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MSP430F2254TDA

Texas Instruments

MSP430F2254TDA by Texas Instruments

MSP430F2254TDA by Texas Instruments is a 16-bit microcontroller with 16384 ROM words and 512 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. Features include 12-Ch 10-Bit ADC channels, PWM support, and connectivity options like I2C, SPI, UART.

Median Price

$4.644

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,790 parts In-Stock

1+ parts

$5.207

100+ parts

$4.245

1k+ parts

$2.830

10k+ parts

-

3,790

$5.207

$4.245

$2.830

-

Rochester

USA . 15 parts In-Stock

1+ parts

-

100+ parts

$4.080

1k+ parts

$3.650

10k+ parts

$3.430

15

-

$4.080

$3.650

$3.430

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,812 parts In-Stock

1+ parts

$3.734

100+ parts

-

1k+ parts

-

10k+ parts

-

3,812

$3.734

-

-

-

Vyrian

USA . 2,747 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,747

-

-

-

-

Component Sense

UK . 1,114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,114

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,397 parts In-Stock

1+ parts

$3.537

100+ parts

-

1k+ parts

-

10k+ parts

-

1,397

$3.537

-

-

-

AZTECH Wire

Italy . 771 parts In-Stock

1+ parts

$10.650

100+ parts

-

1k+ parts

-

10k+ parts

-

771

$10.650

-

-

-

Microchip USA

USA . 2,859 parts In-Stock

1+ parts

$14.250

100+ parts

$14.040

1k+ parts

$13.940

10k+ parts

$13.840

2,859

$14.250

$14.040

$13.940

$13.840

Parana Technologies

USA . 501 parts In-Stock

1+ parts

$63.922

100+ parts

-

1k+ parts

-

10k+ parts

-

501

$63.922

-

-

-

DigiPath Technology Company

USA . 239 parts In-Stock

1+ parts

$70.387

100+ parts

$64.756

1k+ parts

-

10k+ parts

-

239

$70.387

$64.756

-

-

ChromeModa Solutions

Germany . 5,082 parts In-Stock

1+ parts

$71.823

100+ parts

$58.895

1k+ parts

-

10k+ parts

-

5,082

$71.823

$58.895

-

-

IDEA Electronic Components Group

UK . 117 parts In-Stock

1+ parts

$71.823

100+ parts

$68.232

1k+ parts

$64.641

10k+ parts

-

117

$71.823

$68.232

$64.641

-

Perfect Parts

USA . 134 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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134

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Overview

Experience the power of Texas Instruments with the MSP430F2254TDA microcontroller - a cutting-edge solution for your electronic needs. This compact and versatile device, with its high-performance features and durable plastic/epoxy construction, offers unparalleled reliability and efficiency. Ideal for a wide range of applications, from IoT devices to industrial automation, this microcontroller delivers exceptional value and performance. Trust Texas Instruments for top-notch quality and innovation, and unlock endless possibilities with the MSP430F2254TDA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the microcontroller, ensuring reliable performance in various environments.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can operate efficiently within a typical voltage range, ensuring compatibility with various power sources.

On Chip Data RAM Width: 8

Having an 8-bit data RAM width allows for efficient data processing and storage within the microcontroller, enhancing overall performance.

Package Shape: RECTANGULAR

The rectangular package shape offers easy placement and alignment on the PCB, contributing to a streamlined design and layout.

Bit Size: 16

A 16-bit architecture provides enhanced processing capabilities and efficiency, making this microcontroller suitable for a wide range of applications.

Power Supplies (V): 2/3.3

Supporting power supplies of 2V and 3.3V allows for flexible operation and compatibility with different power sources, increasing versatility.

No. of Terminals: 38

Having 38 terminals provides ample connectivity options for interfacing with external components and peripherals, enabling versatile system integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style ensures space-saving design, ideal for applications where size constraints are a consideration.

Minimum Supply Voltage: 3.3 V

With a minimum supply voltage of 3.3V, this microcontroller can operate efficiently without the risk of undervoltage issues, ensuring reliable performance.

Technical Specifications

Microcontrollers MSP430F2254TDA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), TIMER(6), WDT"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2254TDA Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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