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MSP430F2234TDAR

Texas Instruments

MSP430F2234TDAR by Texas Instruments

MSP430F2234TDAR by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 12-Ch 10-Bit ADC channels, and 6 timers. It operates at a max clock frequency of 16 MHz and has low power mode for energy efficiency. Ideal for industrial applications requiring high-speed processing and multiple peripherals like UART, SPI, and I2C.

Median Price

$3.378

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 21,174 parts In-Stock

1+ parts

$3.378

100+ parts

$2.754

1k+ parts

$1.836

10k+ parts

-

21,174

$3.378

$2.754

$1.836

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,665 parts In-Stock

1+ parts

$3.209

100+ parts

-

1k+ parts

-

10k+ parts

-

2,665

$3.209

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-

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Vyrian

USA . 7,430 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,430

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,731 parts In-Stock

1+ parts

$3.040

100+ parts

-

1k+ parts

-

10k+ parts

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2,731

$3.040

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AZTECH Wire

Italy . 455 parts In-Stock

1+ parts

$22.040

100+ parts

-

1k+ parts

-

10k+ parts

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455

$22.040

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Parana Technologies

USA . 588 parts In-Stock

1+ parts

$76.226

100+ parts

-

1k+ parts

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588

$76.226

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-

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ChromeModa Solutions

Germany . 6,534 parts In-Stock

1+ parts

$85.647

100+ parts

$70.231

1k+ parts

-

10k+ parts

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6,534

$85.647

$70.231

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IDEA Electronic Components Group

UK . 860 parts In-Stock

1+ parts

$85.647

100+ parts

$81.365

1k+ parts

$77.082

10k+ parts

-

860

$85.647

$81.365

$77.082

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GreenTree Electronics

Israel . 70,000 parts In-Stock

1+ parts

-

100+ parts

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70,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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DigiPath Technology Company

USA . 2,224 parts In-Stock

1+ parts

-

100+ parts

$77.219

1k+ parts

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2,224

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$77.219

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F2234TDAR microcontroller. Crafted with precision and expertise, this versatile device offers unparalleled performance in a compact package. Ideal for a wide range of applications, this microcontroller provides seamless connectivity and low power consumption, ensuring efficiency and reliability. Experience the next level of innovation with the MSP430F2234TDAR, where quality meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product reliable for long-term use.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6V allows for flexibility in power requirements.

On Chip Data RAM Width: 8

Having a wider data RAM width of 8 allows for faster data processing and storage capabilities.

Bit Size: 16

The 16-bit size provides higher data processing capabilities compared to smaller bit sizes.

Power Supplies (V): 2/3.3

Supporting multiple power supply options at 2V and 3.3V provides flexibility in powering the device.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the product can withstand harsh environments.

No. of Terminals: 38

Having 38 terminals allows for connectivity to various external components, expanding the product's functionality.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product can operate in cold conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller enables efficient data processing and power consumption, making it a suitable choice for resource-constrained applications.

No. of Timers: 6

Having 6 timers provides precise timing control for various functions, enhancing the product's versatility.

Technical Specifications

Microcontrollers MSP430F2234TDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), TIMER(6), WDT"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2234TDAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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