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MSP430F2350IYFFT

Texas Instruments

MSP430F2350IYFFT by Texas Instruments

MSP430F2350IYFFT by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 2048 bytes of RAM, and 16640 ROM words. It operates at up to 16 MHz, supports PWM channels, and has low power mode for industrial applications. With connectivity options like I2C, LIN, and UART, it's ideal for embedded systems requiring high performance in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,634 parts In-Stock

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Vyrian

USA . 4,598 parts In-Stock

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4,598

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SPM Sales

USA . 172 parts In-Stock

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172

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 931 parts In-Stock

1+ parts

$3.000

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931

$3.000

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AZTECH Wire

Italy . 222 parts In-Stock

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$9.996

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222

$9.996

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One Stop Electronics

USA . 1,003 parts In-Stock

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$20.000

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$20.000

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Parana Technologies

USA . 1,501 parts In-Stock

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$71.649

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$71.649

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DigiPath Technology Company

USA . 1,716 parts In-Stock

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$78.894

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1,716

$78.894

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IDEA Electronic Components Group

UK . 666 parts In-Stock

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$80.504

100+ parts

$76.479

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$72.454

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666

$80.504

$76.479

$72.454

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ChromeModa Solutions

Germany . 538 parts In-Stock

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$80.504

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$66.013

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538

$80.504

$66.013

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Continental Prestige Electronics

USA . 2,542 parts In-Stock

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Argo Parts USA

USA . 1,347 parts In-Stock

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Bastille Electronics

Australia . 700 parts In-Stock

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Microchip USA

USA . 146 parts In-Stock

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Corphita

USA . 110 parts In-Stock

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110

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Overview

Elevate your projects with the Texas Instruments MSP430F2350IYFFT microcontroller. Crafted with precision and expertise, this high-quality device offers unparalleled performance in a compact package. Ideal for a wide range of applications, this microcontroller provides customers with exceptional value, efficiency, and reliability. Experience the benefits of cutting-edge technology and unlock endless possibilities with the MSP430F2350IYFFT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product durable and cost-effective.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V allows for flexibility in power supply options.

CPU Family: MSP430

The product belongs to the MSP430 CPU family known for its low power consumption and high performance.

ROM Programmability: FLASH

The flash ROM programmability feature enables easy and fast program updates on the microcontroller.

Connectivity: I2C, IRDA, LIN, SCI(2), SPI(2), UART

The multiple connectivity options make the product versatile and suitable for various communication interfaces.

Technical Specifications

Microcontrollers MSP430F2350IYFFT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e1

Length:

3.202 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

49

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

16640

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.202 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SCI(2), SPI(2), UART

Peripherals:

BOD, COMPARATOR, TIMER(2), WDT

Trade Compliance

MSP430F2350IYFFT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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