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MSP430F2234TRHAT

Texas Instruments

MSP430F2234TRHAT by Texas Instruments

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$3.249

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,250 parts In-Stock

1+ parts

$3.378

100+ parts

$2.754

1k+ parts

$1.836

10k+ parts

-

6,250

$3.378

$2.754

$1.836

-

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.120

10k+ parts

-

250

-

-

$3.120

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,950 parts In-Stock

1+ parts

$3.209

100+ parts

-

1k+ parts

-

10k+ parts

-

1,950

$3.209

-

-

-

Vyrian

USA . 4,911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,911

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,170 parts In-Stock

1+ parts

$3.040

100+ parts

-

1k+ parts

-

10k+ parts

-

2,170

$3.040

-

-

-

Microchip USA

USA . 1,984 parts In-Stock

1+ parts

$22.300

100+ parts

$22.160

1k+ parts

$22.090

10k+ parts

$22.020

1,984

$22.300

$22.160

$22.090

$22.020

Parana Technologies

USA . 192 parts In-Stock

1+ parts

$44.588

100+ parts

-

1k+ parts

-

10k+ parts

-

192

$44.588

-

-

-

DigiPath Technology Company

USA . 1,049 parts In-Stock

1+ parts

$49.097

100+ parts

$45.169

1k+ parts

-

10k+ parts

-

1,049

$49.097

$45.169

-

-

IDEA Electronic Components Group

UK . 1,010 parts In-Stock

1+ parts

$50.099

100+ parts

$47.594

1k+ parts

$45.089

10k+ parts

-

1,010

$50.099

$47.594

$45.089

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ChromeModa Solutions

Germany . 241 parts In-Stock

1+ parts

$50.099

100+ parts

$41.081

1k+ parts

-

10k+ parts

-

241

$50.099

$41.081

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-

Perfect Parts

USA . 757 parts In-Stock

1+ parts

-

100+ parts

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757

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Technical Specifications

Microcontrollers MSP430F2234TRHAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

40

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), TIMER(6), WDT"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2234TRHAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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