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MSP430F2417TZQWR

Texas Instruments

MSP430F2417TZQWR by Texas Instruments

MSP430F2417TZQWR by Texas Instruments is a 16-bit microcontroller with 4096 RAM words and 94208 ROM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like 8-Ch 12-Bit ADC channels and various connectivity options, it offers versatile solutions in embedded systems design.

Median Price

$5.280

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,500 parts In-Stock

1+ parts

$5.280

100+ parts

$5.170

1k+ parts

$5.070

10k+ parts

-

4,500

$5.280

$5.170

$5.070

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,138 parts In-Stock

1+ parts

-

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9,138

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Digiode

USA . 1,068 parts In-Stock

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1,068

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Distributors (Availability)

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One Stop Electronics

USA . 1,379 parts In-Stock

1+ parts

$3.000

100+ parts

-

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1,379

$3.000

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AZTECH Wire

Italy . 575 parts In-Stock

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$6.625

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575

$6.625

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Parana Technologies

USA . 400 parts In-Stock

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$76.538

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400

$76.538

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DigiPath Technology Company

USA . 98 parts In-Stock

1+ parts

$84.278

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98

$84.278

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ChromeModa Solutions

Germany . 2,824 parts In-Stock

1+ parts

$85.998

100+ parts

$70.518

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2,824

$85.998

$70.518

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IDEA Electronic Components Group

UK . 1,899 parts In-Stock

1+ parts

$85.998

100+ parts

$81.698

1k+ parts

$77.398

10k+ parts

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1,899

$85.998

$81.698

$77.398

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Component Stockers USA

USA . 499 parts In-Stock

1+ parts

$99.990

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499

$99.990

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Perfect Parts

USA . 6,339 parts In-Stock

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6,339

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Corphita

USA . 2,617 parts In-Stock

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2,617

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Microchip USA

USA . 292 parts In-Stock

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292

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2417TZQWR microcontroller. Designed with cutting-edge technology and precision, this device offers unparalleled quality and reliability. Perfect for a wide range of applications, this microcontroller provides efficient performance, low power consumption, and versatile connectivity options. Experience the seamless integration of peripherals like BOD, comparator, timer, and WDT, all in a compact and durable package. Trust Texas Instruments to deliver exceptional value and unmatched benefits with the MSP430F2417TZQWR microcontroller. Elevate your projects to new heights with this superior device.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and protects the internal components of the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount feature allows for easy and efficient assembly onto circuit boards, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power input options, making the microcontroller compatible with a wider range of applications.

On Chip Data RAM Width: 16

16-bit data RAM width provides faster data processing and storage capabilities, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

Square package shape simplifies the layout and placement of the microcontroller on the PCB, optimizing space utilization and enabling compact designs.

Bit Size: 16

16-bit architecture allows for handling larger data chunks, improving computational efficiency and supporting complex algorithms in the microcontroller.

Power Supplies (V): 2/3.3

Dual power supply options of 2V and 3.3V provide flexibility in voltage selection based on the specific requirements of the application, ensuring compatibility and efficiency.

No. of Terminals: 113

Higher number of terminals enable increased connectivity options and I/O capabilities, allowing for versatile interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with thin profile and fine pitch enhances soldering accuracy and reliability, ensuring robust connections and long-term performance of the microcontroller.

Minimum Supply Voltage: 3.3 V

Stable minimum supply voltage of 3.3V ensures consistent power delivery to the microcontroller, preventing fluctuations and potential damage due to voltage variations.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance of 105°C allows the microcontroller to function reliably in demanding industrial environments with elevated temperatures.

CPU Family: MSP430

Being part of the MSP430 family indicates advanced microcontroller features, energy efficiency, and a wide range of integrated peripherals for enhanced functionality and performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures the microcontroller's functionality even in harsh cold environments, making it suitable for diverse operational conditions.

Terminal Finish: TIN SILVER COPPER

Terminal finish with Tin Silver Copper composition ensures robust contacts, preventing corrosion and maintaining signal integrity for reliable performance of the microcontroller.

