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MSP430F2252IYFFR

Texas Instruments

MSP430F2252IYFFR by Texas Instruments

MSP430F2252IYFFR by Texas Instruments is a 16-bit microcontroller with 8KB ROM, 512B RAM, and 12-Ch 10-Bit ADC. Ideal for industrial applications due to its low power mode, operating temperature range of -40 to 85°C, and connectivity options like I2C, SPI, UART.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,955 parts In-Stock

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4,955

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Digiode

USA . 2,643 parts In-Stock

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2,643

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Distributors (Availability)

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One Stop Electronics

USA . 1,523 parts In-Stock

1+ parts

$7.000

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-

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1,523

$7.000

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AZTECH Wire

Italy . 438 parts In-Stock

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$9.357

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438

$9.357

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Microchip USA

USA . 4,346 parts In-Stock

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$19.747

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4,346

$19.747

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Parana Technologies

USA . 2,138 parts In-Stock

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$41.933

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2,138

$41.933

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DigiPath Technology Company

USA . 1,995 parts In-Stock

1+ parts

$46.174

100+ parts

$42.480

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1,995

$46.174

$42.480

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ChromeModa Solutions

Germany . 5,452 parts In-Stock

1+ parts

$47.116

100+ parts

$38.635

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5,452

$47.116

$38.635

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IDEA Electronic Components Group

UK . 1,207 parts In-Stock

1+ parts

$47.116

100+ parts

$44.760

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$42.404

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1,207

$47.116

$44.760

$42.404

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Perfect Parts

USA . 1,015 parts In-Stock

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Corphita

USA . 500 parts In-Stock

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500

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Overview

Discover the Texas Instruments MSP430F2252IYFFR, a top-quality microcontroller designed to meet your needs. With a reputation for excellence in the industry, Texas Instruments delivers reliable and efficient products like this one. This microcontroller offers a wide range of applications and benefits, providing value and performance to customers. Whether you're looking for low power consumption, high clock frequency, or multiple peripherals, the MSP430F2252IYFFR has you covered. Trust in Texas Instruments to deliver cutting-edge technology for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Makes it easy to mount the microcontroller on a PCB, saving space and making the overall design more compact.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, giving flexibility in power supply options.

On Chip Data RAM Width: 8

Provides a decent amount of on-chip RAM for data storage and processing.

Package Shape: SQUARE

Square shape allows for easier PCB layout and integration into the system design.

Bit Size: 16

16-bit architecture allows for handling larger data sizes and more complex calculations.

Power Supplies (V): 2/3.3

Supports multiple power supply options, making it versatile for different applications.

No. of Terminals: 49

Sufficient number of terminals for connecting external devices and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style offers high density and fine pitch for efficient PCB layout.

Minimum Supply Voltage: 3.3 V

Low minimum supply voltage helps in reducing power consumption and extending battery life.

Technical Specifications

Microcontrollers MSP430F2252IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e1

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

49

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), TIMER(6), WDT"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2252IYFFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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