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MSP430F2330TRHAR

Texas Instruments

MSP430F2330TRHAR by Texas Instruments

MSP430F2330TRHAR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. Features include PWM channels, I2C, IRDA, LIN connectivity, and on-chip peripherals like BOD and timers.

Median Price

$5.454

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,340 parts In-Stock

1+ parts

$5.454

100+ parts

$4.779

1k+ parts

$2.700

10k+ parts

-

9,340

$5.454

$4.779

$2.700

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,994 parts In-Stock

1+ parts

$5.181

100+ parts

-

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4,994

$5.181

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Vyrian

USA . 5,057 parts In-Stock

1+ parts

-

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5,057

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Chip Stock

USA . 775 parts In-Stock

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775

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,293 parts In-Stock

1+ parts

$4.909

100+ parts

-

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4,293

$4.909

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AZTECH Wire

Italy . 374 parts In-Stock

1+ parts

$20.060

100+ parts

-

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374

$20.060

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Microchip USA

USA . 2,806 parts In-Stock

1+ parts

$23.040

100+ parts

$22.900

1k+ parts

$22.830

10k+ parts

$22.760

2,806

$23.040

$22.900

$22.830

$22.760

Parana Technologies

USA . 1,494 parts In-Stock

1+ parts

$45.063

100+ parts

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1,494

$45.063

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DigiPath Technology Company

USA . 449 parts In-Stock

1+ parts

$49.620

100+ parts

$45.651

1k+ parts

-

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449

$49.620

$45.651

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IDEA Electronic Components Group

UK . 1,981 parts In-Stock

1+ parts

$50.633

100+ parts

$48.101

1k+ parts

$45.570

10k+ parts

-

1,981

$50.633

$48.101

$45.570

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ChromeModa Solutions

Germany . 1,226 parts In-Stock

1+ parts

$50.633

100+ parts

$41.519

1k+ parts

-

10k+ parts

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1,226

$50.633

$41.519

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2330TRHAR microcontroller. Crafted with precision and expertise, this versatile device is perfect for a wide range of applications in various industries. From smart home devices to automotive systems, the MSP430F2330TRHAR offers unrivaled performance, efficiency, and reliability. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Experience the seamless integration, advanced features, and exceptional value that this microcontroller brings to your projects. Elevate your designs with the MSP430F2330TRHAR and take your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, making the product suitable for compact designs and mass production.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V allows for flexibility in power supply options, making it compatible with a wide range of applications.

On Chip Data RAM Width: 8

8-bit data RAM width enables efficient data processing and storage within the microcontroller, enhancing overall performance.

Package Shape: SQUARE

Square package shape simplifies the integration process and ensures a consistent form factor for easier handling and mounting.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities and performance, making the microcontroller suitable for complex tasks and applications.

Power Supplies (V): 2/3.3

Support for dual power supply voltages (2V and 3.3V) offers flexibility in power management and compatibility with various voltage requirements in different applications.

No. of Terminals: 40

40 terminals provide sufficient connectivity options for input/output operations and peripheral connections, enabling versatile functionality.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage of 1.8V ensures efficient power usage and compatibility with low-power applications, resulting in energy savings and extended battery life.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C allows the microcontroller to withstand harsh environmental conditions and ensures reliable performance in industrial settings.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility with existing software and tools, facilitating development and reducing time-to-market for new products.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C enables the microcontroller to function in extreme cold environments, making it suitable for a wide range of applications.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion within the microcontroller, allowing for sensor interfacing and data acquisition in various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish offers high conductivity and corrosion resistance, ensuring reliable connections and signal integrity.

ROM Words: 8192

8192 ROM words provide ample memory capacity for program storage, allowing for the implementation of complex algorithms and data processing functions.

Maximum Seated Height: 1 mm

Low maximum seated height of 1mm allows for slim and compact device designs, making the microcontroller suitable for space-constrained applications.

Width: 6 mm

Narrow width of 6mm enables the microcontroller to fit in small spaces and compact PCB layouts, enhancing design flexibility and efficiency.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the microcontroller during production, ensuring high manufacturing yield and product reliability.

Peripherals: "BOD, COMPARATOR, TIMER(2), WDT

Integrated peripherals such as Brown-out Detector, Comparator, Timers, and Watchdog Timer enhance the microcontroller's functionality and versatility for diverse applications.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16MHz allows for fast and efficient processing of instructions, improving overall system performance and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

30-second maximum time at peak reflow temperature ensures reliable soldering and assembly of the microcontroller onto PCBs, minimizing production defects.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C enables lead-free soldering processes, meeting industry standards for environmental compliance and product reliability.

Length: 6 mm

Compact length of 6mm contributes to a small form factor and space-saving design for electronic devices, making the microcontroller ideal for portable applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments with wide temperature fluctuations, making the microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high performance and energy efficiency, making it suitable for real-time processing and low-power applications.

No. of Timers: 2

Two built-in timers provide timing and scheduling functions for various tasks and operations, enhancing the microcontroller's versatility and functionality.

RAM Bytes: 1024

1024 RAM bytes offer sufficient memory for data storage and manipulation within the microcontroller, supporting multitasking and complex computing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable for long-term operation.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and ensures easy recycling, promoting sustainability and eco-friendly practices.

Maximum Supply Current: 0.55 mA

Low maximum supply current of 0.55mA results in minimal power consumption and extended battery life, making the microcontroller suitable for battery-powered applications.

Nominal Supply Voltage: 2.2 V

Stable nominal supply voltage of 2.2V ensures consistent and reliable operation of the microcontroller, preventing voltage fluctuations and system failures.

PWM Channels: YES

Support for PWM channels enables precise control of analog signals and motor speed, making the microcontroller suitable for applications requiring accurate voltage modulation.

Connectivity: "I2C, IRDA, LIN, SCI(2), SPI(2), UART

Multiple connectivity options such as I2C, IRDA, LIN, SCI, SPI, and UART expand the microcontroller's interfacing capabilities, facilitating communication with various devices and peripherals.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and on-the-fly reprogramming of the microcontroller, enhancing flexibility and adaptability for evolving system requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and compact PCB designs, optimizing space utilization and ensuring reliable electrical connections.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and increases computational efficiency, making the microcontroller suitable for real-time signal processing and control applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard precautions during storage and handling to prevent damage and ensure product reliability.

Speed: 16 rpm

Operational speed of 16 revolutions per minute enables the microcontroller to perform tasks at a controlled pace, suitable for applications requiring precise speed regulation and control.

Low Power Mode: YES

Low power mode functionality allows the microcontroller to operate in a power-efficient state, prolonging battery life and reducing energy consumption in portable and battery-powered devices.

On Chip Program ROM Width: 8

8-bit program ROM width provides efficient storage and access to program instructions within the microcontroller, supporting fast execution and streamlined operation.

No. of I/O Lines: 32

32 I/O lines offer versatile interfacing options for connecting external devices and peripherals, enhancing the microcontroller's flexibility and functionality in diverse applications.

Technical Specifications

Microcontrollers MSP430F2330TRHAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

40

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SCI(2), SPI(2), UART"

Peripherals:

"BOD, COMPARATOR, TIMER(2), WDT"

Trade Compliance

MSP430F2330TRHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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