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MSP430F2252IYFFT

Texas Instruments

MSP430F2252IYFFT by Texas Instruments

MSP430F2252IYFFT by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 512 bytes of RAM, and 16384 ROM words. Operating at up to 16 MHz with a supply voltage range of 2-3.3 V, it's ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,858 parts In-Stock

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Digiode

USA . 4,225 parts In-Stock

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One Stop Electronics

USA . 819 parts In-Stock

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$12.000

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819

$12.000

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AZTECH Wire

Italy . 353 parts In-Stock

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$17.858

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Parana Technologies

USA . 1,492 parts In-Stock

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$58.512

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ChromeModa Solutions

Germany . 6,788 parts In-Stock

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$65.744

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$53.910

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6,788

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IDEA Electronic Components Group

UK . 1,851 parts In-Stock

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$65.744

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$62.457

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$59.170

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1,851

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QUARKTWIN TECHNOLOGY LTD

USA . 9,169 parts In-Stock

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Microchip USA

USA . 7,604 parts In-Stock

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Corphita

USA . 1,948 parts In-Stock

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DigiPath Technology Company

USA . 1,905 parts In-Stock

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$59.275

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Overview

Unlock the power of innovation with the MSP430F2252IYFFT microcontroller by Texas Instruments. Designed to deliver exceptional performance and reliability, this microcontroller is perfect for a wide range of applications. Whether you are working on IoT devices, consumer electronics, or industrial automation, this product offers unmatched value, benefits, and advantages. Trust in Texas Instruments' reputation for quality and experience the difference with the MSP430F2252IYFFT. Elevate your projects to new heights with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protects the microcontroller from external elements, making it suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy installation and integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in powering the microcontroller, making it compatible with different power sources.

Package Shape: SQUARE

The square package shape provides a compact design, ideal for applications where space is limited.

Bit Size: 16

The 16-bit architecture of the microcontroller enables faster processing and increased efficiency in handling data and instructions.

Power Supplies (V): 2/3.3

The multiple power supply options allow for versatile usage in different systems, providing compatibility with various voltage requirements.

No. of Terminals: 49

The high number of terminals enables connectivity with other components, peripherals, and interfaces, enhancing the microcontroller's functionality and capabilities.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows for digital conversion of analog signals, facilitating precise and accurate input readings.

ROM Words: 16384

The large ROM capacity provides ample storage for program instructions and data, accommodating complex algorithms and applications.

CPU Family: MSP430

Belonging to the MSP430 CPU family indicates reliability and performance, as well as compatibility with a range of development tools and software.

Technical Specifications

Microcontrollers MSP430F2252IYFFT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

32

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

MSP430F2252IYFFT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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