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MSP430F2330IRHAR

Texas Instruments

MSP430F2330IRHAR by Texas Instruments

MSP430F2330IRHAR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, LIN, SCI, SPI, and UART interfaces. The package style is chip carrier with a very thin profile, making it ideal for compact designs.

Median Price

$3.529

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,214 parts In-Stock

1+ parts

$1.720

100+ parts

$1.690

1k+ parts

$1.650

10k+ parts

-

2,214

$1.720

$1.690

$1.650

-

Texas Instruments

USA . 117,280 parts In-Stock

1+ parts

$5.454

100+ parts

$4.779

1k+ parts

$2.700

10k+ parts

-

117,280

$5.454

$4.779

$2.700

-

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.529

2,500

-

-

-

$3.529

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,319 parts In-Stock

1+ parts

$5.181

100+ parts

-

1k+ parts

-

10k+ parts

-

1,319

$5.181

-

-

-

Chip Stock

USA . 4,310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,310

-

-

-

-

Vyrian

USA . 2,137 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,137

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,975 parts In-Stock

1+ parts

$4.909

100+ parts

-

1k+ parts

-

10k+ parts

-

1,975

$4.909

-

-

-

AZTECH Wire

Italy . 1,144 parts In-Stock

1+ parts

$9.020

100+ parts

-

1k+ parts

-

10k+ parts

-

1,144

$9.020

-

-

-

Parana Technologies

USA . 1,692 parts In-Stock

1+ parts

$28.725

100+ parts

$2,667.529

1k+ parts

$25.852

10k+ parts

-

1,692

$28.725

$2,667.529

$25.852

-

DigiPath Technology Company

USA . 1,244 parts In-Stock

1+ parts

$31.630

100+ parts

$29.099

1k+ parts

-

10k+ parts

-

1,244

$31.630

$29.099

-

-

ChromeModa Solutions

Germany . 6,329 parts In-Stock

1+ parts

$32.275

100+ parts

$26.466

1k+ parts

-

10k+ parts

-

6,329

$32.275

$26.466

-

-

IDEA Electronic Components Group

UK . 125 parts In-Stock

1+ parts

$32.275

100+ parts

$30.661

1k+ parts

$29.048

10k+ parts

-

125

$32.275

$30.661

$29.048

-

A-Z Elektronik GmbH

Germany . 6,935 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,935

-

-

-

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Kepictronics

USA . 3,870 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,870

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-

-

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2330IRHAR microcontroller. As a leader in the industry, Texas Instruments delivers top-quality products for a wide range of applications. With its advanced features and versatile connectivity options, this microcontroller offers unparalleled value and benefits to customers. Experience high performance, low power consumption, and reliable operation in a compact package. Whether you're working on IoT devices, consumer electronics, or industrial automation, the MSP430F2330IRHAR is the perfect choice for bringing your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options for different applications.

On Chip Data RAM Width: 8

Having a wide data RAM width allows for more efficient data processing and storage on the microcontroller.

Package Shape: SQUARE

The square package shape enables easier integration into circuit designs and PCB layouts.

Bit Size: 16

A 16-bit architecture allows for higher processing capabilities and better performance compared to lower bit sizes.

Power Supplies (V): 2/3.3

Having multiple power supply options gives flexibility in voltage selection for different applications.

No. of Terminals: 40

Having a higher number of terminals allows for more connectivity options and functionality in the microcontroller.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety in package styles provides options for different thermal and space requirements in the application.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability and performance in various environmental conditions.

Technical Specifications

Microcontrollers MSP430F2330IRHAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

40

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SCI(2), SPI(2), UART"

Peripherals:

"BOD, COMPARATOR, TIMER(2), WDT"

Trade Compliance

MSP430F2330IRHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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