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MSP430F2410TRGCT

Texas Instruments

MSP430F2410TRGCT by Texas Instruments

MSP430F2410TRGCT by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 16 MHz. It features 8 ADC channels, 6 timers, and low power mode ideal for industrial applications requiring high-speed processing and connectivity via I2C, LIN, SPI, UART interfaces.

Median Price

$15.950

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Texas Instruments

USA . 1,090 parts In-Stock

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$11.791

100+ parts

$9.612

1k+ parts

$6.408

10k+ parts

-

1,090

$11.791

$9.612

$6.408

-

DigiKey

USA . 406 parts In-Stock

1+ parts

$15.950

100+ parts

$10.900

1k+ parts

$10.466

10k+ parts

-

406

$15.950

$10.900

$10.466

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Mouser Electronics

USA . 43 parts In-Stock

1+ parts

$15.950

100+ parts

$10.900

1k+ parts

$10.460

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43

$15.950

$10.900

$10.460

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Bristol Electronics

USA . 486 parts In-Stock

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$8.451

100+ parts

$5.071

1k+ parts

$4.859

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486

$8.451

$5.071

$4.859

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Digiode

USA . 4,918 parts In-Stock

1+ parts

$11.201

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4,918

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Vyrian

USA . 4,581 parts In-Stock

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4,581

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Dan-Mar Components

USA . 486 parts In-Stock

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486

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ACDS - Activité Composants Distribution Service

France . 242 parts In-Stock

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Semi Source

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Corphita

USA . 4,078 parts In-Stock

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$10.612

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4,078

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Component Stockers USA

USA . 910 parts In-Stock

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$13.390

100+ parts

$10.400

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910

$13.390

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Parana Technologies

USA . 1,689 parts In-Stock

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$74.548

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1,689

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DigiPath Technology Company

USA . 702 parts In-Stock

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$82.087

100+ parts

$75.520

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702

$82.087

$75.520

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ChromeModa Solutions

Germany . 4,198 parts In-Stock

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$83.762

100+ parts

$68.685

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4,198

$83.762

$68.685

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IDEA Electronic Components Group

UK . 789 parts In-Stock

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$83.762

100+ parts

$79.574

1k+ parts

$75.386

10k+ parts

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789

$83.762

$79.574

$75.386

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Perfect Parts

USA . 1,533 parts In-Stock

1+ parts

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1,533

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Overview

Enhance your electronic projects with the MSP430F2410TRGCT microcontroller by Texas Instruments. Renowned for its high quality and reliability, Texas Instruments offers a wide range of applications for this category of microcontrollers. With a maximum supply voltage of 3.6V and low power mode, this product provides exceptional value and benefits to customers seeking efficient and versatile solutions for their designs. Trust in Texas Instruments' expertise and take advantage of the advantages that the MSP430F2410TRGCT has to offer.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and secure mounting on PCBs, making the integration of this microcontroller into electronic devices more efficient.

Maximum Supply Voltage: 3.6 V

Can operate within a wide voltage range, providing flexibility in power supply options and compatibility with various systems.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and manipulation, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization on the PCB, especially in compact electronic devices where space is a constraint.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle larger data sizes and perform more complex operations, making it suitable for a wide range of applications.

Power Supplies (V): 2/3.3

Supporting multiple power supply options makes this microcontroller versatile and compatible with various power sources, adding to its flexibility in different applications.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with external components, peripherals, and sensors, enabling greater functionality in the overall system design.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The chip carrier with a very thin profile allows for a compact form factor, making it suitable for applications where space constraints are critical.

Minimum Supply Voltage: 1.8 V

The ability to operate at low supply voltages is beneficial for energy-efficient designs and prolonging battery life in portable devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, ensuring reliability in industrial applications.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility with existing software and development tools, making it easier for developers to work with this microcontroller.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold temperatures makes this microcontroller suitable for a wide range of challenging environments and applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold for terminal finish ensures high conductivity, corrosion resistance, and reliability in electrical connections.

ADC Channels: YES

The presence of analog-to-digital converter channels enables the microcontroller to interface with analog sensors and signals, expanding its capabilities in data acquisition and processing.

