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MSP430F2272TDAR

Texas Instruments

MSP430F2272TDAR by Texas Instruments

MSP430F2272TDAR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 33024 ROM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, LIN, SPI, UART interfaces.

Median Price

$4.497

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,950 parts In-Stock

1+ parts

$4.497

100+ parts

$3.666

1k+ parts

$2.444

10k+ parts

-

3,950

$4.497

$3.666

$2.444

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,405 parts In-Stock

1+ parts

$4.272

100+ parts

-

1k+ parts

-

10k+ parts

-

2,405

$4.272

-

-

-

Vyrian

USA . 6,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,518

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,874 parts In-Stock

1+ parts

$4.047

100+ parts

-

1k+ parts

-

10k+ parts

-

2,874

$4.047

-

-

-

AZTECH Wire

Italy . 535 parts In-Stock

1+ parts

$20.980

100+ parts

-

1k+ parts

-

10k+ parts

-

535

$20.980

-

-

-

Microchip USA

USA . 2,399 parts In-Stock

1+ parts

$21.340

100+ parts

$21.210

1k+ parts

$21.140

10k+ parts

$21.080

2,399

$21.340

$21.210

$21.140

$21.080

Parana Technologies

USA . 827 parts In-Stock

1+ parts

$30.358

100+ parts

$2,819.192

1k+ parts

$27.322

10k+ parts

-

827

$30.358

$2,819.192

$27.322

-

DigiPath Technology Company

USA . 1,539 parts In-Stock

1+ parts

$33.428

100+ parts

$30.754

1k+ parts

-

10k+ parts

-

1,539

$33.428

$30.754

-

-

ChromeModa Solutions

Germany . 6,133 parts In-Stock

1+ parts

$34.110

100+ parts

$27.970

1k+ parts

-

10k+ parts

-

6,133

$34.110

$27.970

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-

IDEA Electronic Components Group

UK . 78 parts In-Stock

1+ parts

$34.110

100+ parts

$32.404

1k+ parts

$30.699

10k+ parts

-

78

$34.110

$32.404

$30.699

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Lixinc

USA . 12,364 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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12,364

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2272TDAR microcontroller. Built with precision and expertise, this device offers unparalleled quality and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller provides exceptional performance, low power consumption, and versatile connectivity options. Experience the seamless integration of advanced features and cutting-edge technology, making your projects more efficient and cost-effective. Elevate your designs with the MSP430F2272TDAR and unleash endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the microcontroller suitable for portable and rugged applications.

Surface Mount: YES

Surface mount design enables easy and efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages for versatile application compatibility.

No. of I/O Lines: 32

The high number of I/O lines allows for flexibility in connecting various external devices and peripherals.

ADC Channels: YES

Integrated Analog-to-Digital Converters provide the ability to interface with analog sensors and signals.

Connectivity: I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Multiple connectivity options enable seamless communication with a wide range of devices and protocols.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient code execution and high performance for various applications.

ROM Programmability: FLASH

Flash programmable memory allows for easy and convenient firmware updates and modifications.

Technical Specifications

Microcontrollers MSP430F2272TDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

33024

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), TIMER(6), WDT"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2272TDAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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