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MSP430F2370IYFFR

Texas Instruments

MSP430F2370IYFFR by Texas Instruments

MSP430F2370IYFFR by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 2 timers, and 2048 bytes of RAM. It operates at speeds up to 16 MHz and supports low power mode. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$2.420

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,414 parts In-Stock

1+ parts

$2.420

100+ parts

$2.370

1k+ parts

$2.320

10k+ parts

-

4,414

$2.420

$2.370

$2.320

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 803 parts In-Stock

1+ parts

$4.076

100+ parts

-

1k+ parts

-

10k+ parts

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803

$4.076

-

-

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Vyrian

USA . 8,553 parts In-Stock

1+ parts

-

100+ parts

-

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8,553

-

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-

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Prism Electronics

USA . 332 parts In-Stock

1+ parts

-

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332

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,971 parts In-Stock

1+ parts

$3.861

100+ parts

-

1k+ parts

-

10k+ parts

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4,971

$3.861

-

-

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AZTECH Wire

Italy . 396 parts In-Stock

1+ parts

$14.890

100+ parts

-

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-

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396

$14.890

-

-

-

Parana Technologies

USA . 184 parts In-Stock

1+ parts

$16.577

100+ parts

-

1k+ parts

$16.850

10k+ parts

-

184

$16.577

-

$16.850

-

DigiPath Technology Company

USA . 1,692 parts In-Stock

1+ parts

$18.253

100+ parts

$16.793

1k+ parts

-

10k+ parts

-

1,692

$18.253

$16.793

-

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ChromeModa Solutions

Germany . 5,556 parts In-Stock

1+ parts

$18.626

100+ parts

$15.273

1k+ parts

-

10k+ parts

-

5,556

$18.626

$15.273

-

-

IDEA Electronic Components Group

UK . 647 parts In-Stock

1+ parts

$18.626

100+ parts

$17.695

1k+ parts

$16.763

10k+ parts

-

647

$18.626

$17.695

$16.763

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$34.756

100+ parts

$31.628

1k+ parts

$28.500

10k+ parts

-

1,000

$34.756

$31.628

$28.500

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QUARKTWIN TECHNOLOGY LTD

USA . 13,920 parts In-Stock

1+ parts

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13,920

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A-Z Elektronik GmbH

Germany . 3,215 parts In-Stock

1+ parts

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3,215

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S.R.D Solutions

India . 3,000 parts In-Stock

1+ parts

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3,000

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Futuretech Components

Singapore . 831 parts In-Stock

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831

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Microchip USA

USA . 266 parts In-Stock

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266

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Overview

Discover the Texas Instruments MSP430F2370IYFFR, a top-quality microcontroller offering unbeatable value and versatility. With a wide range of applications in various industries, this innovative product boasts reliable performance and exceptional efficiency. Trust in the leading manufacturer to deliver cutting-edge technology that meets your needs. Upgrade your projects with the MSP430F2370IYFFR and experience the benefits of superior quality, advanced features, and unparalleled customer satisfaction. Elevate your work to the next level with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight, durable, and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy installation on printed circuit boards, saving space and cost.

Maximum Supply Voltage: 3.6 V

Supports a high maximum supply voltage, providing flexibility in power supply options.

On Chip Data RAM Width: 8

Wide on-chip data RAM width allows for efficient data processing.

Package Shape: RECTANGULAR

Rectangular shape enables easy integration into various electronic devices and PCB layouts.

Bit Size: 16

16-bit architecture offers higher processing power and performance capabilities.

Power Supplies (V): 2/3.3

Supports multiple power supply options, making it versatile for different applications.

No. of Terminals: 49

Ample number of terminals allow for connectivity to other components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a thin profile and fine pitch enables space-saving and optimal PCB layout.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes the microcontroller suitable for industrial environments.

CPU Family: MSP430

Part of the MSP430 family known for its low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables operation in harsh environments and extreme conditions.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB mounting and soldering.

ROM Words: 32768

Large ROM capacity enables storing a significant amount of program data and code.

Maximum Seated Height: 0.625 mm

Low seated height is beneficial for applications where space constraints are critical.

RAM Words: 2

On-chip RAM storage capacity for efficient data processing and temporary storage.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging the microcontroller during manufacturing.

Peripherals: BOD, COMPARATOR, TIMER(2), WDT

Various built-in peripherals enhance the functionality and versatility of the microcontroller.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast data processing and operations.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow temperature profile ensures reliable soldering and component assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper solder joint formation and reliability.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating makes the microcontroller suitable for rugged and demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance and efficiency in data processing tasks.

No. of Timers: 2

Multiple timer units provide timing and scheduling functions for various applications.

RAM Bytes: 2048

Sufficient RAM capacity for data storage and manipulation during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form simplifies soldering and connection to PCB pads.

Maximum Supply Current: 0.55 mA

Low supply current consumption helps in achieving energy efficiency and extending battery life.

Nominal Supply Voltage: 2.2 V

Stable nominal supply voltage ensures consistent and reliable operation.

PWM Channels: YES

Pulse-Width Modulation (PWM) channels enable precise control of output signals and motor speed.

Connectivity: I2C, IRDA, LIN, SCI(2), SPI(2), UART

Multiple connectivity options support communication with a wide range of external devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and reprogramming of firmware and software.

Terminal Pitch: 0.4 mm

Fine terminal pitch enables high-density mounting and compact PCB design.

Format: FIXED POINT

Fixed-point format simplifies mathematical operations and calculations in software development.

Speed: 16 rpm

High processing speed of 16 RPM ensures quick response time and efficient data processing.

Low Power Mode: YES

Low power mode option enhances energy efficiency and prolongs battery life in portable applications.

On Chip Program ROM Width: 8

Wide on-chip program ROM width facilitates storage of program code for efficient execution.

No. of I/O Lines: 32

Ample I/O lines enable seamless interfacing with external devices and peripherals for versatile functionality.

Technical Specifications

Microcontrollers MSP430F2370IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B49

JESD-609 Code:

e1

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

49

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SCI(2), SPI(2), UART"

Peripherals:

"BOD, COMPARATOR, TIMER(2), WDT"

Trade Compliance

MSP430F2370IYFFR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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