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MSP430F2254IDAR

Texas Instruments

MSP430F2254IDAR by Texas Instruments

MSP430F2254IDAR by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 12-Ch 10-Bit ADC channels, and 6 timers. It operates at a max clock frequency of 16 MHz and features low power mode for energy efficiency. Ideal for industrial applications requiring high-speed processing and multiple peripherals like BOD, comparator, timer, and WDT.

Median Price

$2.831

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,900 parts In-Stock

1+ parts

$2.320

100+ parts

$2.270

1k+ parts

$2.230

10k+ parts

-

9,900

$2.320

$2.270

$2.230

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Texas Instruments

USA . 4,620 parts In-Stock

1+ parts

$4.431

100+ parts

$3.612

1k+ parts

$2.408

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4,620

$4.431

$3.612

$2.408

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Arrow

USA . 6,000 parts In-Stock

1+ parts

-

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$2.831

6,000

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$2.831

Distributors (In-Stock)

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Digiode

USA . 553 parts In-Stock

1+ parts

$4.209

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-

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553

$4.209

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Bristol Electronics

USA . 270 parts In-Stock

1+ parts

$6.272

100+ parts

$2.718

1k+ parts

$2.571

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270

$6.272

$2.718

$2.571

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Sensible Micro Corp

USA . 40,374 parts In-Stock

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40,374

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Chip Stock

USA . 7,500 parts In-Stock

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7,500

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Vyrian

USA . 2,579 parts In-Stock

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2,579

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Microfarads

USA . 261 parts In-Stock

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261

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Distributors (Availability)

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Corphita

USA . 1,476 parts In-Stock

1+ parts

$3.988

100+ parts

-

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1,476

$3.988

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AZTECH Wire

Italy . 93 parts In-Stock

1+ parts

$15.880

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93

$15.880

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Parana Technologies

USA . 1,933 parts In-Stock

1+ parts

$48.622

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1,933

$48.622

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ChromeModa Solutions

Germany . 717 parts In-Stock

1+ parts

$54.631

100+ parts

$44.797

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717

$54.631

$44.797

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IDEA Electronic Components Group

UK . 580 parts In-Stock

1+ parts

$54.631

100+ parts

$51.899

1k+ parts

$49.168

10k+ parts

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580

$54.631

$51.899

$49.168

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GreenTree Electronics

Israel . 84,038 parts In-Stock

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iodParts Technologies Inc.

India . 60,000 parts In-Stock

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S.R.D Solutions

India . 30,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,213 parts In-Stock

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Lixinc

USA . 19,826 parts In-Stock

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19,826

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Metaverse IC Inc.

Canada . 10,000 parts In-Stock

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Perfect Parts

USA . 9,937 parts In-Stock

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9,937

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Futuretech Components

Singapore . 1,000 parts In-Stock

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1,000

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DigiPath Technology Company

USA . 801 parts In-Stock

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$49.255

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801

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$49.255

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Kepictronics

USA . 585 parts In-Stock

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585

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Assy Fe

Spain . 14 parts In-Stock

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Overview

Revolutionize your electronic projects with the Texas Instruments MSP430F2254IDAR microcontroller. Known for its high-quality manufacturing and cutting-edge technology, this microcontroller is perfect for a wide range of applications. From industrial automation to consumer electronics, the MSP430F2254IDAR offers unmatched value, performance, and reliability. With features like low power mode, multiple peripherals, and analog to digital converters, this microcontroller is sure to exceed your expectations. Upgrade your designs today with the MSP430F2254IDAR and experience the difference that Texas Instruments can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and lightweight design for the product.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power supply options.

Bit Size: 16

16-bit processing offers improved performance and processing capabilities.

No. of Terminals: 38

Large number of terminals provide ample connectivity options for peripherals and external devices.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast data processing and execution speeds.

ADC Channels: YES

Analog to Digital Converters allow for precise and accurate data conversion, making the product suitable for sensor-based applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and execution of instructions, enhancing overall performance.

Connectivity: "I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Multiple connectivity options provide versatility in communication protocols, enabling easy integration with different devices and systems.

Low Power Mode: YES

Low power mode helps in conserving energy and prolonging battery life, making the product suitable for power-efficient applications.

Technical Specifications

Microcontrollers MSP430F2254IDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), TIMER(6), WDT"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2254IDAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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