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MSP430F2252TDA

Texas Instruments

MSP430F2252TDA by Texas Instruments

MSP430F2252TDA by Texas Instruments is a 16-bit microcontroller with 16384 ROM words and 512 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, LIN, SPI, UART interfaces.

Median Price

$6.630

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,950 parts In-Stock

1+ parts

$4.479

100+ parts

$3.651

1k+ parts

$2.434

10k+ parts

-

2,950

$4.479

$3.651

$2.434

-

Mouser Electronics

USA . 76 parts In-Stock

1+ parts

$6.630

100+ parts

$4.560

1k+ parts

$3.760

10k+ parts

-

76

$6.630

$4.560

$3.760

-

DigiKey

USA . 29 parts In-Stock

1+ parts

$6.630

100+ parts

$4.554

1k+ parts

$3.875

10k+ parts

$3.769

29

$6.630

$4.554

$3.875

$3.769

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.578

100+ parts

-

1k+ parts

-

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10

$3.578

-

-

-

Digiode

USA . 2,703 parts In-Stock

1+ parts

$4.255

100+ parts

-

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-

10k+ parts

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2,703

$4.255

-

-

-

Vyrian

USA . 7,963 parts In-Stock

1+ parts

-

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7,963

-

-

-

-

Prism Electronics

USA . 136 parts In-Stock

1+ parts

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136

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Elcom Components

USA . 18 parts In-Stock

1+ parts

-

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-

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$3.506

100+ parts

-

1k+ parts

$3.366

10k+ parts

-

100

$3.506

-

$3.366

-

Ampacity Inc.

Singapore . 629 parts In-Stock

1+ parts

$3.810

100+ parts

-

1k+ parts

-

10k+ parts

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629

$3.810

-

-

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Corphita

USA . 4,376 parts In-Stock

1+ parts

$4.031

100+ parts

-

1k+ parts

-

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4,376

$4.031

-

-

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Parana Technologies

USA . 155 parts In-Stock

1+ parts

$70.190

100+ parts

-

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155

$70.190

-

-

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DigiPath Technology Company

USA . 1,010 parts In-Stock

1+ parts

$77.288

100+ parts

-

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10k+ parts

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1,010

$77.288

-

-

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IDEA Electronic Components Group

UK . 1,302 parts In-Stock

1+ parts

$78.865

100+ parts

$74.922

1k+ parts

$70.978

10k+ parts

-

1,302

$78.865

$74.922

$70.978

-

ChromeModa Solutions

Germany . 1,235 parts In-Stock

1+ parts

$78.865

100+ parts

$64.669

1k+ parts

-

10k+ parts

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1,235

$78.865

$64.669

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A-Z Elektronik GmbH

Germany . 5,076 parts In-Stock

1+ parts

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5,076

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Lixinc

USA . 2,721 parts In-Stock

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2,721

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Authorized Procurement Solutions

USA . 20 parts In-Stock

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20

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Overview

Unlock boundless possibilities with the MSP430F2252TDA microcontroller by Texas Instruments. Crafted with precision and expertise, this device offers unparalleled quality and reliability. Ideal for a wide range of applications, from industrial automation to consumer electronics, this microcontroller provides exceptional value, efficiency, and performance. Trust in Texas Instruments' legacy of innovation and choose the MSP430F2252TDA for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring longevity and affordability of the product.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, making it versatile for various applications.

CPU Family: MSP430

Belongs to a reputable and efficient CPU family known for its performance and reliability.

ADC Channels: YES

Integrated Analog to Digital Convertors enable efficient conversion of analog signals for digital processing.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient and fast processing of instructions, making the microcontroller a powerful choice.

Connectivity: I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Support for multiple communication protocols enhances the product's compatibility with various devices and systems.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and quick reprogramming of the microcontroller, enhancing flexibility and adaptability.

Low Power Mode: YES

Capability to operate in a low power mode helps in conserving energy, making it suitable for battery-powered applications.

Technical Specifications

Microcontrollers MSP430F2252TDA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), TIMER(6), WDT"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2252TDA Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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