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MSP430F2234IYFFR

Texas Instruments

MSP430F2234IYFFR by Texas Instruments

MSP430F2234IYFFR by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 512 bytes of RAM, and 8192 ROM words. Operating at a max clock frequency of 16 MHz, it is suitable for industrial applications requiring low power consumption and high-speed processing. With a temperature range from -40 to 85°C, this CMOS technology-based microcontroller offers PWM channels and ADC functionality for versatile system integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,885 parts In-Stock

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Digiode

USA . 381 parts In-Stock

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381

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Distributors (Availability)

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AZTECH Wire

Italy . 207 parts In-Stock

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$6.744

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207

$6.744

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One Stop Electronics

USA . 1,501 parts In-Stock

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$26.000

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$26.000

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Parana Technologies

USA . 2,132 parts In-Stock

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$29.293

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$57.709

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$29.293

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DigiPath Technology Company

USA . 1,177 parts In-Stock

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$32.255

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1,177

$32.255

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ChromeModa Solutions

Germany . 6,127 parts In-Stock

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$32.913

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$26.989

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6,127

$32.913

$26.989

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IDEA Electronic Components Group

UK . 1,675 parts In-Stock

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$32.913

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$31.267

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$29.622

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1,675

$32.913

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$29.622

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Microchip USA

USA . 438 parts In-Stock

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Corphita

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Overview

Unlock the power of innovation with the MSP430F2234IYFFR by Texas Instruments. Designed with precision and quality in mind, this microcontroller offers unmatched performance for a variety of applications. Whether you're working on IoT devices, consumer electronics, or industrial automation, the MSP430F2234IYFFR delivers reliability and efficiency like no other. With a powerful CPU, advanced technology, and a wide range of features, this microcontroller is the perfect choice for those who demand the best. Experience the difference with Texas Instruments and revolutionize your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microcontroller, making it suitable for a variety of environments and applications.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage input, increasing the versatility and compatibility of the microcontroller.

Bit Size: 16

A 16-bit microcontroller offers higher computational power and precision compared to lower bit sizes, making it suitable for advanced applications.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital data, enabling sensor interfacing and data acquisition.

RAM Bytes: 512

With 512 bytes of RAM, the microcontroller can efficiently handle and store data during operation, enhancing performance and processing capabilities.

Maximum Clock Frequency: 16 MHz

A high clock frequency of 16 MHz allows for faster processing and execution of instructions, improving overall system speed and responsiveness.

ROM Programmability: FLASH

Being programmable with FLASH ROM allows for easy and fast updates to the microcontroller's firmware, enabling flexibility and adaptability in various applications.

Technical Specifications

Microcontrollers MSP430F2234IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

32

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

MSP430F2234IYFFR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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