Terminal Position: QUAD

Quad terminal positioning facilitates easy soldering and assembly, enhancing the manufacturability of electronic devices using this microcontroller.

ROM Words: 57344

Having a large ROM size allows for storing significant amounts of program data, enabling the microcontroller to run complex applications and algorithms efficiently.

Maximum Seated Height: 1 mm

With a low seated height, this microcontroller can be integrated into ultra-thin devices without adding bulk, ideal for applications where slim profiles are essential.

RAM Words: 4

Although small, the RAM words provided can be sufficient for storing temporary data and variables during program execution, supporting basic processing tasks.

Width: 9 mm

Having a compact width allows for space-efficient placement on the PCB, contributing to overall board optimization and enabling smaller electronic device designs.

Boundary Scan: YES

Boundary scan capability aids in testing, debugging, and diagnosing faults in the microcontroller and connected components, simplifying the development and maintenance processes.

Peripherals: "BOD, COMPARATOR, TIMER(6), WDT

The inclusion of various peripherals such as Brownout Detector, Comparator, Timers, and Watchdog Timer enhances the microcontroller's functionality and capabilities for diverse applications.

Maximum Clock Frequency: 16 MHz

Operating at a maximum clock frequency of 16 MHz enables fast and efficient processing of instructions, suitable for applications requiring real-time data processing and responsiveness.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this microcontroller can withstand the soldering process during manufacturing, ensuring reliable and robust assembly in mass production.

Length: 9 mm

The length of 9 mm contributes to the overall compactness of the microcontroller, allowing for space-saving integration in electronic designs with size constraints.

Temperature Grade: INDUSTRIAL

Being designated for industrial temperature grades means this microcontroller can operate reliably in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC-based microcontroller, it offers improved performance, power efficiency, and streamlined execution of instructions, making it suitable for a wide range of embedded applications.

No. of Timers: 6

Having six timers allows for precise timing control and event scheduling, essential for applications requiring synchronization, signal processing, or time-critical operations.

RAM Bytes: 4096

With 4096 bytes of RAM, the microcontroller can store and access a moderate amount of data during program execution, supporting multitasking and data processing requirements.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, making this microcontroller energy-efficient and versatile.

Terminal Form: NO LEAD

The lead-free terminal form complies with environmental regulations and promotes sustainability in electronic product design and manufacturing.

Analog To Digital Convertors: 8-Ch 12-Bit

The presence of eight channels of 12-bit analog-to-digital converters allows for accurate and high-resolution conversion of analog signals into digital data, supporting precise sensor interfacing and measurement applications.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V makes this microcontroller compatible with standard power sources and simplifies power management in electronic systems.

No. of Serial I/Os: 4

With four serial input/output ports, the microcontroller can communicate with multiple external devices, sensors, or interfaces simultaneously, enhancing connectivity options in the system.

PWM Channels: YES

Supporting pulse-width modulation channels allows for precise control of analog outputs, such as motor speed or LED brightness, enabling flexible and responsive system control.

Connectivity: "I2C, IRDA, LIN, SPI(2), UART, USCI(2)

The multiple connectivity options including I2C, IRDA, LIN, SPI, UART, and USCI enhance the microcontroller's versatility in communicating with different devices, peripherals, and communication protocols.

ROM Programmability: FLASH

The flash programmable ROM enables easy and quick reprogramming of the microcontroller's memory, allowing for firmware updates, customization, and flexibility in application development.

Terminal Pitch: 0.5 mm

A narrow terminal pitch of 0.5 mm facilitates high-density PCB layout and miniaturization, ideal for compact electronic devices and designs with tight spacing requirements.

Format: FIXED POINT

Using fixed-point format simplifies mathematical computations and accelerates processing speed, making this microcontroller efficient in applications requiring numerical calculations and algorithms.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this microcontroller can withstand moderate exposure to moisture during handling and assembly processes, ensuring reliability and performance in various environmental conditions.

Speed: 16 rpm

Operating at a speed of 16 rpm, this microcontroller can perform high-speed computational tasks, data processing, and communication operations, meeting the demands of modern applications.

Technical Specifications

Microcontrollers MSP430F2410TRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

57344

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR, TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F2410TRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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