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MSP430F2416TZCAR

Texas Instruments

MSP430F2416TZCAR by Texas Instruments

MSP430F2416TZCAR by Texas Instruments is a 16-bit microcontroller with 4096 bytes of RAM and 94208 ROM words. It operates at a max frequency of 16 MHz, suitable for industrial applications requiring low power consumption. Features include 8-channel 12-bit ADCs, multiple connectivity options (I2C, SPI, UART), and on-chip peripherals like BOD and timers.

Median Price

$10.080

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,000 parts In-Stock

1+ parts

$10.080

100+ parts

$8.217

1k+ parts

$5.478

10k+ parts

-

15,000

$10.080

$8.217

$5.478

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,924 parts In-Stock

1+ parts

$9.576

100+ parts

-

1k+ parts

-

10k+ parts

-

4,924

$9.576

-

-

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Vyrian

USA . 9,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,775

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 442 parts In-Stock

1+ parts

$8.930

100+ parts

-

1k+ parts

-

10k+ parts

-

442

$8.930

-

-

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Corphita

USA . 812 parts In-Stock

1+ parts

$9.072

100+ parts

-

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812

$9.072

-

-

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Parana Technologies

USA . 130 parts In-Stock

1+ parts

$25.903

100+ parts

-

1k+ parts

$26.501

10k+ parts

-

130

$25.903

-

$26.501

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ChromeModa Solutions

Germany . 2,861 parts In-Stock

1+ parts

$29.104

100+ parts

$23.865

1k+ parts

-

10k+ parts

-

2,861

$29.104

$23.865

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IDEA Electronic Components Group

UK . 1,676 parts In-Stock

1+ parts

$29.104

100+ parts

$27.649

1k+ parts

$26.194

10k+ parts

-

1,676

$29.104

$27.649

$26.194

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QUARKTWIN TECHNOLOGY LTD

USA . 12,589 parts In-Stock

1+ parts

-

100+ parts

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12,589

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Component Stockers USA

USA . 11,261 parts In-Stock

1+ parts

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11,261

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

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7,000

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DigiPath Technology Company

USA . 2,074 parts In-Stock

1+ parts

-

100+ parts

$26.240

1k+ parts

-

10k+ parts

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2,074

-

$26.240

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Overview

Discover the cutting-edge MSP430F2416TZCAR microcontroller by Texas Instruments, a true game-changer in the world of technology. With a wide range of applications in various industries, this high-quality product offers unparalleled value and benefits to customers. From its advanced features to its durable package body material, this microcontroller guarantees top-notch performance and reliability. Trust Texas Instruments, a reputable manufacturer known for innovation and excellence, to deliver a product that exceeds expectations. Upgrade your projects with the MSP430F2416TZCAR and experience the advantages of top-of-the-line technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, which is ideal for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration of the microcontroller on a PCB, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in powering the microcontroller, catering to a wide range of applications.

On Chip Data RAM Width: 8

Having a wide data RAM width of 8 enables the microcontroller to handle and process large amounts of data efficiently.

Package Shape: SQUARE

The square package shape makes it easy to mount and align the microcontroller on the PCB, ensuring proper orientation and connection.

Bit Size: 16

A 16-bit architecture allows for higher precision and performance in processing data and executing instructions.

No. of Terminals: 113

With a high number of terminals, the microcontroller offers ample connectivity options for interfacing with external devices and peripherals.

Minimum Supply Voltage: 3.3 V

The low minimum supply voltage ensures efficient power consumption, making it suitable for battery-powered devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes the microcontroller suitable for industrial applications where it may be exposed to elevated temperatures.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it a reliable choice for energy-efficient applications.

Technical Specifications

Microcontrollers MSP430F2416TZCAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

113

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F2416TZCAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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