

1+ parts

$7.974

100+ parts

-

1k+ parts

-

10k+ parts

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810

$7.974

-

-

-

Microchip USA

USA . 2,110 parts In-Stock

1+ parts

$25.790

100+ parts

$25.420

1k+ parts

$25.240

10k+ parts

$25.050

2,110

$25.790

$25.420

$25.240

$25.050

Parana Technologies

USA . 1,274 parts In-Stock

1+ parts

$29.201

100+ parts

$2,711.746

1k+ parts

$26.281

10k+ parts

-

1,274

$29.201

$2,711.746

$26.281

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DigiPath Technology Company

USA . 1,208 parts In-Stock

1+ parts

$32.154

100+ parts

$29.581

1k+ parts

-

10k+ parts

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1,208

$32.154

$29.581

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ChromeModa Solutions

Germany . 4,927 parts In-Stock

1+ parts

$32.810

100+ parts

$26.904

1k+ parts

-

10k+ parts

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4,927

$32.810

$26.904

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IDEA Electronic Components Group

UK . 958 parts In-Stock

1+ parts

$32.810

100+ parts

$31.170

1k+ parts

$29.529

10k+ parts

-

958

$32.810

$31.170

$29.529

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2418TPN microcontroller. Built with precision and expertise, Texas Instruments is a renowned leader in the industry, ensuring top-notch quality in every product. This versatile microcontroller is perfect for a wide range of applications, offering customers unmatched value and performance. With features like low power mode, multiple connectivity options, and a high clock frequency, the MSP430F2418TPN delivers efficiency and reliability for all your projects. Experience the difference with Texas Instruments and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ensuring the microcontroller is robust and easy to handle.

Surface Mount: YES

Easily integrated onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Supports a higher supply voltage, providing flexibility in power requirements for various applications.

On Chip Data RAM Width: 8

Wide data RAM width for efficient data processing and storage capabilities.

Package Shape: SQUARE

Sleek and compact design, easy to place and secure within electronic devices.

Bit Size: 16

16-bit architecture allows for faster processing and higher data resolution.

Power Supplies (V): 2/3.3

Supports dual power supply options, enhancing compatibility with different voltage requirements.

No. of Terminals: 80

Ample terminals for connectivity and interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Streamlined package style for efficient heat dissipation and space-saving in compact designs.

Minimum Supply Voltage: 3.3 V

Ensures stable operation at lower voltages, conserving power and extending battery life.

Maximum Operating Temperature: 105 °C

High maximum operating temperature range for reliable performance in various environmental conditions.

CPU Family: MSP430

Part of a well-established and reliable CPU family known for low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold environments without compromising functionality.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Durable and corrosion-resistant terminal finish for long-lasting connectivity.

ADC Channels: YES

Integrated analog-to-digital converters provide accurate and efficient conversion of analog signals.

Terminal Position: QUAD

Quad terminal position for strong mechanical stability and secure connection on circuit boards.

ROM Words: 118784

Large ROM capacity for storing program instructions and data, enabling complex algorithms and applications.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications and efficient heat dissipation.

Width: 12 mm

Compact width for easy integration into various electronic devices without occupying excess space.

Peripherals: BOD, COMPARATOR, TIMER(2), WDT

Comprehensive set of peripherals for enhanced functionality and usability in diverse applications.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing speed and real-time responsiveness in tasks and applications.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during assembly processes without compromising performance.

Length: 12 mm

Compact length for versatile placement within electronic devices and circuit layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Advanced RISC architecture for efficient data processing and reduced power consumption in microcontroller operations.

No. of Timers: 10

Multiple timers for precise timekeeping, scheduling tasks, and synchronization of operations.

RAM Bytes: 8192

Sufficient RAM capacity for storing temporary data and variables during program execution.

Technology: CMOS

CMOS technology for low power consumption and efficient operation in battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form for reliable solder connections and secure mounting on circuit boards.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple 12-bit ADC channels for high-resolution conversion of analog signals to digital data.

Maximum Supply Current: 0.595 mA

Low supply current consumption for energy-efficient operation and extended battery life.

PWM Channels: YES

Pulse-width modulation channels for precise control of motor speed, LED brightness, and other applications.

Connectivity: I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Diverse connectivity options for communication with external devices, sensors, and peripherals.

ROM Programmability: FLASH

Flash programmable ROM for easy updating and reprogramming of software applications without requiring external programming tools.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact design layouts and precise connection with other components.

Format: FIXED POINT

Fixed-point format for efficient numerical computations and improved algorithm performance.

Moisture Sensitivity Level (MSL): 3

Moisture-resistant design with MSL level 3 for safe storage and operation in humid environments.

Speed: 16 rpm

High processing speed of 16 revolutions per minute for quick data processing and real-time response.

Low Power Mode: YES

Integrated low power mode for energy-saving operation and extended battery life in portable devices.

On Chip Program ROM Width: 8

Wide on-chip program ROM width for storing program instructions and data without requiring external memory.

No. of I/O Lines: 64

Abundant I/O lines for interfacing with external devices, sensors, and peripherals, enhancing connectivity and functionality.

Technical Specifications

Microcontrollers MSP430F2418TPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

80

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

118784

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F2418TPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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