ADC Channels: YES

Integrated ADC channels enable analog-to-digital conversion within the microcontroller, facilitating accurate sensor readings and data acquisition for various measurement applications.

Terminal Position: BOTTOM

Terminal position at the bottom simplifies PCB layout and routing, enhancing the overall design efficiency and accessibility for soldering and assembly processes.

ROM Words: 94208

Large ROM capacity of 94208 words allows for storing extensive program codes and data, supporting complex algorithms and applications in the microcontroller.

Maximum Seated Height: 1 mm

Low maximum seated height of 1mm enables slim and compact device designs, reducing the overall profile and footprint of products integrating this microcontroller.

RAM Words: 4096

Adequate RAM capacity of 4096 words provides sufficient memory for temporary data storage, buffering, and efficient data manipulation during program execution in the microcontroller.

Width: 7 mm

Compact width of 7mm allows for space-efficient placement on the PCB, enabling dense integration of components and optimizing the overall layout for streamlined system designs.

Boundary Scan: YES

Boundary scan capability facilitates efficient testing and debugging of the microcontroller, enhancing the development process, reliability, and maintenance of electronic systems.

Peripherals: BOD, COMPARATOR, TIMER(2), WDT

Integrated peripherals like Brown-Out Detector (BOD), Comparator, Timers, and Watchdog Timer (WDT) enhance the functionality and versatility of the microcontroller for diverse applications.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16 MHz supports fast data processing and execution speed, enabling rapid response times and efficient operation of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

Defined maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reflow processes during manufacturing, maintaining component integrity and reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C allows for robust assembly and soldering of the microcontroller onto PCBs, ensuring secure connections and long-term stability.

Length: 7 mm

Compact length of 7mm contributes to the overall small form factor of the microcontroller, facilitating space-saving designs and efficient PCB utilization in electronic products.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating ensures reliable operation and performance of the microcontroller in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing (RISC) architecture offers streamlined operation, efficient instruction execution, and enhanced processing speed for optimized performance.

No. of Timers: 2

Having 2 timers onboard expands timing and control capabilities, enabling precise scheduling, synchronization, and event management functions within the microcontroller.

RAM Bytes: 8192

Generous RAM storage of 8192 bytes supports data buffering, stack operations, and temporary storage needs, enhancing the efficiency and performance of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable performance, making it an ideal choice for energy-efficient and durable microcontroller designs.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, enabling efficient soldering and mounting onto PCBs for robust mechanical and electrical integration.

Analog To Digital Convertors: 8-Ch 12-Bit

Integrated 8-channel 12-bit ADC enhances analog signal processing and conversion accuracy, enabling precise sensor readings and data acquisition in various application scenarios.

Maximum Supply Current: 0.595 mA

Low maximum supply current of 0.595 mA indicates energy-efficient operation, reducing power consumption and heat generation for improved system performance and longevity.

No. of Serial I/Os: 2

Dual serial I/O interfaces provide versatile communication options, facilitating connectivity with external devices, sensors, and peripherals for comprehensive system integration.

PWM Channels: YES

PWM (Pulse Width Modulation) channel support enables precise control of analog signals, motor speed regulation, and power management, enhancing the microcontroller's versatility and functionality.

Connectivity: I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Diverse connectivity options including I2C, IRDA, LIN, SPI, UART, and USCI interfaces facilitate seamless communication and data exchange with external devices, expanding the flexibility and compatibility of the microcontroller.

ROM Programmability: FLASH

Flash ROM programmability enables easy and efficient updates of firmware and software, allowing for flexibility in applications, quick debugging, and seamless integration of new features.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm ensures precise soldering and connection reliability, maintaining signal integrity and electrical performance in the microcontroller for robust system operation.

Format: FIXED POINT

Fixed-point format for data representation enables accurate numerical calculations and efficient processing, supporting various mathematical operations and algorithms in the microcontroller.

Technical Specifications

Microcontrollers MSP430F2417TZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

4096

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F2417TZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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