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MSP430F2232IYFFR

Texas Instruments

MSP430F2232IYFFR by Texas Instruments

MSP430F2232IYFFR by Texas Instruments is a 16-bit microcontroller with 512B RAM, 8192 ROM words, and 32 I/O lines. Operating at up to 16MHz with a supply voltage range of 2-3.3V, it's ideal for industrial applications requiring low power consumption and high clock frequency. The package style is grid array with very thin profile and fine pitch terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,435 parts In-Stock

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Digiode

USA . 2,030 parts In-Stock

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AZTECH Wire

Italy . 370 parts In-Stock

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$11.405

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370

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One Stop Electronics

USA . 387 parts In-Stock

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$34.000

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Parana Technologies

USA . 1,750 parts In-Stock

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$51.310

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DigiPath Technology Company

USA . 501 parts In-Stock

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$56.499

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$51.979

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$56.499

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ChromeModa Solutions

Germany . 6,414 parts In-Stock

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$57.652

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$47.275

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IDEA Electronic Components Group

UK . 1,670 parts In-Stock

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$57.652

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$54.769

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$51.887

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$57.652

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Corphita

USA . 3,319 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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Microchip USA

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Overview

Discover the Texas Instruments MSP430F2232IYFFR microcontroller, a top-quality product designed to elevate your projects to new heights. With a trusted manufacturer like Texas Instruments behind it, this device offers unparalleled reliability and performance. Ideal for a wide range of applications in various industries, this microcontroller delivers exceptional value, efficiency, and versatility. Experience seamless integration, advanced features, and cutting-edge technology with the MSP430F2232IYFFR - the perfect choice for your next innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material helps in making the microcontroller lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount packaging allows for easy and efficient mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6 V, providing flexibility and compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shape helps in optimizing layout and space utilization on the PCB, allowing for efficient design and integration.

Bit Size: 16

16-bit processing capability enables enhanced performance and efficiency in handling data and executing tasks.

Power Supplies (V): 2/3.3

Supports multiple power supply options (2V and 3.3V), giving flexibility in power management and compatibility with different systems.

No. of Terminals: 49

With 49 terminals, this microcontroller provides ample connectivity options for interfacing with external devices and components.

ADC Channels: YES

Integrated ADC channels enable analog-to-digital conversion, allowing the microcontroller to interface with sensors and analog signals.

CPU Family: MSP430

Based on the MSP430 CPU family, known for its low-power consumption and high performance, making this microcontroller suitable for battery-powered applications.

RAM Bytes: 512

512 bytes of RAM provide sufficient memory for data storage and manipulation, ensuring smooth operation of the microcontroller.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various operating conditions.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and convenient firmware updates, enabling flexibility and adaptability in the microcontroller's functionality.

Technical Specifications

Microcontrollers MSP430F2232IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

32

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

MSP430F2232IYFFR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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